AUSTIN, TX, UNITED STATES, June 15, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of EI-1169, a new UV-curable silver conductive ink engineered for inkjet deposition across advanced electronics manufacturing applications. Designed for high-reliability conductive printing on epoxy, polyimide, and copper substrates, EI-1169 expands Electroninks’ portfolio of metal-organic decomposition (MOD) conductive inks supporting next-generation additive manufacturing workflows, printed electronics, EMI shielding, and semiconductor packaging applications.

The new formulation combines stable jetting performance on industry-relevant printheads, long shelf life and printhead life, low-temperature curing, and strong adhesion characteristics within a polymer-free conductive ink platform optimized for digitally manufactured electronics. The combination of jettability, reliability and electrical performance sets this product apart on a global level.

“As electronics manufacturers continue moving toward additive and digitally driven production environments, conductive materials have to deliver both processing stability and long-term reliability,” said Brett Walker, chief executive officer at Electroninks. “EI-1169 was developed to support those requirements while enabling broader substrate compatibility and lower-temperature conductive processing.”

EI-1169 is formulated for inkjet deposition environments requiring precise droplet control, repeatable print performance, and robust substrate adhesion. The ink demonstrates strong stability and ink-jettability in several printheads, including DMP Samba printheads, helping support scalable additive manufacturing workflows and consistent production output.

Key product features include:

* Polymer-free MOD silver conductive ink

* UV-curable processing capability

* Lead-free and halogen-free formulation

* Strong adhesion on copper, epoxy, and polyimide substrates

* Stable jetting performance for inkjet deposition

* Long refrigerated shelf stability

The material also supports UV curing at 365 nm or 395 nm wavelengths, providing additional process flexibility for manufacturers working with temperature-sensitive substrates and advanced packaging architectures.

Electroninks developed EI-1169 to support the growing shift toward additive manufacturing across electronics production and semiconductor packaging workflows. As device architectures become more compact and geometrically complex, manufacturers increasingly require conductive materials that combine high-resolution deposition, substrate compatibility, and scalable processing performance.

Electroninks expects EI-1169 to support applications including:

* EMI shielding

* Printed electronics

* Flexible electronics

* Semiconductor packaging

* Advanced interconnects

* Additive manufacturing workflows

The launch of EI-1169 further expands Electroninks’ growing portfolio of conductive materials engineered for next-generation electronics manufacturing.

The company continues developing advanced metal complex conductive ink solutions spanning silver, copper, gold, platinum, and nickel chemistries for applications across semiconductor packaging, printed circuit boards, advanced sensors, aerospace systems, medical devices, and additive electronics manufacturing.

“Additive manufacturing is fundamentally changing how electronics are designed and produced,” added Walker. “Our focus remains on delivering conductive materials that help customers simplify manufacturing workflows while enabling new levels of performance and integration flexibility.”

EI-1169 is available immediately for customer evaluation and integration. For additional product specifications and availability information, visit www.electroninks.com.

Full release: https://www.einpresswire.com/article/919268252/electroninks-launches-uv-curable-silver-conductive-ink-for-advanced-printed-electronics-and-emi-shielding-applications

The post Electroninks Launches UV-Curable Silver Conductive Ink for Advanced Printed Electronics and EMI Shielding Applications appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, June 9, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced it will host a booth and present a session on MOD inks at TechBlick 2026, taking place June 10-11 at the Computer History Museum in Mountain View, California. At the event, Mitchell Smith, will present Silver MOD Inks: Advancing Performance Beyond Particle Pastes at 12:15PM PT on June 10th. Visit us at Booth E07, at TechBlick to connect with our team and discover how Electroninks is transforming the industry.

The presentation will examine how metal organic decomposition (MOD) inks are emerging as a next-generation alternative to conventional silver particle-based conductive pastes used across printed electronics and advanced manufacturing applications.

As manufacturers face increasing pressure to improve performance while managing material costs, silver MOD inks are gaining attention for their ability to achieve high conductivity using less silver content. This advantage becomes particularly important amid ongoing silver price volatility, which continues to impact production economics across the electronics industry.

“Traditional conductive particle pastes have played an important role in printed electronics, but the market is reaching a point where performance, scalability, and cost efficiency must evolve together,” said Mitchell Smith, Engineer, Product Manager at Electroninks. “MOD inks offer a fundamentally different chemical approach that enables denser conductive films, lower curing temperatures, and broader substrate compatibility.”

The session will explore the underlying chemical mechanisms behind silver MOD technology and how these materials differ from traditional particle-filled formulations. Attendees will gain insight into how MOD inks can:

* Form denser conductive films than conventional silver particle pastes

* Achieve high electrical performance with reduced metal loading

* Enable lower-temperature curing processes compatible with plastic substrates

* Support next-generation additive manufacturing and printed electronics applications

The presentation is designed for manufacturers, materials engineers, and product developers currently using conductive particle pastes, as well as organizations evaluating conductive inks for future product integration.

Electroninks continues to expand the use of its proprietary MOD ink platform across advanced packaging, additive electronics, EMI shielding, and printed electronic applications, helping manufacturers improve performance while simplifying manufacturing workflows.

Attendees interested in learning more about Electroninks’ conductive ink technologies are encouraged to attend the session at TechBlick 2026.

Full release: https://www.einpresswire.com/article/918448613/electroninks-to-present-at-techblick-2026-on-the-future-of-silver-mod-inks-for-advanced-electronics

The post Electroninks to Present at TechBlick 2026 on the Future of Silver MOD Inks for Advanced Electronics appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, June 2, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced a significant advancement to its copper metal-organic decomposition (MOD) ink platform: a copper metallization technology capable of curing under ambient conditions, open to air.

Building on the company’s September 2024 commercial launch of Cu-MOD, which demonstrated low resistivity and strong adhesion across a broad range of substrates, this next-generation development directly addresses one of the most consistent requests from the market since that release: the ability to cure copper without an inert atmosphere, especially in large area metallization applications.

Electroninks is currently working with a select group of preferred partners to develop this core technology into real-world use cases, with more complete results and performance data expected in Q3 of 2026.

A Meaningful Shift For Copper Metallization

Copper is one of the most widely used materials in electronics manufacturing, valued for its conductivity, availability, and cost advantages over precious metals. However, a fundamental challenge has long limited its use in additive and ink-based processes: copper oxidizes readily, requiring inert atmosphere curing environments, typically nitrogen or forming gas, to produce dense, conductive films.

Electroninks’ new Cu-MOD technology removes that requirement. The ink cures under ambient, open-air conditions using standard low-temperature thermal processing at approximately 150 deg for 5 to 10 minutes, producing a dense copper film without the need for inert gas infrastructure, vacuum equipment, heat press or lamination systems, or other specialty tooling. The result is a simpler, more accessible copper metallization workflow that is compatible with standard processing environments.

Preliminary results, which focus on polymide, glass, EMC, and build-up film substrates, indicate resistivity performance that is competitive with existing copper metallization approaches, with full performance data to be shared with the broader market in Q3 2026

Broader Implications for the Market

Electroninks believes the implications of ambient-condition copper curing extend well beyond the applications where copper metallization is already established.

“While silver and gold will remain key materials in many applications, for large area and full-film metallization, the rising cost of precious metals has renewed interest across the electronics industry in cost-effective alternatives that do not compromise electrical performance. Electroninks’ ambient-curable Cu-MOD is designed to address that need directly, offering a lower-cost conductive solution that can be processed without the environmental controls traditionally required for copper.” Said Kazutaka Ozawa, Technical Director at Electroninks.

Preferred Partner Engagement

Given the level of market interest anticipated, Electroninks is currently limiting early access to a select group of preferred development partners to ensure focused collaboration and the highest quality of technical outcomes. Organizations interested in learning more about partnership opportunities are encouraged to contact Electroninks directly.

Full performance data, application results, and broader availability details will be announced in Q3 2026.

Full release can be found here: https://www.einpresswire.com/article/916854051/electroninks-introduces-air-curable-copper-complex-conductive-ink-in-marked-advanced-for-additive-metallization

The post Electroninks Introduces Air-Curable Copper Complex Conductive Ink in Marked Advanced for Additive Metallization appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, May 18, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced the company’s new gold and silver nanoparticle inks from its UTDots portfolio, which will be commercially available through Sigma-Aldrich. The new product family includes six conductive ink formulations with a focus on green solvents and optimized for inkjet and aerosol jet deposition platforms, enabling high-performance additive manufacturing across applications ranging from wearable devices and biosensors to RF systems, EMI shielding, and advanced defense electronics.

The launch includes the following commercially available formulations:

* UTD-Ag-25IJ

* UTD-Ag-40IJ

* UTD-Ag-60PA

* UTD-Au-25IJ

* UTD-Au-40IJ

* UTD-Au-60IJ

As manufacturers increasingly shift toward digital fabrication methods, UT Dots’ nanoparticle inks are designed to provide the conductivity, process stability, and scalability required to move printed electronics beyond prototyping and into broader commercial deployment.

“The printed electronics market is moving rapidly toward higher-performance, digitally manufactured systems that demand both precision and scalability,” said Alex Didenko, engineer at Electroninks, managing the product development of the UTDots portfolio.. “Our new nanoparticle ink portfolio was developed to help engineers and manufacturers bridge that gap with materials capable of supporting everything from flexible consumer devices to highly demanding aerospace and defense applications.”

Engineered for Precision Across Modern Printing Platforms

The new ink portfolio is designed to support a broad range of additive manufacturing workflows and geometries. UT Dots’ inkjet-compatible formulations are optimized for stable and repeatable droplet formation, enabling fine-feature patterning with minimal variability across flexible and rigid substrates alike. The aerosol jet-compatible series extends those capabilities further, supporting conformal deposition on complex three-dimensional surfaces with feature widths below 200 microns.

This flexibility enables manufacturers to print conductive structures on everything from planar flexible circuits to curved integrated systems without sacrificing precision or consistency.

Near-Bulk Conductivity for High-Performance Applications

Following sintering, UT Dots’ silver nanoparticle inks achieve resistivity values between 3–10 microhm-centimeter, approaching the performance characteristics of bulk silver while maintaining compatibility with additive manufacturing processes.

The company’s gold nanoparticle formulations achieve conductivity levels within 2–7x of bulk gold and support photonic curing in the 500–550 nm wavelength range. This capability allows conductive structures to be processed on temperature-sensitive substrates that are incompatible with conventional high-temperature thermal curing methods.

These performance characteristics position the materials for demanding applications requiring high conductivity, low-profile form factors, and advanced integration flexibility.

Accelerating Innovation in Printed Biosensing

UT Dots’ gold nanoparticle formulations are also designed to support emerging biosensing and diagnostic applications. Gold’s inherent biocompatibility, oxidation resistance, and compatibility with thiol-based surface chemistry make the UTD-Au series particularly well suited for applications including:

* Enzymatic glucose sensors

* Immunoassay platforms

* DNA detection arrays

* Lab-on-chip microelectrode systems

By enabling mask-free additive fabrication through inkjet printing, the platform significantly shortens the design-to-prototype cycle compared to traditional lithography-based manufacturing methods. The result is faster iteration, reduced material waste, and improved development flexibility for researchers and medical device developers.

Designed for Commercial Scalability

Beyond laboratory development, UT Dots engineered the new ink platform to support long-term manufacturing scalability. The formulations are produced using standardized synthesis processes and strict quality-control methodologies designed to ensure strong batch-to-batch consistency. This allows manufacturers to maintain predictable electrical and processing performance as products transition from early-stage development into commercial production environments.

“As electronic microdevices continue maturing into broader application spaces, including medical devices and advanced sensors, material consistency and reliability become just as important as conductivity,” stated Melbs LeMieux, cofounder and president of Electroninks, UT Dots’ parent company. “We built this portfolio to support our continuous expansion of advanced materials to address new markets and customers.”

The new conductive ink portfolio is available immediately for customer evaluation and commercial integration. For more information on UT Dots products and solutions, please visit www.utdots.com

Full release: https://www.einpresswire.com/article/913069752/sigma-aldrich-adds-electroninks-ut-dots-advanced-gold-and-silver-nanoparticle-inks-to-product-offering

The post Sigma-Aldrich Adds Electroninks’ ‘UT Dots’ Advanced Gold and Silver Nanoparticle Inks to Product Offering appeared first on Electroninks.

Welcome to Business Insight Journal, Melbs. We’re delighted to have you. Please can you walk us through your professional journey and what led you to co-found Electroninks Incorporated?

At the highest level, this is an opportunity to build something that could advance microelectronics, while adding a positive economic impact and high-value jobs in an important technology sector. Specifically for me, my education and professional training in advance materials, thin films and microelectronics, combined with an entrepreneurial drive led me to start my first company, which was eventually sold to a large a chemicals company here in the US. Electroninks is my second company. In 2014, I met Brett Walker, my co-founder and really the driver of the initial chemistry, and we had a mutual vision on how to commercialize that chemistry into formulations that could be produced and deposited in mass-production settings. It’s extremely difficult to start companies to begin with, and especially challenging with new materials. We built a solid team, travelled the globe nonstop for 5+ years teaching customers about MOD technology, with adoption now taking hold.

Traditional metallization processes have been widely used for years. What are the key limitations of these legacy approaches?

As performance demands increase (particularly in advanced packaging and heterogeneous integration) these methods become limiting. They struggle to enable the types of structures now required, such as highly conformal sidewalls, fine-pitch high-density interconnects, low-temperature processing on sensitive substrates, and complex 3D geometries. In many cases, the process itself dictates the design, rather than enabling new architectures.

Breaking through current performance bottlenecks increasingly requires new build approaches that decouple design from these legacy constraints—enabling more flexible, additive, and geometry-driven fabrication. Companies like Electroninks have framed this shift clearly in applications such as seed-layer formation, EMI shielding, and next-generation packaging.

Additive ink-based methods are gaining attention. How do they simplify manufacturing workflows and reduce costs?

Additive, ink-based metallization simplifies manufacturing by shifting from subtractive processes to selective deposition—placing material only where it’s needed. This eliminates multiple steps such as vacuum deposition, lithography, etching, and extensive wet processing, reducing complexity, defect risk, and cycle time. It also lowers costs by minimizing material waste, energy use, and reliance on capital-intensive equipment. More importantly, it decouples manufacturing from legacy constraints, enabling lower-temperature processing, broader substrate compatibility, and scalable panel-level approaches. Ultimately, the advantage is foundational —simplifying the process, tooling footprint and CAPEX, while enabling more design-driven, flexible production.

As semiconductor devices become more advanced, how important is conformal metallization and EMI shielding in modern packaging?

It is becoming critical. As packages get denser and components sit closer together, EMI becomes a system-level design issue, not an afterthought. Conformal metallization matters because modern packages are three-dimensional, compact, and performance-sensitive. If you cannot coat complex surfaces uniformly, you end up creating reliability and performance bottlenecks. Package-level shielding is increasingly important in compact electronics, and Electroninks has specifically highlighted that its MOD deposition process can achieve strong sidewall coverage in geometries that traditional methods struggle to handle.

How is System in Package and AI-driven compute influencing the need for new materials and processes?

System-in-Package and AI-driven compute are accelerating the need for new materials and processes by fundamentally increasing integration density, power, and complexity. As multiple dies, memory, and heterogeneous components are tightly integrated, traditional metallization approaches struggle to meet requirements for fine-feature interconnects, thermal management, and signal integrity. AI workloads further intensify these demands, pushing for higher current densities and faster data movement on increasingly complex geometries. This is where additive, ink-based approaches—such as those developed by Electroninks—become especially relevant, enabling direct patterning of high-performance metals at lower temperatures and across a wider range of substrates. Ultimately, these trends are driving a shift toward more flexible, design-driven manufacturing that better aligns with the needs of next-generation packaging.

Sustainability is becoming a priority in manufacturing. How do additive approaches support decarbonization goals?

Additive approaches support decarbonization at a system level by fundamentally reducing the material, energy, and infrastructure intensity of manufacturing. For OEMs and hyperscalers, this translates directly into lower embodied carbon, reduced water and chemical usage, and more efficient, scalable production aligned with sustainability targets. By eliminating multiple process steps and enabling lower-temperature, less capital-intensive workflows, additive methods also support more localized and flexible manufacturing—reducing supply chain emissions and improving resilience. Approaches like those from Electroninks further align with this shift by enabling high-performance metallization with fewer inputs and less process overhead. Ultimately, additive manufacturing offers a pathway to meet both performance and ESG goals without the traditional trade-offs.

What impact does reduced material waste and energy usage have on large-scale production environments?

Reduced material waste and energy usage have a compounding impact at scale, improving both economics and sustainability across large production environments. For OEMs and hyperscalers, this means lower operating costs, reduced embodied carbon, and more efficient, resilient supply chains aligned with ESG targets. For engineering directors, it translates into simpler process flows, fewer failure points, and more predictable yield and throughput—making it easier to scale advanced designs without adding complexity. On the factory floor, fewer steps, less chemical handling, and reduced process overhead can improve uptime, safety, and overall workflow efficiency. Approaches such as those from Electroninks reinforce this shift by enabling more selective, streamlined metallization. Ultimately, these efficiencies benefit every layer of the organization, scaling from day-to-day operations to long-term strategic advantage.

As leaders, we have to look beyond simply replacing legacy processes and instead embrace solutions, which are often new and risky, that fundamentally simplify manufacturing, improve sustainability, and unlock performance and scale.

Flexible electronics and wearables are growing rapidly. How are new materials enabling innovation in these categories?

Flexible electronics and wearables are still an early, rapidly evolving market, and new materials are playing a central role in shaping what products are even possible to build. From a product development perspective, materials that enable low-temperature processing, mechanical flexibility, and direct patterning on non-traditional substrates allow teams to move beyond rigid form factors and explore new device architectures. This reduces the gap between concept and manufacturable design, enabling faster iteration and more integrated, conformal products.

For engineering teams, these materials open up new design spaces—such as stretchable interconnects, printed sensors, and embedded functionality—without requiring entirely new manufacturing infrastructure. Approaches like those from Electroninks further support this by enabling conductive features to be printed directly onto/into flexible substrates/fabrics, simplifying prototyping and early production. Ultimately, innovation in this category is less about incremental improvements and more about expanding the design envelope, allowing product teams to define new use cases rather than just optimize existing ones.

On a personal note, what strategy helps you stay effective while leading innovation in a highly technical industry?

I’ve found that staying effective in a highly technical, fast-moving space comes down to consistently aligning innovation with outcomes—both technical and economic. It’s easy for teams to get pulled into complexity, so I focus on maintaining succinctness around what actually drives step-function improvements in performance, and ultimately customer adoption. That means spending time at multiple levels: understanding enough of the technical detail to ask the right questions, while also keeping a clear line of sight to how those decisions translate into growth, adoption, and long-term value creation.

Equally important is building a team and environment that can move quickly while staying grounded. At Electroninks, that means actively listening to the teams closest to the technology and the process—because they often see opportunities and risks before they surface elsewhere. My role is to balance that input with external signals, ensuring we’re driving toward near-term customer adoption while also investing in the capabilities that create long-term value. In an emerging space, there isn’t a fixed playbook, so staying effective comes down to aligning strong internal insight with market realities and focusing execution on the highest-impact opportunities.

Finally, what advice would you give to leaders exploring advanced manufacturing solutions, and any closing thoughts you would like to share with our readers? 

For leaders exploring advanced manufacturing solutions, the most important starting point is to anchor every decision in a clear understanding of where meaningful value is created—whether that’s performance, cost, scalability, or time to market. It’s easy to get drawn to novel technologies, but the real advantage comes from identifying where a new approach removes a fundamental bottleneck rather than incrementally improving an existing process. That requires an entrepreneurial mindset—being willing to challenge assumptions, move early on promising ideas, and accept a degree of calculated risk to capture outsized upside.

More broadly, we’re at a point where manufacturing innovation is increasingly tied to system-level outcomes—performance, efficiency, and sustainability are no longer independent variables. Approaches like those being advanced by Electroninks reflect a broader shift toward more flexible, design-driven manufacturing that aligns better with where advanced packaging and electronics are heading.

Ultimately, the leaders who will benefit most from this transition are those who stay focused on outcomes, remain open to fundamentally different approaches, and are willing to invest early in capabilities that can define the next generation of products.

Melbs LeMieux is the co-founder and president of Electroninks, a global leader in developing and commercializing advanced electronic materials. The company’s core products are focused on a portfolio of metal-complex conductive inks, comprised of Ag, Cu, Ni, Pd, Pt, and other alloys, for additive manufacturing and advanced semiconductor packaging. Their metallization technology has become critical materials for commercial and defense supply chains. With nearly two decades of experience at the intersection of materials science, electronics, and manufacturing, he is widely recognized for advancing next-generation metallization technologies that enable more efficient, scalable, and sustainable production processes.

LeMieux holds a Ph.D. in Materials Science and Engineering from Iowa State University and completed postdoctoral research in Chemical Engineering at Stanford University. His career has focused on translating deep materials innovation into real-world manufacturing solutions.

At Electroninks HQ headquarters in Austin TX, LeMieux leads the company’s strategic vision, driving the development and commercialization of proprietary metal-organic decomposition (MOD) inks that are reshaping how conductive materials are deposited across industries ranging from consumer electronics to automotive, medical devices, and aero/defense. Ultimately, his work emphasizes listening to customer problems from design, implementation and market strategy perspective, and responding with solutions from Electroninks technology and talented team.

A frequent industry speaker and thought leader, LeMieux is an active voice in the evolution of advanced packaging and additive manufacturing. He is particularly focused on how advanced materials can address needs in emerging technologies such as AI-driven compute and related 3D and chiplet architectures driving these end-uses for the hyperscalers, and ultimate their customers.

The post Top Voices Business Insight Journal Interview with Melbs LeMieux, Co-Founder and President of Electroninks Incorporated appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, April 6, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced its participation in Productronica India 2026 from April 8-10, 2026. The company will highlight its latest advancements in metal organic decomposition (MOD) ink technology for high-performance electronics manufacturing. Representing Electroninks at the event will be Maneesh Gupta, who will engage with customers, partners, and industry stakeholders to discuss how additive metallization is transforming traditional manufacturing approaches across semiconductor packaging and electronics assembly. Attendees can visit Electroninks at the India Expo Mart (IEML) at booth H15.G45 in Hall No. 15.

Productronica India serves as a key platform for the electronics manufacturing ecosystem across Asia, bringing together industry leaders focused on advancing production technologies, materials innovation, and scalable manufacturing solutions. Electroninks’ presence underscores its continued investment in expanding its global footprint and supporting regional demand for next-generation packaging technologies.

“At events like Productronica India, we’re seeing strong interest from manufacturers looking to move beyond conventional metallization processes,” said Maneesh Gupta, Representative of Electroninks. “As device architectures become more complex and performance requirements increase, there is a clear need for solutions that can deliver both precision and scalability. Our MOD ink platform is designed to meet those needs while simplifying manufacturing workflows.”

Enabling Advanced Packaging and EMI Shielding at Scale:

At the event, Electroninks will showcase its portfolio of silver-based MOD inks, which enable additive metallization for applications including electromagnetic interference (EMI) shielding, backside metallization, and advanced interconnect formation.

Unlike traditional vacuum-based deposition methods, Electroninks’ MOD inks support atmospheric processing and can be integrated into a range of deposition techniques, including spray and inkjet systems. This approach enables highly uniform, conformal metal coverage across complex three-dimensional geometries, while reducing energy consumption and process complexity. This also offers much lower CAPEX at higher UPH, and modularity in NPI and production lines, which can be advantageous as OSATs and fabs scale.

The company’s technology is particularly well-suited for emerging System-in-Package (SiP) architectures and high-frequency applications, where conventional line-of-sight processes such as sputtering face increasing limitations in sidewall coverage and feature-level uniformity.

By enabling additive, recon-free metallization approaches, Electroninks’ solutions also support reduced chip spacing and higher integration density, addressing key challenges in next-generation electronics design.

Driving Regional Engagement and Industry Collaboration:

As demand for advanced electronics manufacturing continues to grow across India and the broader Asia-Pacific region, Electroninks is focused on building strong partnerships with local manufacturers, equipment providers, and ecosystem players.

Productronica India provides an opportunity for the company to engage directly with industry leaders exploring new approaches to improve yield, reduce cost, and scale production for high-performance devices.

Attendees are invited to connect with Maneesh Gupta during the event to learn more about Electroninks’ technology platform and explore collaboration opportunities.

For more information on Electroninks products and solutions, please visit www.electroninks.com

Full press release: https://www.einpresswire.com/article/904125458/electroninks-to-showcase-advanced-metallization-solutions-at-productronica-india-2026

The post Electroninks to Showcase Advanced Metallization Solutions at Productronica India 2026 appeared first on Electroninks.

The poster, titled: “A Breakthrough in Advanced Packaging: The Total Low-Temperature Silver Metal Complex Ink Full-Suite Materials Platform for EMI Shielding in SiP” will be presented by Jessica Lin on Wednesday, March 4, from 5:30–7:30 PM on the Akimel Lawn.

Addressing a Growing Packaging Bottleneck

As semiconductor devices continue to scale in complexity, integrating RF modules, sensors, AI accelerators, power management, and memory into increasingly dense SiP architectures, shielding and thermal budgets have become one of the most limiting constraints in advanced packaging. Traditional EMI shielding approaches often rely on high-temperature processes or materials that introduce mechanical stress, warpage risk, or integration complexity. These constraints are increasingly incompatible with:

* Heterogeneous integration

* Organic substrates and advanced laminates

* Temperature-sensitive components

* High-frequency automotive and AI applications

Electroninks’ total silver metal complex ink platform directly addresses this challenge by enabling high-conductivity EMI shielding at processing temperatures compatible with advanced substrates and thermally sensitive device stacks.

A Full-Suite Materials Platform — On a Single Tool

MOD Silver Inks have met the majority of performance and reliability specs for advanced packaging. However, they will sometimes tarnish over time. To address this, EI has developed anti-tarnish chemistry and technology. This platform represents a complete materials ecosystem engineered for integration into modern advanced packaging workflows.

The poster will demonstrate:

* Ultra-low temperature processing compatibility: Enabling EMI shielding without exceeding the thermal thresholds of next-generation SiP designs.

* High conductivity performance: Achieving metallic performance levels required for high-frequency EMI suppression.

* A full-suite materials platform approach: Designed for compatibility across substrates, deposition methods, and packaging configurations.

* Scalable integration for manufacturing: Supporting additive and hybrid manufacturing approaches aligned with evolving semiconductor packaging roadmaps.

This holistic approach allows advanced packaging engineers to rethink EMI shielding as an integrated materials solution rather than a secondary, high-temperature add-on step.

Why This Matters Now

Advanced packaging has become a primary driver of semiconductor innovation, particularly as Moore’s Law scaling slows and heterogeneous integration accelerates. According to industry roadmaps from IMAPS and leading semiconductor consortia, SiP architectures are central to enabling:

* AI edge devices

* Automotive electronics and ADAS

* 5G/6G RF modules

* Power-dense industrial systems

However, EMI performance at higher frequencies—especially in tightly integrated modules—remains a growing technical hurdle.

Electroninks’ low-temperature silver metal complex chemistry provides a path forward by decoupling EMI performance from high thermal budgets. This is particularly relevant for:

* Automotive-grade electronics

* Fine-pitch advanced substrates

* Panel-level packaging

* Emerging heterogeneous chiplet designs

For more information on Electroninks products and solutions, please visit www.electroninks.com

Poster Session: Wednesday, March 4 | 5:30–7:30 PM | Akimel Lawn
Location: Sheraton Grand at Wild Horse Pass
Event: IMAPS Device Packaging Conference

Full release: https://www.einpresswire.com/article/895587437/electroninks-to-present-industry-leading-silver-metal-complex-product-suite-platform-for-emi-shielding-at-imaps-dpc-2026

The post Electroninks to Present Industry-Leading Silver Metal Complex Product Suite Platform for EMI Shielding at IMAPS DPC 2026 appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, January 12, 2026 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today released its annual outlook of top trends to impact the industry, Electroninks 2026: The Top Additive Manufacturing Trends to Watch. The trends identify the next major inflection points in additive manufacturing, where organizations shift from legacy implementation to executing on new insights with cost efficiency, competitive advantages and advanced workflows at the core.

The following predictions come from Electroninks top executives and thought leaders, Brett Walker (CEO and Co-founder), Melbs LeMieux (President and Co-founder), Takashi Mochizuki (Head of Sales and Business Development), Kazutaka Ozawa (Technical Director):

1. Metal–Organic Decomposition (MOD) Inks Become a Standard Metallization Pathway
2026 will mark the first year that MOD inks transition from early-stage adoption to mainstream qualification across chip packaging lines. As fabs seek lower-temperature processes, higher reliability, and faster cycle times, particle-free printable metals will emerge as a de facto choice for backside metallization, EMI shielding, and RDL repair applications.

2. Backside Metallization (BSM) Moves to Additive-First Workflows
The rapid rise of AI accelerators and multi-die GPU architectures is pushing BSM requirements beyond the capabilities of traditional vacuum deposition tools. Additive alternatives enable faster throughput, high-aspect-ratio coverage, and better thermal conduction. In 2026, several major OSATs are expected to shift at least one production line to additive metallization.

3. Materials Equipment Co-development Becomes Industry Standard
The industry will increasingly adopt a collaborative model where materials suppliers and toolmakers co-engineer integrated solutions. This is expected to produce purpose-built additive metallization systems optimized for reliability, speed, and fully digital deposition. These vertically aligned solutions will accelerate qualification cycles and improve scalability.

4. Hybrid Packaging Architectures Drive Demand for Multi-Material Workflows
With chiplets, 2.5D interposers, and 3D stacked architectures reaching commercial scale, 2026 will usher in greater demand for materials that work seamlessly together. Printable metals, curable dielectrics, underfills, and thermal interface materials will need to integrate into unified, digitally programmable workflows that support rapid prototyping and high-mix production environments.

5. Power and Water Reduction Becomes a Global Priority as AI Data Centers Drive Infrastructure Strain
A surge in AI-dedicated data centers will create unprecedented demand for power and cooling, pushing utilities and hyperscalers into crisis-level resource constraints. In 2026, semiconductor companies will face urgent pressure to reduce energy and water use across material deposition, curing, and packaging processes. Additive metallization will gain accelerated momentum due to its ability to:

• Eliminate energy-intensive, wasteful metallization processes, especially for large area panels.
• Reduce water use by cutting out chemical etching steps.
• Lower total carbon footprint across packaging lines.

Governments and enterprise customers will reward suppliers that enable more sustainable semiconductor scaling, especially as AI workloads continue to multiply.

6. Metal-Complex Silver Inks: A New Cost-Stability Lever in a Volatile Silver Market
Record and multi-year-high silver prices are forcing every electronics and semiconductor manufacturer to rethink how much precious metal they really need in their processes. Traditional conductive materials have long depended on heavy silver loading to hit performance targets. Today, that approach is colliding with commodity volatility, budget pressure, and growing scrutiny on material efficiency.

The post Electroninks Showcases Top Industry Predictions for 2026 appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, December 19, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the expanding industry adoption of its metal-complex silver formulations due to global silver prices climbing to multi-year highs. The company’s proprietary chemistry enables higher conductivity per gram, lower total silver loading, and improved manufacturing efficiency compared to traditional particulate, flake, or bulk silver materials.

Electroninks’ metal-complex silver platform has emerged as a strategic solution for sectors facing escalating materials costs, including semiconductor packaging, consumer electronics, automotive electronics, aerospace, and advanced additive manufacturing. While traditional silver inks and pastes depend on heavy metal loading to achieve conductive performance, Electroninks’ metal-complex silver technology takes a fundamentally different approach, leveraging engineered molecular and nanoscale architectures that create more accessible and uniformly dispersed active silver species.

This structural design forms highly efficient conductive pathways, enabling:

* Higher conductivity per unit of silver

* Equal or greater electrical performance at significantly lower silver loading

* Reduced exposure to volatile precious-metal markets

As conventional silver prices surge, these efficiency gains translate directly into lower material consumption and more stable long-term cost structures for manufacturers. The company’s formulations allow for lower sintering temperatures, more robust substrate compatibility, and improved reproducibility in complex manufacturing environments. These capabilities are particularly valuable as the semiconductor and electronics packaging sectors continue shifting toward thinner substrates, higher data densities, and rapid production cycles.

As silver markets experience sustained volatility and rising spot prices, manufacturers are increasingly reevaluating raw material strategies. Metal-complex silver offers a resilient pathway forward with significant strategic benefits:

* Lower bill of materials (BOM) due to decreased precious-metal usage

* Equal or superior performance relative to traditional silver inks and pastes

* Ability to domestically or near-shore production to strengthen supply chain security

* Reduced environmental impact through lower lifetime silver consumption

* Lower amount/burden for recycling silver materials, ingots

“Every manufacturer working with conductive materials is feeling the pressure of today’s silver market,” said Dhaval Patel, chief financial officer of Electroninks. “Our metal-complex silver platform gives customers a way to maintain or improve performance while using dramatically less silver. It is a material innovation that is aligned with both the economic realities of the moment and the long-term direction of the industry.”

Electroninks’ metal-complex platform supports the industry’s transition toward higher performance, reduced waste, and more secure supply chains. As electronic systems grow more complex and data-rich, conductive materials must deliver elevated reliability and tighter process control while remaining economically viable.

The company continues to partner with leading OEMs, semiconductor manufacturers, and materials suppliers to scale its formulations into high-volume production environments.

Full release: https://www.einpresswire.com/article/876848711/electroninks-announces-high-performance-metal-complex-silver-as-a-cost-efficient-solution-amid-high-global-silver-prices

The post Electroninks Announces High-Performance Metal-Complex Silver as a Cost-Efficient Solution Amid High Global Silver Prices appeared first on Electroninks.

AUSTIN, TX – December 1, 2025 – Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today unveiled its next-generation EMI shielding solution, setting a new standard for cost, performance and reliability in advanced semiconductor packaging. Notably, the new Electroninks process involves smaller tooling footprint, and boasts a greater than 99 percent reduction in power and water use compared to conventional PVD and e-less metallization, also making it the most sustainable solution on the market.

The solution is based on the company’s revolutionary EI-1200 ink series technology, which is engineered to directly metalize molding compounds, silicon and other relevant substrates in various packaging formats including package level, die-level, and wafer level. However, the major advancements come from the addition of a recon-free process. 

Electroninks’s MOD spray process offers major advancements in EMI shielding by enabling uniform sidewall coverage with aspect ratios approaching 100% for a standard 2mm spacing and the process can do recon-free (which depending on spacing and test vehicle design) can achieve up to 70 percent coverage. In both cases, a feat that traditional processes struggle to match. Critically, the ability to achieve sidewall coverage in such geometries enables manufacturers to eliminate the wafer dicing and reconstitution steps that are typically required to achieve sufficient spacing for traditional sputtered films. By bypassing these stages, Electroninks’s MOD process not only simplifies the overall packaging workflow but also boosts production throughput and reduces handling-related defects.

Silver is widely used in EMI shielding due to its excellent conductivity and high-frequency attenuation capabilities. However, it can be susceptible to surface sulfurization that can alter the film’s appearance when exposed to certain environmental conditions such as elevated temperatures, specific air qualities, or high-humidity tests like uHAST. While this tarnish is purely cosmetic and doesn’t affect conductivity or shielding effectiveness, visible discoloration can erode customer trust, raise quality concerns in manufacturing and inspection, and create uncertainty for long-term reliability. Electroninks has worked with customers to develop solutions, such as the modification of its product chemistry or the addition of a black or clear overcoat, to completely eliminate this hurdle. When combined with the recon-free process, this creates the industry’s most advanced EMI shielding solution. 

“The semiconductor packaging industry has long relied on sputtered EMI shielding layers, despite their cost and complexity,” said Brett Walker, CEO of Electroninks. “With EI-1207, we’re proving that MOD-based spray coating is not just viable; it’s technically superior, lower cost, more sustainable, and ready for high-volume adoption worldwide.”

At the core of EI-1207’s innovation is Electroninks’s proprietary MOD ink chemistry, a true solution, not a particle suspension, which enables superior film uniformity, low-temperature curing, and stable spray coating with no reconstitution required. The platform is already in use by leading OSATs, with production tool installations underway in both Korea and Taiwan.

Key technical advantages over traditional coating processes include:

• Up to 100% sidewall aspect ratio (vs. ~40% with PVD), eliminating the need for wafer dicing and reconstitution.
• Fully compatible with ultrasonic and pneumatic spray heads, enabling seamless integration into standard production lines.
• Simple thermal cure at 160°C, with tack-dry build-up during spraying—no complex vacuum equipment or multi-step sputtering required.
• Multi-head spray systems allow for higher throughput.

For the semiconductor industry, where throughput, yield, and sustainability are paramount, EI-1207 delivers tangible benefits:

• >99% reduction in power and water use compared to PVD.
• Up to 50% lower cost per package, based on third-party modeling by Savansys.
• Small equipment footprint allows for 8 spray coaters in the same floorspace as one PVD system.
• Higher throughput via parallel spray heads, easily scaling production volume.
• Material efficiency gains through optimized spray parameters that reduce silver waste—critical as silver remains the highest-cost input.

“From an engineering standpoint, EI-1200 series is a leap forward because it solves two of the biggest EMI shielding pain points in one stroke, uniform coverage and process complexity,” stated Sima Hannani, product director for Electroninks. “Improvements like achieving near-100 percent sidewall coverage or circumventing dicing and reconstitution steps aren’t just yield boosters; they fundamentally change how lines can be designed and run. Add to that a greater than 99 percent reduction in power and water usage, and you have a process that’s not only more precise, but also inherently more sustainable. This is the kind of advancement that makes high-volume adoption inevitable.”

By replacing capital-intensive and energy-hungry sputtering lines, EI-1207 positions Electroninks’ customers to meet the performance and sustainability demands of 5G, RF-FEM, and SiP applications—without compromising shielding effectiveness. Testing confirms 60dB (1.2μm) to 80dB (3μm) shielding across 1–40GHz, with >30dB from 1MHz–1GHz.

For more information on Electroninks’ expanded portfolio and technical capabilities, visit www.electroninks.com.

Press release link: https://www.einpresswire.com/article/870498095/electroninks-leads-industry-with-total-emi-shielding-solutions-including-recon-free-process

The post Electroninks Leads Industry with Total EMI Shielding Solutions Including Recon-Free Process appeared first on Electroninks.