AUSTIN, TX, UNITED STATES, September 2, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced a landmark strategic partnership with global science and technology company EMD Electronics and advanced packaging specialist Qualipoly. This collaboration is purpose-built to deliver a comprehensive, expedited service offering for customers in the advanced packaging sector.

At the heart of the partnership is the establishment of a dedicated EMD Electronics application lab within Qualipoly ‘s facilities; a move that significantly strengthens Electroninks’ capacity to provide customers with convenient, high-quality, and responsive technical support. By bringing together the complementary expertise and resources of all three organizations, the alliance creates a fully integrated pipeline from materials science to real-world application.

“This partnership represents a pivotal step in how we serve the advanced packaging community,” stated Melbs LeMieux, co-founder and president at Electroninks. “By uniting the world-class materials capabilities from EMD Electronics with Qualipoly’s packaging expertise and our own additive manufacturing innovations, we’re creating a one-stop ecosystem that dramatically shortens the path from development to full deployment for our customers.”

The co-located EMD Electronics application lab within Qualipoly’s environment enables collaborative, real-time problem-solving and accelerates the qualification and deployment of advanced materials, reducing friction and time-to-market for customers navigating increasingly complex packaging challenges.

Full release: https://www.einpresswire.com/article/938936980/electroninks-emd-electronics-and-qualipoly-forge-strategic-partnership-to-accelerate-advanced-packaging-solutions

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AUSTIN, TX, UNITED STATES, August 24, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced its participation in SEMICON Taiwan 2026, taking place September 2–4 at the Taipei Nangang Exhibition Center (TaiNEX 1 & 2). Electroninks will exhibit at booth #M1248, co-located with manufacturing partner MANZ, where the company will showcase its portfolio of MOD (metal organic decomposition) silver inks for spray coating and inkjet printing applications.

Representing Electroninks at the event will be a full roster of executives who will be on-site throughout the show to meet with customers, partners, and industry stakeholders exploring additive alternatives to traditional metallization.

ATTENDING EXECUTIVES:

* Melbs LeMieux – President & Co-founder
* Takashi Mochizuki – Director of Sales and Business Development
* Brian Liu – APAC Sales Director
* Johnson Ke – Director of Sales & Technical Services
* Kazutaka Ozawa – Global Technical Director
* Kang-Yu Liu- Taiwan Application Development Manager
* Linus Wu – Engineer
* Charlie Chiu – Engineer
* Jet Cheng – Engineer
* Johnny Hsieh – Operations Manager

At the booth, Electroninks will highlight EI-1207, a particle-free, polymer-free silver MOD ink engineered for spray coating (and inkjet) applications in EMI shielding and advanced packaging. The product offering enables non-line-of-sight deposition, cures in air atmosphere and delivers immediate metallization, good sidewall and corner coverage, and higher metal purity with low sheet resistance.

Because spray coating is not limited by line-of-sight physics, it enables uniform sidewall coverage up to 100 percent aspect ratio in package geometries with narrow spacing, compared to roughly 40 percent sidewall coverage for current state-of-the-art metalization. That coverage advantage allows manufacturers to skip the reconstitution step required in traditional workflows, reducing process steps while significantly increasing units per hour and packages per wafer ring.

Electroninks will present reliability and shielding effectiveness data for EI-1207 spray-coated films, which achieve greater than 30 dB of shielding across 1 MHz to 1 GHz at 2 microns of film thickness, and up to 60 dB at 1.2 microns or 80 dB at 3 microns across the 1 to 40 GHz range. The films maintain stable adhesion and electrical resistance through reliability testing and have passed customer qualification.

Electroninks’ broader MOD ink platform spans the EI-12xx and EI-14xx series for spray coating and the EI-7xx and EI-11xx series for inkjet printing, giving manufacturers a range of process temperatures, resistivity, and adhesion profiles to match specific packaging and interconnect requirements.

“Our metalization products for EMI shielding have been in qualification and reliability testing for the past couple of years. Now qualified from a reliability and performance standpoint, customers are looking to adopt for not only cost and UPH benefits, but also the functional advantages,” said Melbs LeMieux, co-founder and president of Electroninks. “Spray-coated MOD silver gives manufacturers sidewall coverage sputtering simply cannot reach, with significant ESG benefits. At SEMICON Taiwan, we’re looking forward to showing the industry what that means in practice, not just in the data.”

Attendees are invited to visit Electroninks at booth #M1248 to see live demonstrations of the spray coating process and to discuss how MOD ink technology can be integrated into existing manufacturing lines.

For more information on Electroninks products and solutions, please visit www.electroninks.com.

Full release: https://www.einpresswire.com/article/936067740/electroninks-to-showcase-spray-coated-mod-silver-ink-for-emi-shielding-at-semicon-taiwan-2026

The post Electroninks to Showcase Spray-Coated MOD Silver Ink for EMI Shielding at SEMICON Taiwan 2026 appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, August 17, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced that its Austin headquarters has earned ISO 9001:2015 certification, the internationally recognized standard for quality management systems. The certification was awarded following an independent audit conducted by a top, global auditing firm confirming that Electroninks’ headquarters meets the same rigorous global benchmarks for consistency, traceability, and continual improvement long upheld at the company’s manufacturing facilities.

ISO 9001:2015 is the world’s most widely adopted quality management standard, used by organizations in more than 170 countries to demonstrate their ability to consistently deliver products and services that meet customer and regulatory requirements. Certification requires an organization to document and implement a quality management system, undergo rigorous third-party auditing, and commit to ongoing process improvement. For Electroninks, the newly certified scope covers manufacture of metal-complex conductive inks for printed applications and delivery of printed samples based on customer specifications at its Austin, TX facility. This is a separate certification from those already held at the company’s manufacturing sites worldwide, together giving customers a fully certified quality system spanning every stage of the business.

This milestone arrives as Electroninks continues to scale commercialization of its particle-free silver, gold, platinum, nickel, and copper inks, which have become critical materials for commercial and defense supply chains, including customers in semiconductor packaging, aerospace, medical devices, and the U.S. Department of Defense. With certification now in place across both manufacturing and headquarters operations, those customers gain independent, audited assurance that the same quality standards run through every part of the organization they rely on.

“Quality has never been an afterthought at Electroninks. It is the foundation our customers build on when they qualify our materials into mission-critical applications,” said Melbs LeMieux, co-founder and president of Electroninks. “Our manufacturing sites have carried ISO 9001 certification for years. Extending that same standard to our headquarters closes the loop on quality across the entire organization and gives our partners in semiconductor, defense, and advanced manufacturing further confidence in the discipline behind our materials.”

The certification reflects a company-wide effort to document processes, strengthen traceability, and embed continual improvement into daily operations, from raw material sourcing through formulation, production, and quality control.

“Earning ISO 9001:2015 certification for our headquarters required us to examine every step of how we develop, produce, and deliver our materials, and to prove that our Quality Management System holds up under independent review,” said Robert Gilhuly, manager, global quality & regulatory compliance at Electroninks. “It took a cross-functional effort across our R&D, manufacturing, and operations teams. The result is a framework that now runs consistently from our manufacturing sites through headquarters, and one that drives measurable improvement as we continue to grow.”

With ISO 9001:2015 certification now in place across both its global manufacturing sites and its Austin headquarters, Electroninks strengthens its position as a trusted supplier to the world’s most demanding industries and reinforces its commitment to delivering high-performance, reliable, and scalable conductive materials.

“Electroninks’ ongoing commitment to quality is now formally recognized with ISO 9001:2015 certification at our headquarters, achieved thanks to the collective effort of every team member,” said Serah Thomas, senior QA specialist at Electroninks. “This milestone builds on the quality discipline already certified across our manufacturing sites and extends that same rigor to how we operate at headquarters.”

Full Release: https://www.einpresswire.com/article/934648063/electroninks-austin-hq-earns-iso-9001-certification-joining-its-already-certified-global-manufacturing-sites

The post Electroninks’ Austin HQ Earns ISO 9001 Certification, Joining Its Already-Certified Global Manufacturing Sites appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, July 27, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced an expanded strategic collaboration with SIIX Corporation to advance additive high-frequency electromagnetic interference (EMI) shielding solutions across a range of electronics applications in Japan and global markets. As part of the expanded collaboration, SIIX has introduced spray coating equipment and prepared a specialized ultrasonic spray coating environment, enabling it to support prototype coating trials for a variety of products.

The collaboration combines Electroninks’ advanced metal-organic decomposition (MOD) conductive ink platform and spray coating process knowledge with SIIX’s large-scale Electronics Manufacturing Services (EMS) infrastructure and global manufacturing presence. Together, the companies aim to help customers establish and evaluate additive EMI shielding approaches for a broad range of electronics, with automotive being one of several potential target applications.

Under the expanded relationship, SIIX serves as a distribution and collaboration partner for Electroninks’ EMI shielding materials and processes within Japan. SIIX has introduced spray coating equipment and established a specialized ultrasonic spray coating environment, and the partners are now ready to work with customers to establish suitable printing and coating processes together, beginning with prototype coating trials rather than immediate volume production.

“As electronics across automotive and many other industries become denser and operate at higher frequencies, EMI shielding is evolving from a component-level consideration into a system-level engineering challenge,” said Takashi Mochizuki, director of sales and business development at Electroninks. “This collaboration brings together advanced conductive materials, a specialized ultrasonic spray coating environment, and global manufacturing expertise so we can work directly with customers to establish coating processes suited to their products, from automotive electronics to a broad range of other applications.”

Electroninks’ additive EMI shielding platform enables conductive coatings to be deposited directly onto complex geometries using precision spray coating processes, creating lightweight alternatives to traditional metal shielding enclosures such as those used in ECUs, Power Control Units (PCUs), and a wide range of other electronic assemblies.

The collaboration is designed to support growing market demand for conformal EMI shielding approaches capable of reducing weight, simplifying integration, and enabling greater design flexibility across next-generation electronics platforms in automotive and many other industries.

As part of the collaboration, Electroninks provides materials and process knowledge and works alongside SIIX and its customers on the collaborative establishment of coating processes suited to each product and material set. Rather than offering a fixed, pre-optimized process, the partners engage with customers to jointly define the printing and coating approach, starting with prototype coating trials in SIIX’s specialized ultrasonic spray coating environment. Process parameters for specific MOD products and customer materials, including commonly used automotive plastics such as PBT, are established together as part of each engagement rather than assumed to be complete in advance.

The companies have also established a collaborative framework intended to make it easier to bring newly developed Electroninks materials into coating trials over time. As additional conductive materials are introduced, the partners can build on what they learn together to explore process parameters, material configurations, and equipment settings for each new evaluation.

Supporting the initiative, Electroninks has continued to strengthen its own internal capabilities through the installation of advanced spray and printing systems for its metal complex conductive inks, improving process consistency and supporting future scale-up.

“Additive manufacturing is enabling entirely new approaches to electronics integration,” added Melbs LeMieux, co-founder and president at Electroninks. “By combining advanced materials with scalable EMS manufacturing, SIIX, a longtime partner of EI, is now taking the strong initiative to advance their EMS business and offer their customers advancements in functionality and production times. We are proud to support SIIX, and the overall market in Japan as they look to adopt the MOD technology in their electronics manufacturing supply chains.

The companies expect the collaboration to expand over time into additional applications, manufacturing regions, and advanced conductive material workflows supporting broader electronics and semiconductor packaging markets.

Full Release: https://www.einpresswire.com/article/929089911/electroninks-and-siix-expand-collaboration-to-advance-additive-emi-shielding

The post Electroninks and SIIX Expand Collaboration to Advance Additive EMI Shielding appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, July 22, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced it has been selected by AFWERX for a SBIR contract in the amount of $1,249,907 focused on advancing on-demand printed circuit board (PCB) manufacturing for rapid prototyping and mission-critical electronics sustainment applications to address the most pressing challenges in the Department of the Air Force (DAF). The DAF began offering the Open Topic SBIR/STTR program in 2018, which expanded the range of innovations the DAF funded, and now Electroninks has started its journey to create and provide innovative capabilities that will strengthen the national defense of the United States of America.

“Military operations and sustainment environments cannot always afford to wait for traditional electronics supply chains, particularly when dealing with obsolete components or urgent mission requirements,” said Melbs LeMieux, co-founder and president of Electroninks. “With CircuitJet, we are working to bring manufacturing directly to the point of need, enabling rapid production of PCBs and electronic components where and when they are required. This program represents an important opportunity to further advance on-demand electronics manufacturing capabilities that can strengthen operational readiness and improve resilience across defense applications.”

The views expressed are those of the author and do not necessarily reflect the official policy or position of the Department of the Air Force, the Department of Defense, or the U.S. government.

About Electroninks
Electroninks Incorporated is a world-leader in the commercialization of advanced materials for electronics and semiconductor packaging. We have developed a full suite of proprietary metal complex conductive ink solutions and complementary material sets, thus accelerating time to market for both new innovations and drop-in manufacturing breakthroughs.

Electroninks’ metal complex inks – including silver, gold, platinum, nickel and copper – deliver higher conductivity, manufacturing flexibility, and cost-effectiveness. The company’s conductive inks provide reliable solutions for applications in printed circuit board (PCB) manufacturing, semiconductor packaging, consumer electronics, wearables, medical devices and more. We also partner closely with best-in-class equipment and integration partners to provide customers with a total ink and process solution with the ultimate goal of reducing the manufacturing costs and complexity.

Full Release: https://www.einpresswire.com/article/928590667/electroninks-awarded-u-s-air-force-contract-to-advance-on-demand-pcb-manufacturing-for-defense-applications

The post Electroninks Awarded U.S. Air Force Contract to Advance On-Demand PCB Manufacturing for Defense Applications appeared first on Electroninks.

Electroninks makes something that sounds almost too simple to matter: metal in liquid form. Print it, cure it at low heat, and the organic carriers burn off, leaving behind dense, pure metal, no particles, no grey paste, up to 90 percent of bulk conductivity. That metal is what shields a chip package from electromagnetic noise and carries its signal and power to the outside world. Every phone assembled and every module packaged depends on getting that layer right.

This month, the Austin-based company named Baba Fine Chemicals (BFC) as its official India distribution partner, bringing its CircuitShield EMI shielding ink and copper metallization products into the country’s outsourced semiconductor assembly and test (OSAT) market. Electroninks has also joined the India Semiconductor Mission’s IDSPS programme and showed its technology at Gujarat Semiconnect and Productronica India 2026.

None of that is unusual, on paper. Foreign materials companies announce India distribution deals often enough that the news barely registers. What is worth examining is the reasoning behind the timing, and whether it holds up.

The Argument for Now, Not Later

Brett Walker, co-founder and CEO of Electroninks, makes a case rooted less in India’s growth story and more in how materials decisions actually get made. A shielding or metallization material is chosen when a packaging line is designed and qualified. Once production starts, that choice rarely gets revisited, because requalifying a material touches the whole line. The moment to introduce something new is while engineers are still specifying the process flow, not after.

That is where much of India’s OSAT capacity sits today, under active build-out through the India Semiconductor Mission. Plants in Sanand and elsewhere are being tooled now. Whatever gets designed in this year will likely still be running a decade from now. It is a narrow window, and Electroninks’ logic for entering is essentially: better to be at the table while the architecture is still open than to arrive with a better material after the concrete has set.

The greenfield point is real and worth taking seriously rather than treating as a talking point. India skipped landline infrastructure and went straight to mobile. It built UPI rather than layering onto legacy banking rails. A packaging line built from scratch can be laid out around an additive, lower-capital shielding process from day one, rather than shoehorning it into a floor plan designed for an older wet-chemistry approach. An established Taiwanese or American plant with trained teams and depreciating equipment has every rational reason to keep running what already works. That asymmetry is genuinely in India’s favour, whatever technology eventually wins out.

Why BFC, and Why That Choice Matters

The distribution partner is arguably the more consequential decision here than the ink chemistry itself. Electroninks picked Baba Fine Chemicals, a Greater Noida-based specialty chemicals manufacturer that has supplied India’s semiconductor industry since 1997 and has been majority-owned by Acutaas Chemicals since 2023. Walker’s stated criteria (technical credibility on the ground, real supply chain and import infrastructure, financial staying power, and a willingness to stock material customers have not yet asked for) sound like a reasonable checklist for anyone trying to avoid becoming another foreign name that showed up for a press release and left.

That last point, selling ahead of demand, is the harder one to prove out. It requires BFC’s team to walk into an Indian OSAT’s engineering group and make the case for a material nobody has requisitioned yet. Whether that happens at scale is a 2027 story, not a July 2026 one.

The Question That Went Unanswered

To the outlet’s credit, and worth flagging rather than smoothing over, one question in this exchange was declined outright: whether Indian engineers currently have the process knowledge to run MOD ink-based shielding and metallization at scale, and what training plan backs that up. The response on record was that the question itself implies a deficiency and that Indian engineers are capable, followed by a preference not to answer further.

That is a defensible instinct if the goal is not to sound condescending. But workforce readiness for a genuinely new ink chemistry, printed and cured rather than deposited by more familiar methods, is a fair operational question, and dodging it leaves a gap in an otherwise candid set of answers. A grounded reading is that Electroninks has not yet published a concrete training and support plan for India, which is a reasonable thing to still be building, but is different from having answered the question.

What Success Actually Looks Like

Walker’s own bar for judging this a year out is specific enough to hold him to: material qualified into a meaningful number of production processes in India, with at least one customer willing to say so publicly. That is a sensible metric. In materials, a single qualified line carries more weight than any number of trade-show conversations, because qualification is the expensive, months-long step that proves the chemistry survives contact with a real process engineer’s tolerances.

The near-term demand, by Walker’s account, is largely global OEMs building Indian capacity for products sold worldwide, with India’s own consumer electronics and automotive demand as the larger long-term opportunity. The stated investment sequence, distribution first, local inventory and applications support next, local production only if volumes justify it, is conservative and probably the right order for a company of Electroninks’ size, reported at roughly 40 to 45 people.

A Fair Read

There is a straightforward commercial logic here that does not require taking every line of the announcement at face value to find credible: India is genuinely building packaging capacity from a clean sheet, that is a real window for a new metallization technology, and BFC brings decades of exactly the unglamorous logistics and trust-building work a foreign chemistry company cannot shortcut. The workforce question deserved a fuller answer than it got, and the real test of the “designing in before customers ask” pitch will show up in qualification numbers, not in this interview. On the specific, checkable claim, that Indian packaging lines are being specified now and will run largely unchanged for years, the timing argument holds. What happens next depends on whether BFC can turn early trade-show interest into signed-off production lines, which is precisely the kind of thing worth revisiting in twelve months.

Full release: https://www.theceo.in/industry/technology/why-a-texas-ink-maker-sees-the-value-in-indias-semiconductor-market-before-lines-are-even-built

The post Why a Texas Ink Maker Sees the Value In India’s Semiconductor Market Before Lines Are Even Built appeared first on Electroninks.

by Rohan Mathawan

India’s semiconductor ambitions have attracted chip designers, fab investors, and packaging specialists from across the globe. But the quieter story, the one that actually determines whether a packaging line works well, is about materials. The inks, coatings, and metallization compounds that sit between a chip and the board it lives on are as consequential as the silicon itself, yet they rarely get the headline treatment.

That is starting to change.

Electroninks, the Austin, Texas-based company that has built its reputation on metal organic decomposition (MOD) ink technology, announced on July 13 that it has named Baba Fine Chemicals (BFC) as its official India distribution partner. The deal brings Electroninks’ full conductive ink portfolio into the Indian market, including its CircuitShield EMI shielding product and copper metallization solutions, targeting the country’s fast-growing outsourced semiconductor assembly and test (OSAT) and electronics manufacturing services (EMS) sectors.

Why India, and Why Now

The timing is not accidental. India’s semiconductor packaging industry is in a genuinely unusual position: much of it does not exist yet. Unlike mature markets in Taiwan, South Korea, or Japan, where established players must retrofit new materials into decades-old processes, India’s greenfield OSAT and EMS lines are being designed from scratch. That creates a window for advanced materials companies to get their technology specified into facilities before the first production run, a far easier path than displacing an entrenched supplier later.

Rakesh Gupta, founder and partner at Baba Fine Chemicals, put it plainly: the goal is to get world-class materials into Indian manufacturers’ hands before they need them, not after. The logic is straightforward. If a packaging line is built from the ground up with Electroninks’ MOD ink-based shielding and metallization baked in from the start, the customer never has to face the painful and expensive process of re-qualifying a new material mid-production.

Melbs LeMieux, co-founder and president of Electroninks, framed the urgency from his side. India’s market is growing rapidly across multiple product platforms driven by global OEMs, and getting in early with a trusted local partner matters enormously in a supply chain as complex as semiconductors.

What MOD Ink Technology Actually Does

Electroninks’ core technology is built around metal complex inks, a class of conductive materials that decompose at relatively low temperatures to leave behind high-purity metal traces. The approach offers advantages over traditional silver paste or solder-based solutions in terms of resolution, adhesion, and compatibility with advanced packaging architectures.

CircuitShield, the company’s EMI shielding product, addresses one of the more pressing challenges in modern semiconductor packaging: as chips get smaller and more powerful, managing electromagnetic interference becomes harder. Effective shielding needs to be applied with precision, and MOD ink-based approaches allow for conformal, additive deposition that traditional methods struggle to match.

The copper metallization portfolio extends that capability to interconnect applications, an area where the industry is paying close attention as it moves beyond traditional wire bonding toward more advanced packaging formats.

The IDSPS Angle Is the Strategic Play

Equally significant is BFC’s entry into the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative that brings together government bodies, academic institutions, and global industry players to accelerate India’s semiconductor R&D, workforce development, and supply chain maturity.

For Electroninks, participation in IDSPS is not just a relationship-building exercise. It is a direct channel into the institutions and decision-makers who will shape India’s semiconductor infrastructure over the next decade. Research institutes affiliated with the program influence procurement decisions, technology roadmaps, and the training pipelines that produce the engineers who will eventually specify materials for production lines.

It is a long game, but it is the right one.

Market Validation Has Already Begun

The companies have not waited for the formal announcement to start generating interest. Electroninks and BFC showcased the technology at the IDSPS program kickoff, Gujarat Semiconnect, and Productronica India 2026. The companies report strong early interest from major Indian packaging customers following these appearances. Given how early-stage most of India’s OSAT ecosystem still is, the pipeline for adoption could develop quickly as those customers move from planning to production.

Gujarat Semiconnect, in particular, has emerged as an important forum for companies targeting India’s semiconductor manufacturing push in the state, which has positioned itself aggressively to attract chip-related investment.

Reading the Bigger Picture

India’s semiconductor packaging market is still in formation, but the trajectory is clear. Global OEMs are actively diversifying their supply chains away from single-country concentration, and India has made the policy commitments, through the India Semiconductor Mission and programs like IDSPS, to position itself as a credible alternative.

For a company like Electroninks, this is a market-entry decision that looks modest today but could prove foundational. The companies that establish material qualifications and supply relationships at the greenfield stage tend to remain incumbents for the lifecycle of those facilities, which in semiconductor manufacturing can span fifteen to twenty years.

BFC brings the local credibility, supply chain navigation experience, and relationships that a foreign materials supplier simply cannot replicate by setting up a local office and hoping for the best. That combination of technical differentiation from Electroninks and local market depth from BFC is a sensible structure for a market where trust and reliability matter as much as performance specs.

India is building its semiconductor industry in real time. The companies that show up early, with the right partners and the right materials, are likely to have a significant advantage over those who wait until the market matures.

Electroninks appears to understand that.

Full Article: https://techstory.in/electroninks-is-betting-on-indias-semiconductor-moment-and-it-is-bringing-the-right-materials-to-do-it/

The post Electroninks Is Betting on India’s Semiconductor Moment and It Is Bringing the Right Materials to Do It appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, June 15, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of EI-1169, a new UV-curable silver conductive ink engineered for inkjet deposition across advanced electronics manufacturing applications. Designed for high-reliability conductive printing on epoxy, polyimide, and copper substrates, EI-1169 expands Electroninks’ portfolio of metal-organic decomposition (MOD) conductive inks supporting next-generation additive manufacturing workflows, printed electronics, EMI shielding, and semiconductor packaging applications.

The new formulation combines stable jetting performance on industry-relevant printheads, long shelf life and printhead life, low-temperature curing, and strong adhesion characteristics within a polymer-free conductive ink platform optimized for digitally manufactured electronics. The combination of jettability, reliability and electrical performance sets this product apart on a global level.

“As electronics manufacturers continue moving toward additive and digitally driven production environments, conductive materials have to deliver both processing stability and long-term reliability,” said Brett Walker, chief executive officer at Electroninks. “EI-1169 was developed to support those requirements while enabling broader substrate compatibility and lower-temperature conductive processing.”

EI-1169 is formulated for inkjet deposition environments requiring precise droplet control, repeatable print performance, and robust substrate adhesion. The ink demonstrates strong stability and ink-jettability in several printheads, including DMP Samba printheads, helping support scalable additive manufacturing workflows and consistent production output.

Key product features include:

* Polymer-free MOD silver conductive ink

* UV-curable processing capability

* Lead-free and halogen-free formulation

* Strong adhesion on copper, epoxy, and polyimide substrates

* Stable jetting performance for inkjet deposition

* Long refrigerated shelf stability

The material also supports UV curing at 365 nm or 395 nm wavelengths, providing additional process flexibility for manufacturers working with temperature-sensitive substrates and advanced packaging architectures.

Electroninks developed EI-1169 to support the growing shift toward additive manufacturing across electronics production and semiconductor packaging workflows. As device architectures become more compact and geometrically complex, manufacturers increasingly require conductive materials that combine high-resolution deposition, substrate compatibility, and scalable processing performance.

Electroninks expects EI-1169 to support applications including:

* EMI shielding

* Printed electronics

* Flexible electronics

* Semiconductor packaging

* Advanced interconnects

* Additive manufacturing workflows

The launch of EI-1169 further expands Electroninks’ growing portfolio of conductive materials engineered for next-generation electronics manufacturing.

The company continues developing advanced metal complex conductive ink solutions spanning silver, copper, gold, platinum, and nickel chemistries for applications across semiconductor packaging, printed circuit boards, advanced sensors, aerospace systems, medical devices, and additive electronics manufacturing.

“Additive manufacturing is fundamentally changing how electronics are designed and produced,” added Walker. “Our focus remains on delivering conductive materials that help customers simplify manufacturing workflows while enabling new levels of performance and integration flexibility.”

EI-1169 is available immediately for customer evaluation and integration. For additional product specifications and availability information, visit www.electroninks.com.

Full release: https://www.einpresswire.com/article/919268252/electroninks-launches-uv-curable-silver-conductive-ink-for-advanced-printed-electronics-and-emi-shielding-applications

The post Electroninks Launches UV-Curable Silver Conductive Ink for Advanced Printed Electronics and EMI Shielding Applications appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, June 9, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced it will host a booth and present a session on MOD inks at TechBlick 2026, taking place June 10-11 at the Computer History Museum in Mountain View, California. At the event, Mitchell Smith, will present Silver MOD Inks: Advancing Performance Beyond Particle Pastes at 12:15PM PT on June 10th. Visit us at Booth E07, at TechBlick to connect with our team and discover how Electroninks is transforming the industry.

The presentation will examine how metal organic decomposition (MOD) inks are emerging as a next-generation alternative to conventional silver particle-based conductive pastes used across printed electronics and advanced manufacturing applications.

As manufacturers face increasing pressure to improve performance while managing material costs, silver MOD inks are gaining attention for their ability to achieve high conductivity using less silver content. This advantage becomes particularly important amid ongoing silver price volatility, which continues to impact production economics across the electronics industry.

“Traditional conductive particle pastes have played an important role in printed electronics, but the market is reaching a point where performance, scalability, and cost efficiency must evolve together,” said Mitchell Smith, Engineer, Product Manager at Electroninks. “MOD inks offer a fundamentally different chemical approach that enables denser conductive films, lower curing temperatures, and broader substrate compatibility.”

The session will explore the underlying chemical mechanisms behind silver MOD technology and how these materials differ from traditional particle-filled formulations. Attendees will gain insight into how MOD inks can:

* Form denser conductive films than conventional silver particle pastes

* Achieve high electrical performance with reduced metal loading

* Enable lower-temperature curing processes compatible with plastic substrates

* Support next-generation additive manufacturing and printed electronics applications

The presentation is designed for manufacturers, materials engineers, and product developers currently using conductive particle pastes, as well as organizations evaluating conductive inks for future product integration.

Electroninks continues to expand the use of its proprietary MOD ink platform across advanced packaging, additive electronics, EMI shielding, and printed electronic applications, helping manufacturers improve performance while simplifying manufacturing workflows.

Attendees interested in learning more about Electroninks’ conductive ink technologies are encouraged to attend the session at TechBlick 2026.

Full release: https://www.einpresswire.com/article/918448613/electroninks-to-present-at-techblick-2026-on-the-future-of-silver-mod-inks-for-advanced-electronics

The post Electroninks to Present at TechBlick 2026 on the Future of Silver MOD Inks for Advanced Electronics appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, June 2, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced a significant advancement to its copper metal-organic decomposition (MOD) ink platform: a copper metallization technology capable of curing under ambient conditions, open to air.

Building on the company’s September 2024 commercial launch of Cu-MOD, which demonstrated low resistivity and strong adhesion across a broad range of substrates, this next-generation development directly addresses one of the most consistent requests from the market since that release: the ability to cure copper without an inert atmosphere, especially in large area metallization applications.

Electroninks is currently working with a select group of preferred partners to develop this core technology into real-world use cases, with more complete results and performance data expected in Q3 of 2026.

A Meaningful Shift For Copper Metallization

Copper is one of the most widely used materials in electronics manufacturing, valued for its conductivity, availability, and cost advantages over precious metals. However, a fundamental challenge has long limited its use in additive and ink-based processes: copper oxidizes readily, requiring inert atmosphere curing environments, typically nitrogen or forming gas, to produce dense, conductive films.

Electroninks’ new Cu-MOD technology removes that requirement. The ink cures under ambient, open-air conditions using standard low-temperature thermal processing at approximately 150 deg for 5 to 10 minutes, producing a dense copper film without the need for inert gas infrastructure, vacuum equipment, heat press or lamination systems, or other specialty tooling. The result is a simpler, more accessible copper metallization workflow that is compatible with standard processing environments.

Preliminary results, which focus on polymide, glass, EMC, and build-up film substrates, indicate resistivity performance that is competitive with existing copper metallization approaches, with full performance data to be shared with the broader market in Q3 2026

Broader Implications for the Market

Electroninks believes the implications of ambient-condition copper curing extend well beyond the applications where copper metallization is already established.

“While silver and gold will remain key materials in many applications, for large area and full-film metallization, the rising cost of precious metals has renewed interest across the electronics industry in cost-effective alternatives that do not compromise electrical performance. Electroninks’ ambient-curable Cu-MOD is designed to address that need directly, offering a lower-cost conductive solution that can be processed without the environmental controls traditionally required for copper.” Said Kazutaka Ozawa, Technical Director at Electroninks.

Preferred Partner Engagement

Given the level of market interest anticipated, Electroninks is currently limiting early access to a select group of preferred development partners to ensure focused collaboration and the highest quality of technical outcomes. Organizations interested in learning more about partnership opportunities are encouraged to contact Electroninks directly.

Full performance data, application results, and broader availability details will be announced in Q3 2026.

Full release can be found here: https://www.einpresswire.com/article/916854051/electroninks-introduces-air-curable-copper-complex-conductive-ink-in-marked-advanced-for-additive-metallization

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