AUSTIN, TX, UNITED STATES, July 27, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced an expanded strategic collaboration with SIIX Corporation to advance additive high-frequency electromagnetic interference (EMI) shielding solutions across a range of electronics applications in Japan and global markets. As part of the expanded collaboration, SIIX has introduced spray coating equipment and prepared a specialized ultrasonic spray coating environment, enabling it to support prototype coating trials for a variety of products.

The collaboration combines Electroninks’ advanced metal-organic decomposition (MOD) conductive ink platform and spray coating process knowledge with SIIX’s large-scale Electronics Manufacturing Services (EMS) infrastructure and global manufacturing presence. Together, the companies aim to help customers establish and evaluate additive EMI shielding approaches for a broad range of electronics, with automotive being one of several potential target applications.

Under the expanded relationship, SIIX serves as a distribution and collaboration partner for Electroninks’ EMI shielding materials and processes within Japan. SIIX has introduced spray coating equipment and established a specialized ultrasonic spray coating environment, and the partners are now ready to work with customers to establish suitable printing and coating processes together, beginning with prototype coating trials rather than immediate volume production.

“As electronics across automotive and many other industries become denser and operate at higher frequencies, EMI shielding is evolving from a component-level consideration into a system-level engineering challenge,” said Takashi Mochizuki, director of sales and business development at Electroninks. “This collaboration brings together advanced conductive materials, a specialized ultrasonic spray coating environment, and global manufacturing expertise so we can work directly with customers to establish coating processes suited to their products, from automotive electronics to a broad range of other applications.”

Electroninks’ additive EMI shielding platform enables conductive coatings to be deposited directly onto complex geometries using precision spray coating processes, creating lightweight alternatives to traditional metal shielding enclosures such as those used in ECUs, Power Control Units (PCUs), and a wide range of other electronic assemblies.

The collaboration is designed to support growing market demand for conformal EMI shielding approaches capable of reducing weight, simplifying integration, and enabling greater design flexibility across next-generation electronics platforms in automotive and many other industries.

As part of the collaboration, Electroninks provides materials and process knowledge and works alongside SIIX and its customers on the collaborative establishment of coating processes suited to each product and material set. Rather than offering a fixed, pre-optimized process, the partners engage with customers to jointly define the printing and coating approach, starting with prototype coating trials in SIIX’s specialized ultrasonic spray coating environment. Process parameters for specific MOD products and customer materials, including commonly used automotive plastics such as PBT, are established together as part of each engagement rather than assumed to be complete in advance.

The companies have also established a collaborative framework intended to make it easier to bring newly developed Electroninks materials into coating trials over time. As additional conductive materials are introduced, the partners can build on what they learn together to explore process parameters, material configurations, and equipment settings for each new evaluation.

Supporting the initiative, Electroninks has continued to strengthen its own internal capabilities through the installation of advanced spray and printing systems for its metal complex conductive inks, improving process consistency and supporting future scale-up.

“Additive manufacturing is enabling entirely new approaches to electronics integration,” added Melbs LeMieux, co-founder and president at Electroninks. “By combining advanced materials with scalable EMS manufacturing, SIIX, a longtime partner of EI, is now taking the strong initiative to advance their EMS business and offer their customers advancements in functionality and production times. We are proud to support SIIX, and the overall market in Japan as they look to adopt the MOD technology in their electronics manufacturing supply chains.

The companies expect the collaboration to expand over time into additional applications, manufacturing regions, and advanced conductive material workflows supporting broader electronics and semiconductor packaging markets.

Full Release: https://www.einpresswire.com/article/929089911/electroninks-and-siix-expand-collaboration-to-advance-additive-emi-shielding

The post Electroninks and SIIX Expand Collaboration to Advance Additive EMI Shielding appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, July 22, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced it has been selected by AFWERX for a SBIR contract in the amount of $1,249,907 focused on advancing on-demand printed circuit board (PCB) manufacturing for rapid prototyping and mission-critical electronics sustainment applications to address the most pressing challenges in the Department of the Air Force (DAF). The DAF began offering the Open Topic SBIR/STTR program in 2018, which expanded the range of innovations the DAF funded, and now Electroninks has started its journey to create and provide innovative capabilities that will strengthen the national defense of the United States of America.

“Military operations and sustainment environments cannot always afford to wait for traditional electronics supply chains, particularly when dealing with obsolete components or urgent mission requirements,” said Melbs LeMieux, co-founder and president of Electroninks. “With CircuitJet, we are working to bring manufacturing directly to the point of need, enabling rapid production of PCBs and electronic components where and when they are required. This program represents an important opportunity to further advance on-demand electronics manufacturing capabilities that can strengthen operational readiness and improve resilience across defense applications.”

The views expressed are those of the author and do not necessarily reflect the official policy or position of the Department of the Air Force, the Department of Defense, or the U.S. government.

About Electroninks
Electroninks Incorporated is a world-leader in the commercialization of advanced materials for electronics and semiconductor packaging. We have developed a full suite of proprietary metal complex conductive ink solutions and complementary material sets, thus accelerating time to market for both new innovations and drop-in manufacturing breakthroughs.

Electroninks’ metal complex inks – including silver, gold, platinum, nickel and copper – deliver higher conductivity, manufacturing flexibility, and cost-effectiveness. The company’s conductive inks provide reliable solutions for applications in printed circuit board (PCB) manufacturing, semiconductor packaging, consumer electronics, wearables, medical devices and more. We also partner closely with best-in-class equipment and integration partners to provide customers with a total ink and process solution with the ultimate goal of reducing the manufacturing costs and complexity.

Full Release: https://www.einpresswire.com/article/928590667/electroninks-awarded-u-s-air-force-contract-to-advance-on-demand-pcb-manufacturing-for-defense-applications

The post Electroninks Awarded U.S. Air Force Contract to Advance On-Demand PCB Manufacturing for Defense Applications appeared first on Electroninks.

Electroninks makes something that sounds almost too simple to matter: metal in liquid form. Print it, cure it at low heat, and the organic carriers burn off, leaving behind dense, pure metal, no particles, no grey paste, up to 90 percent of bulk conductivity. That metal is what shields a chip package from electromagnetic noise and carries its signal and power to the outside world. Every phone assembled and every module packaged depends on getting that layer right.

This month, the Austin-based company named Baba Fine Chemicals (BFC) as its official India distribution partner, bringing its CircuitShield EMI shielding ink and copper metallization products into the country’s outsourced semiconductor assembly and test (OSAT) market. Electroninks has also joined the India Semiconductor Mission’s IDSPS programme and showed its technology at Gujarat Semiconnect and Productronica India 2026.

None of that is unusual, on paper. Foreign materials companies announce India distribution deals often enough that the news barely registers. What is worth examining is the reasoning behind the timing, and whether it holds up.

The Argument for Now, Not Later

Brett Walker, co-founder and CEO of Electroninks, makes a case rooted less in India’s growth story and more in how materials decisions actually get made. A shielding or metallization material is chosen when a packaging line is designed and qualified. Once production starts, that choice rarely gets revisited, because requalifying a material touches the whole line. The moment to introduce something new is while engineers are still specifying the process flow, not after.

That is where much of India’s OSAT capacity sits today, under active build-out through the India Semiconductor Mission. Plants in Sanand and elsewhere are being tooled now. Whatever gets designed in this year will likely still be running a decade from now. It is a narrow window, and Electroninks’ logic for entering is essentially: better to be at the table while the architecture is still open than to arrive with a better material after the concrete has set.

The greenfield point is real and worth taking seriously rather than treating as a talking point. India skipped landline infrastructure and went straight to mobile. It built UPI rather than layering onto legacy banking rails. A packaging line built from scratch can be laid out around an additive, lower-capital shielding process from day one, rather than shoehorning it into a floor plan designed for an older wet-chemistry approach. An established Taiwanese or American plant with trained teams and depreciating equipment has every rational reason to keep running what already works. That asymmetry is genuinely in India’s favour, whatever technology eventually wins out.

Why BFC, and Why That Choice Matters

The distribution partner is arguably the more consequential decision here than the ink chemistry itself. Electroninks picked Baba Fine Chemicals, a Greater Noida-based specialty chemicals manufacturer that has supplied India’s semiconductor industry since 1997 and has been majority-owned by Acutaas Chemicals since 2023. Walker’s stated criteria (technical credibility on the ground, real supply chain and import infrastructure, financial staying power, and a willingness to stock material customers have not yet asked for) sound like a reasonable checklist for anyone trying to avoid becoming another foreign name that showed up for a press release and left.

That last point, selling ahead of demand, is the harder one to prove out. It requires BFC’s team to walk into an Indian OSAT’s engineering group and make the case for a material nobody has requisitioned yet. Whether that happens at scale is a 2027 story, not a July 2026 one.

The Question That Went Unanswered

To the outlet’s credit, and worth flagging rather than smoothing over, one question in this exchange was declined outright: whether Indian engineers currently have the process knowledge to run MOD ink-based shielding and metallization at scale, and what training plan backs that up. The response on record was that the question itself implies a deficiency and that Indian engineers are capable, followed by a preference not to answer further.

That is a defensible instinct if the goal is not to sound condescending. But workforce readiness for a genuinely new ink chemistry, printed and cured rather than deposited by more familiar methods, is a fair operational question, and dodging it leaves a gap in an otherwise candid set of answers. A grounded reading is that Electroninks has not yet published a concrete training and support plan for India, which is a reasonable thing to still be building, but is different from having answered the question.

What Success Actually Looks Like

Walker’s own bar for judging this a year out is specific enough to hold him to: material qualified into a meaningful number of production processes in India, with at least one customer willing to say so publicly. That is a sensible metric. In materials, a single qualified line carries more weight than any number of trade-show conversations, because qualification is the expensive, months-long step that proves the chemistry survives contact with a real process engineer’s tolerances.

The near-term demand, by Walker’s account, is largely global OEMs building Indian capacity for products sold worldwide, with India’s own consumer electronics and automotive demand as the larger long-term opportunity. The stated investment sequence, distribution first, local inventory and applications support next, local production only if volumes justify it, is conservative and probably the right order for a company of Electroninks’ size, reported at roughly 40 to 45 people.

A Fair Read

There is a straightforward commercial logic here that does not require taking every line of the announcement at face value to find credible: India is genuinely building packaging capacity from a clean sheet, that is a real window for a new metallization technology, and BFC brings decades of exactly the unglamorous logistics and trust-building work a foreign chemistry company cannot shortcut. The workforce question deserved a fuller answer than it got, and the real test of the “designing in before customers ask” pitch will show up in qualification numbers, not in this interview. On the specific, checkable claim, that Indian packaging lines are being specified now and will run largely unchanged for years, the timing argument holds. What happens next depends on whether BFC can turn early trade-show interest into signed-off production lines, which is precisely the kind of thing worth revisiting in twelve months.

Full release: https://www.theceo.in/industry/technology/why-a-texas-ink-maker-sees-the-value-in-indias-semiconductor-market-before-lines-are-even-built

The post Why a Texas Ink Maker Sees the Value In India’s Semiconductor Market Before Lines Are Even Built appeared first on Electroninks.

by Rohan Mathawan

India’s semiconductor ambitions have attracted chip designers, fab investors, and packaging specialists from across the globe. But the quieter story, the one that actually determines whether a packaging line works well, is about materials. The inks, coatings, and metallization compounds that sit between a chip and the board it lives on are as consequential as the silicon itself, yet they rarely get the headline treatment.

That is starting to change.

Electroninks, the Austin, Texas-based company that has built its reputation on metal organic decomposition (MOD) ink technology, announced on July 13 that it has named Baba Fine Chemicals (BFC) as its official India distribution partner. The deal brings Electroninks’ full conductive ink portfolio into the Indian market, including its CircuitShield EMI shielding product and copper metallization solutions, targeting the country’s fast-growing outsourced semiconductor assembly and test (OSAT) and electronics manufacturing services (EMS) sectors.

Why India, and Why Now

The timing is not accidental. India’s semiconductor packaging industry is in a genuinely unusual position: much of it does not exist yet. Unlike mature markets in Taiwan, South Korea, or Japan, where established players must retrofit new materials into decades-old processes, India’s greenfield OSAT and EMS lines are being designed from scratch. That creates a window for advanced materials companies to get their technology specified into facilities before the first production run, a far easier path than displacing an entrenched supplier later.

Rakesh Gupta, founder and partner at Baba Fine Chemicals, put it plainly: the goal is to get world-class materials into Indian manufacturers’ hands before they need them, not after. The logic is straightforward. If a packaging line is built from the ground up with Electroninks’ MOD ink-based shielding and metallization baked in from the start, the customer never has to face the painful and expensive process of re-qualifying a new material mid-production.

Melbs LeMieux, co-founder and president of Electroninks, framed the urgency from his side. India’s market is growing rapidly across multiple product platforms driven by global OEMs, and getting in early with a trusted local partner matters enormously in a supply chain as complex as semiconductors.

What MOD Ink Technology Actually Does

Electroninks’ core technology is built around metal complex inks, a class of conductive materials that decompose at relatively low temperatures to leave behind high-purity metal traces. The approach offers advantages over traditional silver paste or solder-based solutions in terms of resolution, adhesion, and compatibility with advanced packaging architectures.

CircuitShield, the company’s EMI shielding product, addresses one of the more pressing challenges in modern semiconductor packaging: as chips get smaller and more powerful, managing electromagnetic interference becomes harder. Effective shielding needs to be applied with precision, and MOD ink-based approaches allow for conformal, additive deposition that traditional methods struggle to match.

The copper metallization portfolio extends that capability to interconnect applications, an area where the industry is paying close attention as it moves beyond traditional wire bonding toward more advanced packaging formats.

The IDSPS Angle Is the Strategic Play

Equally significant is BFC’s entry into the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative that brings together government bodies, academic institutions, and global industry players to accelerate India’s semiconductor R&D, workforce development, and supply chain maturity.

For Electroninks, participation in IDSPS is not just a relationship-building exercise. It is a direct channel into the institutions and decision-makers who will shape India’s semiconductor infrastructure over the next decade. Research institutes affiliated with the program influence procurement decisions, technology roadmaps, and the training pipelines that produce the engineers who will eventually specify materials for production lines.

It is a long game, but it is the right one.

Market Validation Has Already Begun

The companies have not waited for the formal announcement to start generating interest. Electroninks and BFC showcased the technology at the IDSPS program kickoff, Gujarat Semiconnect, and Productronica India 2026. The companies report strong early interest from major Indian packaging customers following these appearances. Given how early-stage most of India’s OSAT ecosystem still is, the pipeline for adoption could develop quickly as those customers move from planning to production.

Gujarat Semiconnect, in particular, has emerged as an important forum for companies targeting India’s semiconductor manufacturing push in the state, which has positioned itself aggressively to attract chip-related investment.

Reading the Bigger Picture

India’s semiconductor packaging market is still in formation, but the trajectory is clear. Global OEMs are actively diversifying their supply chains away from single-country concentration, and India has made the policy commitments, through the India Semiconductor Mission and programs like IDSPS, to position itself as a credible alternative.

For a company like Electroninks, this is a market-entry decision that looks modest today but could prove foundational. The companies that establish material qualifications and supply relationships at the greenfield stage tend to remain incumbents for the lifecycle of those facilities, which in semiconductor manufacturing can span fifteen to twenty years.

BFC brings the local credibility, supply chain navigation experience, and relationships that a foreign materials supplier simply cannot replicate by setting up a local office and hoping for the best. That combination of technical differentiation from Electroninks and local market depth from BFC is a sensible structure for a market where trust and reliability matter as much as performance specs.

India is building its semiconductor industry in real time. The companies that show up early, with the right partners and the right materials, are likely to have a significant advantage over those who wait until the market matures.

Electroninks appears to understand that.

Full Article: https://techstory.in/electroninks-is-betting-on-indias-semiconductor-moment-and-it-is-bringing-the-right-materials-to-do-it/

The post Electroninks Is Betting on India’s Semiconductor Moment and It Is Bringing the Right Materials to Do It appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, June 15, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of EI-1169, a new UV-curable silver conductive ink engineered for inkjet deposition across advanced electronics manufacturing applications. Designed for high-reliability conductive printing on epoxy, polyimide, and copper substrates, EI-1169 expands Electroninks’ portfolio of metal-organic decomposition (MOD) conductive inks supporting next-generation additive manufacturing workflows, printed electronics, EMI shielding, and semiconductor packaging applications.

The new formulation combines stable jetting performance on industry-relevant printheads, long shelf life and printhead life, low-temperature curing, and strong adhesion characteristics within a polymer-free conductive ink platform optimized for digitally manufactured electronics. The combination of jettability, reliability and electrical performance sets this product apart on a global level.

“As electronics manufacturers continue moving toward additive and digitally driven production environments, conductive materials have to deliver both processing stability and long-term reliability,” said Brett Walker, chief executive officer at Electroninks. “EI-1169 was developed to support those requirements while enabling broader substrate compatibility and lower-temperature conductive processing.”

EI-1169 is formulated for inkjet deposition environments requiring precise droplet control, repeatable print performance, and robust substrate adhesion. The ink demonstrates strong stability and ink-jettability in several printheads, including DMP Samba printheads, helping support scalable additive manufacturing workflows and consistent production output.

Key product features include:

* Polymer-free MOD silver conductive ink

* UV-curable processing capability

* Lead-free and halogen-free formulation

* Strong adhesion on copper, epoxy, and polyimide substrates

* Stable jetting performance for inkjet deposition

* Long refrigerated shelf stability

The material also supports UV curing at 365 nm or 395 nm wavelengths, providing additional process flexibility for manufacturers working with temperature-sensitive substrates and advanced packaging architectures.

Electroninks developed EI-1169 to support the growing shift toward additive manufacturing across electronics production and semiconductor packaging workflows. As device architectures become more compact and geometrically complex, manufacturers increasingly require conductive materials that combine high-resolution deposition, substrate compatibility, and scalable processing performance.

Electroninks expects EI-1169 to support applications including:

* EMI shielding

* Printed electronics

* Flexible electronics

* Semiconductor packaging

* Advanced interconnects

* Additive manufacturing workflows

The launch of EI-1169 further expands Electroninks’ growing portfolio of conductive materials engineered for next-generation electronics manufacturing.

The company continues developing advanced metal complex conductive ink solutions spanning silver, copper, gold, platinum, and nickel chemistries for applications across semiconductor packaging, printed circuit boards, advanced sensors, aerospace systems, medical devices, and additive electronics manufacturing.

“Additive manufacturing is fundamentally changing how electronics are designed and produced,” added Walker. “Our focus remains on delivering conductive materials that help customers simplify manufacturing workflows while enabling new levels of performance and integration flexibility.”

EI-1169 is available immediately for customer evaluation and integration. For additional product specifications and availability information, visit www.electroninks.com.

Full release: https://www.einpresswire.com/article/919268252/electroninks-launches-uv-curable-silver-conductive-ink-for-advanced-printed-electronics-and-emi-shielding-applications

The post Electroninks Launches UV-Curable Silver Conductive Ink for Advanced Printed Electronics and EMI Shielding Applications appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, June 9, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced it will host a booth and present a session on MOD inks at TechBlick 2026, taking place June 10-11 at the Computer History Museum in Mountain View, California. At the event, Mitchell Smith, will present Silver MOD Inks: Advancing Performance Beyond Particle Pastes at 12:15PM PT on June 10th. Visit us at Booth E07, at TechBlick to connect with our team and discover how Electroninks is transforming the industry.

The presentation will examine how metal organic decomposition (MOD) inks are emerging as a next-generation alternative to conventional silver particle-based conductive pastes used across printed electronics and advanced manufacturing applications.

As manufacturers face increasing pressure to improve performance while managing material costs, silver MOD inks are gaining attention for their ability to achieve high conductivity using less silver content. This advantage becomes particularly important amid ongoing silver price volatility, which continues to impact production economics across the electronics industry.

“Traditional conductive particle pastes have played an important role in printed electronics, but the market is reaching a point where performance, scalability, and cost efficiency must evolve together,” said Mitchell Smith, Engineer, Product Manager at Electroninks. “MOD inks offer a fundamentally different chemical approach that enables denser conductive films, lower curing temperatures, and broader substrate compatibility.”

The session will explore the underlying chemical mechanisms behind silver MOD technology and how these materials differ from traditional particle-filled formulations. Attendees will gain insight into how MOD inks can:

* Form denser conductive films than conventional silver particle pastes

* Achieve high electrical performance with reduced metal loading

* Enable lower-temperature curing processes compatible with plastic substrates

* Support next-generation additive manufacturing and printed electronics applications

The presentation is designed for manufacturers, materials engineers, and product developers currently using conductive particle pastes, as well as organizations evaluating conductive inks for future product integration.

Electroninks continues to expand the use of its proprietary MOD ink platform across advanced packaging, additive electronics, EMI shielding, and printed electronic applications, helping manufacturers improve performance while simplifying manufacturing workflows.

Attendees interested in learning more about Electroninks’ conductive ink technologies are encouraged to attend the session at TechBlick 2026.

Full release: https://www.einpresswire.com/article/918448613/electroninks-to-present-at-techblick-2026-on-the-future-of-silver-mod-inks-for-advanced-electronics

The post Electroninks to Present at TechBlick 2026 on the Future of Silver MOD Inks for Advanced Electronics appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, June 2, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced a significant advancement to its copper metal-organic decomposition (MOD) ink platform: a copper metallization technology capable of curing under ambient conditions, open to air.

Building on the company’s September 2024 commercial launch of Cu-MOD, which demonstrated low resistivity and strong adhesion across a broad range of substrates, this next-generation development directly addresses one of the most consistent requests from the market since that release: the ability to cure copper without an inert atmosphere, especially in large area metallization applications.

Electroninks is currently working with a select group of preferred partners to develop this core technology into real-world use cases, with more complete results and performance data expected in Q3 of 2026.

A Meaningful Shift For Copper Metallization

Copper is one of the most widely used materials in electronics manufacturing, valued for its conductivity, availability, and cost advantages over precious metals. However, a fundamental challenge has long limited its use in additive and ink-based processes: copper oxidizes readily, requiring inert atmosphere curing environments, typically nitrogen or forming gas, to produce dense, conductive films.

Electroninks’ new Cu-MOD technology removes that requirement. The ink cures under ambient, open-air conditions using standard low-temperature thermal processing at approximately 150 deg for 5 to 10 minutes, producing a dense copper film without the need for inert gas infrastructure, vacuum equipment, heat press or lamination systems, or other specialty tooling. The result is a simpler, more accessible copper metallization workflow that is compatible with standard processing environments.

Preliminary results, which focus on polymide, glass, EMC, and build-up film substrates, indicate resistivity performance that is competitive with existing copper metallization approaches, with full performance data to be shared with the broader market in Q3 2026

Broader Implications for the Market

Electroninks believes the implications of ambient-condition copper curing extend well beyond the applications where copper metallization is already established.

“While silver and gold will remain key materials in many applications, for large area and full-film metallization, the rising cost of precious metals has renewed interest across the electronics industry in cost-effective alternatives that do not compromise electrical performance. Electroninks’ ambient-curable Cu-MOD is designed to address that need directly, offering a lower-cost conductive solution that can be processed without the environmental controls traditionally required for copper.” Said Kazutaka Ozawa, Technical Director at Electroninks.

Preferred Partner Engagement

Given the level of market interest anticipated, Electroninks is currently limiting early access to a select group of preferred development partners to ensure focused collaboration and the highest quality of technical outcomes. Organizations interested in learning more about partnership opportunities are encouraged to contact Electroninks directly.

Full performance data, application results, and broader availability details will be announced in Q3 2026.

Full release can be found here: https://www.einpresswire.com/article/916854051/electroninks-introduces-air-curable-copper-complex-conductive-ink-in-marked-advanced-for-additive-metallization

The post Electroninks Introduces Air-Curable Copper Complex Conductive Ink in Marked Advanced for Additive Metallization appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, May 18, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced the company’s new gold and silver nanoparticle inks from its UTDots portfolio, which will be commercially available through Sigma-Aldrich. The new product family includes six conductive ink formulations with a focus on green solvents and optimized for inkjet and aerosol jet deposition platforms, enabling high-performance additive manufacturing across applications ranging from wearable devices and biosensors to RF systems, EMI shielding, and advanced defense electronics.

The launch includes the following commercially available formulations:

* UTD-Ag-25IJ

* UTD-Ag-40IJ

* UTD-Ag-60PA

* UTD-Au-25IJ

* UTD-Au-40IJ

* UTD-Au-60IJ

As manufacturers increasingly shift toward digital fabrication methods, UT Dots’ nanoparticle inks are designed to provide the conductivity, process stability, and scalability required to move printed electronics beyond prototyping and into broader commercial deployment.

“The printed electronics market is moving rapidly toward higher-performance, digitally manufactured systems that demand both precision and scalability,” said Alex Didenko, engineer at Electroninks, managing the product development of the UTDots portfolio.. “Our new nanoparticle ink portfolio was developed to help engineers and manufacturers bridge that gap with materials capable of supporting everything from flexible consumer devices to highly demanding aerospace and defense applications.”

Engineered for Precision Across Modern Printing Platforms

The new ink portfolio is designed to support a broad range of additive manufacturing workflows and geometries. UT Dots’ inkjet-compatible formulations are optimized for stable and repeatable droplet formation, enabling fine-feature patterning with minimal variability across flexible and rigid substrates alike. The aerosol jet-compatible series extends those capabilities further, supporting conformal deposition on complex three-dimensional surfaces with feature widths below 200 microns.

This flexibility enables manufacturers to print conductive structures on everything from planar flexible circuits to curved integrated systems without sacrificing precision or consistency.

Near-Bulk Conductivity for High-Performance Applications

Following sintering, UT Dots’ silver nanoparticle inks achieve resistivity values between 3–10 microhm-centimeter, approaching the performance characteristics of bulk silver while maintaining compatibility with additive manufacturing processes.

The company’s gold nanoparticle formulations achieve conductivity levels within 2–7x of bulk gold and support photonic curing in the 500–550 nm wavelength range. This capability allows conductive structures to be processed on temperature-sensitive substrates that are incompatible with conventional high-temperature thermal curing methods.

These performance characteristics position the materials for demanding applications requiring high conductivity, low-profile form factors, and advanced integration flexibility.

Accelerating Innovation in Printed Biosensing

UT Dots’ gold nanoparticle formulations are also designed to support emerging biosensing and diagnostic applications. Gold’s inherent biocompatibility, oxidation resistance, and compatibility with thiol-based surface chemistry make the UTD-Au series particularly well suited for applications including:

* Enzymatic glucose sensors

* Immunoassay platforms

* DNA detection arrays

* Lab-on-chip microelectrode systems

By enabling mask-free additive fabrication through inkjet printing, the platform significantly shortens the design-to-prototype cycle compared to traditional lithography-based manufacturing methods. The result is faster iteration, reduced material waste, and improved development flexibility for researchers and medical device developers.

Designed for Commercial Scalability

Beyond laboratory development, UT Dots engineered the new ink platform to support long-term manufacturing scalability. The formulations are produced using standardized synthesis processes and strict quality-control methodologies designed to ensure strong batch-to-batch consistency. This allows manufacturers to maintain predictable electrical and processing performance as products transition from early-stage development into commercial production environments.

“As electronic microdevices continue maturing into broader application spaces, including medical devices and advanced sensors, material consistency and reliability become just as important as conductivity,” stated Melbs LeMieux, cofounder and president of Electroninks, UT Dots’ parent company. “We built this portfolio to support our continuous expansion of advanced materials to address new markets and customers.”

The new conductive ink portfolio is available immediately for customer evaluation and commercial integration. For more information on UT Dots products and solutions, please visit www.utdots.com

Full release: https://www.einpresswire.com/article/913069752/sigma-aldrich-adds-electroninks-ut-dots-advanced-gold-and-silver-nanoparticle-inks-to-product-offering

The post Sigma-Aldrich Adds Electroninks’ ‘UT Dots’ Advanced Gold and Silver Nanoparticle Inks to Product Offering appeared first on Electroninks.

Welcome to Business Insight Journal, Melbs. We’re delighted to have you. Please can you walk us through your professional journey and what led you to co-found Electroninks Incorporated?

At the highest level, this is an opportunity to build something that could advance microelectronics, while adding a positive economic impact and high-value jobs in an important technology sector. Specifically for me, my education and professional training in advance materials, thin films and microelectronics, combined with an entrepreneurial drive led me to start my first company, which was eventually sold to a large a chemicals company here in the US. Electroninks is my second company. In 2014, I met Brett Walker, my co-founder and really the driver of the initial chemistry, and we had a mutual vision on how to commercialize that chemistry into formulations that could be produced and deposited in mass-production settings. It’s extremely difficult to start companies to begin with, and especially challenging with new materials. We built a solid team, travelled the globe nonstop for 5+ years teaching customers about MOD technology, with adoption now taking hold.

Traditional metallization processes have been widely used for years. What are the key limitations of these legacy approaches?

As performance demands increase (particularly in advanced packaging and heterogeneous integration) these methods become limiting. They struggle to enable the types of structures now required, such as highly conformal sidewalls, fine-pitch high-density interconnects, low-temperature processing on sensitive substrates, and complex 3D geometries. In many cases, the process itself dictates the design, rather than enabling new architectures.

Breaking through current performance bottlenecks increasingly requires new build approaches that decouple design from these legacy constraints—enabling more flexible, additive, and geometry-driven fabrication. Companies like Electroninks have framed this shift clearly in applications such as seed-layer formation, EMI shielding, and next-generation packaging.

Additive ink-based methods are gaining attention. How do they simplify manufacturing workflows and reduce costs?

Additive, ink-based metallization simplifies manufacturing by shifting from subtractive processes to selective deposition—placing material only where it’s needed. This eliminates multiple steps such as vacuum deposition, lithography, etching, and extensive wet processing, reducing complexity, defect risk, and cycle time. It also lowers costs by minimizing material waste, energy use, and reliance on capital-intensive equipment. More importantly, it decouples manufacturing from legacy constraints, enabling lower-temperature processing, broader substrate compatibility, and scalable panel-level approaches. Ultimately, the advantage is foundational —simplifying the process, tooling footprint and CAPEX, while enabling more design-driven, flexible production.

As semiconductor devices become more advanced, how important is conformal metallization and EMI shielding in modern packaging?

It is becoming critical. As packages get denser and components sit closer together, EMI becomes a system-level design issue, not an afterthought. Conformal metallization matters because modern packages are three-dimensional, compact, and performance-sensitive. If you cannot coat complex surfaces uniformly, you end up creating reliability and performance bottlenecks. Package-level shielding is increasingly important in compact electronics, and Electroninks has specifically highlighted that its MOD deposition process can achieve strong sidewall coverage in geometries that traditional methods struggle to handle.

How is System in Package and AI-driven compute influencing the need for new materials and processes?

System-in-Package and AI-driven compute are accelerating the need for new materials and processes by fundamentally increasing integration density, power, and complexity. As multiple dies, memory, and heterogeneous components are tightly integrated, traditional metallization approaches struggle to meet requirements for fine-feature interconnects, thermal management, and signal integrity. AI workloads further intensify these demands, pushing for higher current densities and faster data movement on increasingly complex geometries. This is where additive, ink-based approaches—such as those developed by Electroninks—become especially relevant, enabling direct patterning of high-performance metals at lower temperatures and across a wider range of substrates. Ultimately, these trends are driving a shift toward more flexible, design-driven manufacturing that better aligns with the needs of next-generation packaging.

Sustainability is becoming a priority in manufacturing. How do additive approaches support decarbonization goals?

Additive approaches support decarbonization at a system level by fundamentally reducing the material, energy, and infrastructure intensity of manufacturing. For OEMs and hyperscalers, this translates directly into lower embodied carbon, reduced water and chemical usage, and more efficient, scalable production aligned with sustainability targets. By eliminating multiple process steps and enabling lower-temperature, less capital-intensive workflows, additive methods also support more localized and flexible manufacturing—reducing supply chain emissions and improving resilience. Approaches like those from Electroninks further align with this shift by enabling high-performance metallization with fewer inputs and less process overhead. Ultimately, additive manufacturing offers a pathway to meet both performance and ESG goals without the traditional trade-offs.

What impact does reduced material waste and energy usage have on large-scale production environments?

Reduced material waste and energy usage have a compounding impact at scale, improving both economics and sustainability across large production environments. For OEMs and hyperscalers, this means lower operating costs, reduced embodied carbon, and more efficient, resilient supply chains aligned with ESG targets. For engineering directors, it translates into simpler process flows, fewer failure points, and more predictable yield and throughput—making it easier to scale advanced designs without adding complexity. On the factory floor, fewer steps, less chemical handling, and reduced process overhead can improve uptime, safety, and overall workflow efficiency. Approaches such as those from Electroninks reinforce this shift by enabling more selective, streamlined metallization. Ultimately, these efficiencies benefit every layer of the organization, scaling from day-to-day operations to long-term strategic advantage.

As leaders, we have to look beyond simply replacing legacy processes and instead embrace solutions, which are often new and risky, that fundamentally simplify manufacturing, improve sustainability, and unlock performance and scale.

Flexible electronics and wearables are growing rapidly. How are new materials enabling innovation in these categories?

Flexible electronics and wearables are still an early, rapidly evolving market, and new materials are playing a central role in shaping what products are even possible to build. From a product development perspective, materials that enable low-temperature processing, mechanical flexibility, and direct patterning on non-traditional substrates allow teams to move beyond rigid form factors and explore new device architectures. This reduces the gap between concept and manufacturable design, enabling faster iteration and more integrated, conformal products.

For engineering teams, these materials open up new design spaces—such as stretchable interconnects, printed sensors, and embedded functionality—without requiring entirely new manufacturing infrastructure. Approaches like those from Electroninks further support this by enabling conductive features to be printed directly onto/into flexible substrates/fabrics, simplifying prototyping and early production. Ultimately, innovation in this category is less about incremental improvements and more about expanding the design envelope, allowing product teams to define new use cases rather than just optimize existing ones.

On a personal note, what strategy helps you stay effective while leading innovation in a highly technical industry?

I’ve found that staying effective in a highly technical, fast-moving space comes down to consistently aligning innovation with outcomes—both technical and economic. It’s easy for teams to get pulled into complexity, so I focus on maintaining succinctness around what actually drives step-function improvements in performance, and ultimately customer adoption. That means spending time at multiple levels: understanding enough of the technical detail to ask the right questions, while also keeping a clear line of sight to how those decisions translate into growth, adoption, and long-term value creation.

Equally important is building a team and environment that can move quickly while staying grounded. At Electroninks, that means actively listening to the teams closest to the technology and the process—because they often see opportunities and risks before they surface elsewhere. My role is to balance that input with external signals, ensuring we’re driving toward near-term customer adoption while also investing in the capabilities that create long-term value. In an emerging space, there isn’t a fixed playbook, so staying effective comes down to aligning strong internal insight with market realities and focusing execution on the highest-impact opportunities.

Finally, what advice would you give to leaders exploring advanced manufacturing solutions, and any closing thoughts you would like to share with our readers? 

For leaders exploring advanced manufacturing solutions, the most important starting point is to anchor every decision in a clear understanding of where meaningful value is created—whether that’s performance, cost, scalability, or time to market. It’s easy to get drawn to novel technologies, but the real advantage comes from identifying where a new approach removes a fundamental bottleneck rather than incrementally improving an existing process. That requires an entrepreneurial mindset—being willing to challenge assumptions, move early on promising ideas, and accept a degree of calculated risk to capture outsized upside.

More broadly, we’re at a point where manufacturing innovation is increasingly tied to system-level outcomes—performance, efficiency, and sustainability are no longer independent variables. Approaches like those being advanced by Electroninks reflect a broader shift toward more flexible, design-driven manufacturing that aligns better with where advanced packaging and electronics are heading.

Ultimately, the leaders who will benefit most from this transition are those who stay focused on outcomes, remain open to fundamentally different approaches, and are willing to invest early in capabilities that can define the next generation of products.

Melbs LeMieux is the co-founder and president of Electroninks, a global leader in developing and commercializing advanced electronic materials. The company’s core products are focused on a portfolio of metal-complex conductive inks, comprised of Ag, Cu, Ni, Pd, Pt, and other alloys, for additive manufacturing and advanced semiconductor packaging. Their metallization technology has become critical materials for commercial and defense supply chains. With nearly two decades of experience at the intersection of materials science, electronics, and manufacturing, he is widely recognized for advancing next-generation metallization technologies that enable more efficient, scalable, and sustainable production processes.

LeMieux holds a Ph.D. in Materials Science and Engineering from Iowa State University and completed postdoctoral research in Chemical Engineering at Stanford University. His career has focused on translating deep materials innovation into real-world manufacturing solutions.

At Electroninks HQ headquarters in Austin TX, LeMieux leads the company’s strategic vision, driving the development and commercialization of proprietary metal-organic decomposition (MOD) inks that are reshaping how conductive materials are deposited across industries ranging from consumer electronics to automotive, medical devices, and aero/defense. Ultimately, his work emphasizes listening to customer problems from design, implementation and market strategy perspective, and responding with solutions from Electroninks technology and talented team.

A frequent industry speaker and thought leader, LeMieux is an active voice in the evolution of advanced packaging and additive manufacturing. He is particularly focused on how advanced materials can address needs in emerging technologies such as AI-driven compute and related 3D and chiplet architectures driving these end-uses for the hyperscalers, and ultimate their customers.

The post Top Voices Business Insight Journal Interview with Melbs LeMieux, Co-Founder and President of Electroninks Incorporated appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, April 6, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced its participation in Productronica India 2026 from April 8-10, 2026. The company will highlight its latest advancements in metal organic decomposition (MOD) ink technology for high-performance electronics manufacturing. Representing Electroninks at the event will be Maneesh Gupta, who will engage with customers, partners, and industry stakeholders to discuss how additive metallization is transforming traditional manufacturing approaches across semiconductor packaging and electronics assembly. Attendees can visit Electroninks at the India Expo Mart (IEML) at booth H15.G45 in Hall No. 15.

Productronica India serves as a key platform for the electronics manufacturing ecosystem across Asia, bringing together industry leaders focused on advancing production technologies, materials innovation, and scalable manufacturing solutions. Electroninks’ presence underscores its continued investment in expanding its global footprint and supporting regional demand for next-generation packaging technologies.

“At events like Productronica India, we’re seeing strong interest from manufacturers looking to move beyond conventional metallization processes,” said Maneesh Gupta, Representative of Electroninks. “As device architectures become more complex and performance requirements increase, there is a clear need for solutions that can deliver both precision and scalability. Our MOD ink platform is designed to meet those needs while simplifying manufacturing workflows.”

Enabling Advanced Packaging and EMI Shielding at Scale:

At the event, Electroninks will showcase its portfolio of silver-based MOD inks, which enable additive metallization for applications including electromagnetic interference (EMI) shielding, backside metallization, and advanced interconnect formation.

Unlike traditional vacuum-based deposition methods, Electroninks’ MOD inks support atmospheric processing and can be integrated into a range of deposition techniques, including spray and inkjet systems. This approach enables highly uniform, conformal metal coverage across complex three-dimensional geometries, while reducing energy consumption and process complexity. This also offers much lower CAPEX at higher UPH, and modularity in NPI and production lines, which can be advantageous as OSATs and fabs scale.

The company’s technology is particularly well-suited for emerging System-in-Package (SiP) architectures and high-frequency applications, where conventional line-of-sight processes such as sputtering face increasing limitations in sidewall coverage and feature-level uniformity.

By enabling additive, recon-free metallization approaches, Electroninks’ solutions also support reduced chip spacing and higher integration density, addressing key challenges in next-generation electronics design.

Driving Regional Engagement and Industry Collaboration:

As demand for advanced electronics manufacturing continues to grow across India and the broader Asia-Pacific region, Electroninks is focused on building strong partnerships with local manufacturers, equipment providers, and ecosystem players.

Productronica India provides an opportunity for the company to engage directly with industry leaders exploring new approaches to improve yield, reduce cost, and scale production for high-performance devices.

Attendees are invited to connect with Maneesh Gupta during the event to learn more about Electroninks’ technology platform and explore collaboration opportunities.

For more information on Electroninks products and solutions, please visit www.electroninks.com

Full press release: https://www.einpresswire.com/article/904125458/electroninks-to-showcase-advanced-metallization-solutions-at-productronica-india-2026

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