AUSTIN, TX, UNITED STATES, April 6, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced its participation in Productronica India 2026 from April 8-10, 2026. The company will highlight its latest advancements in metal organic decomposition (MOD) ink technology for high-performance electronics manufacturing. Representing Electroninks at the event will be Maneesh Gupta, who will engage with customers, partners, and industry stakeholders to discuss how additive metallization is transforming traditional manufacturing approaches across semiconductor packaging and electronics assembly. Attendees can visit Electroninks at the India Expo Mart (IEML) at booth H15.G45 in Hall No. 15.

Productronica India serves as a key platform for the electronics manufacturing ecosystem across Asia, bringing together industry leaders focused on advancing production technologies, materials innovation, and scalable manufacturing solutions. Electroninks’ presence underscores its continued investment in expanding its global footprint and supporting regional demand for next-generation packaging technologies.

“At events like Productronica India, we’re seeing strong interest from manufacturers looking to move beyond conventional metallization processes,” said Maneesh Gupta, Representative of Electroninks. “As device architectures become more complex and performance requirements increase, there is a clear need for solutions that can deliver both precision and scalability. Our MOD ink platform is designed to meet those needs while simplifying manufacturing workflows.”

Enabling Advanced Packaging and EMI Shielding at Scale:

At the event, Electroninks will showcase its portfolio of silver-based MOD inks, which enable additive metallization for applications including electromagnetic interference (EMI) shielding, backside metallization, and advanced interconnect formation.

Unlike traditional vacuum-based deposition methods, Electroninks’ MOD inks support atmospheric processing and can be integrated into a range of deposition techniques, including spray and inkjet systems. This approach enables highly uniform, conformal metal coverage across complex three-dimensional geometries, while reducing energy consumption and process complexity. This also offers much lower CAPEX at higher UPH, and modularity in NPI and production lines, which can be advantageous as OSATs and fabs scale.

The company’s technology is particularly well-suited for emerging System-in-Package (SiP) architectures and high-frequency applications, where conventional line-of-sight processes such as sputtering face increasing limitations in sidewall coverage and feature-level uniformity.

By enabling additive, recon-free metallization approaches, Electroninks’ solutions also support reduced chip spacing and higher integration density, addressing key challenges in next-generation electronics design.

Driving Regional Engagement and Industry Collaboration:

As demand for advanced electronics manufacturing continues to grow across India and the broader Asia-Pacific region, Electroninks is focused on building strong partnerships with local manufacturers, equipment providers, and ecosystem players.

Productronica India provides an opportunity for the company to engage directly with industry leaders exploring new approaches to improve yield, reduce cost, and scale production for high-performance devices.

Attendees are invited to connect with Maneesh Gupta during the event to learn more about Electroninks’ technology platform and explore collaboration opportunities.

For more information on Electroninks products and solutions, please visit www.electroninks.com

Full press release: https://www.einpresswire.com/article/904125458/electroninks-to-showcase-advanced-metallization-solutions-at-productronica-india-2026

The post Electroninks to Showcase Advanced Metallization Solutions at Productronica India 2026 appeared first on Electroninks.

The poster, titled: “A Breakthrough in Advanced Packaging: The Total Low-Temperature Silver Metal Complex Ink Full-Suite Materials Platform for EMI Shielding in SiP” will be presented by Jessica Lin on Wednesday, March 4, from 5:30–7:30 PM on the Akimel Lawn.

Addressing a Growing Packaging Bottleneck

As semiconductor devices continue to scale in complexity, integrating RF modules, sensors, AI accelerators, power management, and memory into increasingly dense SiP architectures, shielding and thermal budgets have become one of the most limiting constraints in advanced packaging. Traditional EMI shielding approaches often rely on high-temperature processes or materials that introduce mechanical stress, warpage risk, or integration complexity. These constraints are increasingly incompatible with:

* Heterogeneous integration

* Organic substrates and advanced laminates

* Temperature-sensitive components

* High-frequency automotive and AI applications

Electroninks’ total silver metal complex ink platform directly addresses this challenge by enabling high-conductivity EMI shielding at processing temperatures compatible with advanced substrates and thermally sensitive device stacks.

A Full-Suite Materials Platform — On a Single Tool

MOD Silver Inks have met the majority of performance and reliability specs for advanced packaging. However, they will sometimes tarnish over time. To address this, EI has developed anti-tarnish chemistry and technology. This platform represents a complete materials ecosystem engineered for integration into modern advanced packaging workflows.

The poster will demonstrate:

* Ultra-low temperature processing compatibility: Enabling EMI shielding without exceeding the thermal thresholds of next-generation SiP designs.

* High conductivity performance: Achieving metallic performance levels required for high-frequency EMI suppression.

* A full-suite materials platform approach: Designed for compatibility across substrates, deposition methods, and packaging configurations.

* Scalable integration for manufacturing: Supporting additive and hybrid manufacturing approaches aligned with evolving semiconductor packaging roadmaps.

This holistic approach allows advanced packaging engineers to rethink EMI shielding as an integrated materials solution rather than a secondary, high-temperature add-on step.

Why This Matters Now

Advanced packaging has become a primary driver of semiconductor innovation, particularly as Moore’s Law scaling slows and heterogeneous integration accelerates. According to industry roadmaps from IMAPS and leading semiconductor consortia, SiP architectures are central to enabling:

* AI edge devices

* Automotive electronics and ADAS

* 5G/6G RF modules

* Power-dense industrial systems

However, EMI performance at higher frequencies—especially in tightly integrated modules—remains a growing technical hurdle.

Electroninks’ low-temperature silver metal complex chemistry provides a path forward by decoupling EMI performance from high thermal budgets. This is particularly relevant for:

* Automotive-grade electronics

* Fine-pitch advanced substrates

* Panel-level packaging

* Emerging heterogeneous chiplet designs

For more information on Electroninks products and solutions, please visit www.electroninks.com

Poster Session: Wednesday, March 4 | 5:30–7:30 PM | Akimel Lawn
Location: Sheraton Grand at Wild Horse Pass
Event: IMAPS Device Packaging Conference

Full release: https://www.einpresswire.com/article/895587437/electroninks-to-present-industry-leading-silver-metal-complex-product-suite-platform-for-emi-shielding-at-imaps-dpc-2026

The post Electroninks to Present Industry-Leading Silver Metal Complex Product Suite Platform for EMI Shielding at IMAPS DPC 2026 appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, January 12, 2026 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today released its annual outlook of top trends to impact the industry, Electroninks 2026: The Top Additive Manufacturing Trends to Watch. The trends identify the next major inflection points in additive manufacturing, where organizations shift from legacy implementation to executing on new insights with cost efficiency, competitive advantages and advanced workflows at the core.

The following predictions come from Electroninks top executives and thought leaders, Brett Walker (CEO and Co-founder), Melbs LeMieux (President and Co-founder), Takashi Mochizuki (Head of Sales and Business Development), Kazutaka Ozawa (Technical Director):

1. Metal–Organic Decomposition (MOD) Inks Become a Standard Metallization Pathway
2026 will mark the first year that MOD inks transition from early-stage adoption to mainstream qualification across chip packaging lines. As fabs seek lower-temperature processes, higher reliability, and faster cycle times, particle-free printable metals will emerge as a de facto choice for backside metallization, EMI shielding, and RDL repair applications.

2. Backside Metallization (BSM) Moves to Additive-First Workflows
The rapid rise of AI accelerators and multi-die GPU architectures is pushing BSM requirements beyond the capabilities of traditional vacuum deposition tools. Additive alternatives enable faster throughput, high-aspect-ratio coverage, and better thermal conduction. In 2026, several major OSATs are expected to shift at least one production line to additive metallization.

3. Materials Equipment Co-development Becomes Industry Standard
The industry will increasingly adopt a collaborative model where materials suppliers and toolmakers co-engineer integrated solutions. This is expected to produce purpose-built additive metallization systems optimized for reliability, speed, and fully digital deposition. These vertically aligned solutions will accelerate qualification cycles and improve scalability.

4. Hybrid Packaging Architectures Drive Demand for Multi-Material Workflows
With chiplets, 2.5D interposers, and 3D stacked architectures reaching commercial scale, 2026 will usher in greater demand for materials that work seamlessly together. Printable metals, curable dielectrics, underfills, and thermal interface materials will need to integrate into unified, digitally programmable workflows that support rapid prototyping and high-mix production environments.

5. Power and Water Reduction Becomes a Global Priority as AI Data Centers Drive Infrastructure Strain
A surge in AI-dedicated data centers will create unprecedented demand for power and cooling, pushing utilities and hyperscalers into crisis-level resource constraints. In 2026, semiconductor companies will face urgent pressure to reduce energy and water use across material deposition, curing, and packaging processes. Additive metallization will gain accelerated momentum due to its ability to:

• Eliminate energy-intensive, wasteful metallization processes, especially for large area panels.
• Reduce water use by cutting out chemical etching steps.
• Lower total carbon footprint across packaging lines.

Governments and enterprise customers will reward suppliers that enable more sustainable semiconductor scaling, especially as AI workloads continue to multiply.

6. Metal-Complex Silver Inks: A New Cost-Stability Lever in a Volatile Silver Market
Record and multi-year-high silver prices are forcing every electronics and semiconductor manufacturer to rethink how much precious metal they really need in their processes. Traditional conductive materials have long depended on heavy silver loading to hit performance targets. Today, that approach is colliding with commodity volatility, budget pressure, and growing scrutiny on material efficiency.

The post Electroninks Showcases Top Industry Predictions for 2026 appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, December 19, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the expanding industry adoption of its metal-complex silver formulations due to global silver prices climbing to multi-year highs. The company’s proprietary chemistry enables higher conductivity per gram, lower total silver loading, and improved manufacturing efficiency compared to traditional particulate, flake, or bulk silver materials.

Electroninks’ metal-complex silver platform has emerged as a strategic solution for sectors facing escalating materials costs, including semiconductor packaging, consumer electronics, automotive electronics, aerospace, and advanced additive manufacturing. While traditional silver inks and pastes depend on heavy metal loading to achieve conductive performance, Electroninks’ metal-complex silver technology takes a fundamentally different approach, leveraging engineered molecular and nanoscale architectures that create more accessible and uniformly dispersed active silver species.

This structural design forms highly efficient conductive pathways, enabling:

* Higher conductivity per unit of silver

* Equal or greater electrical performance at significantly lower silver loading

* Reduced exposure to volatile precious-metal markets

As conventional silver prices surge, these efficiency gains translate directly into lower material consumption and more stable long-term cost structures for manufacturers. The company’s formulations allow for lower sintering temperatures, more robust substrate compatibility, and improved reproducibility in complex manufacturing environments. These capabilities are particularly valuable as the semiconductor and electronics packaging sectors continue shifting toward thinner substrates, higher data densities, and rapid production cycles.

As silver markets experience sustained volatility and rising spot prices, manufacturers are increasingly reevaluating raw material strategies. Metal-complex silver offers a resilient pathway forward with significant strategic benefits:

* Lower bill of materials (BOM) due to decreased precious-metal usage

* Equal or superior performance relative to traditional silver inks and pastes

* Ability to domestically or near-shore production to strengthen supply chain security

* Reduced environmental impact through lower lifetime silver consumption

* Lower amount/burden for recycling silver materials, ingots

“Every manufacturer working with conductive materials is feeling the pressure of today’s silver market,” said Dhaval Patel, chief financial officer of Electroninks. “Our metal-complex silver platform gives customers a way to maintain or improve performance while using dramatically less silver. It is a material innovation that is aligned with both the economic realities of the moment and the long-term direction of the industry.”

Electroninks’ metal-complex platform supports the industry’s transition toward higher performance, reduced waste, and more secure supply chains. As electronic systems grow more complex and data-rich, conductive materials must deliver elevated reliability and tighter process control while remaining economically viable.

The company continues to partner with leading OEMs, semiconductor manufacturers, and materials suppliers to scale its formulations into high-volume production environments.

Full release: https://www.einpresswire.com/article/876848711/electroninks-announces-high-performance-metal-complex-silver-as-a-cost-efficient-solution-amid-high-global-silver-prices

The post Electroninks Announces High-Performance Metal-Complex Silver as a Cost-Efficient Solution Amid High Global Silver Prices appeared first on Electroninks.

AUSTIN, TX – December 1, 2025 – Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today unveiled its next-generation EMI shielding solution, setting a new standard for cost, performance and reliability in advanced semiconductor packaging. Notably, the new Electroninks process involves smaller tooling footprint, and boasts a greater than 99 percent reduction in power and water use compared to conventional PVD and e-less metallization, also making it the most sustainable solution on the market.

The solution is based on the company’s revolutionary EI-1200 ink series technology, which is engineered to directly metalize molding compounds, silicon and other relevant substrates in various packaging formats including package level, die-level, and wafer level. However, the major advancements come from the addition of a recon-free process. 

Electroninks’s MOD spray process offers major advancements in EMI shielding by enabling uniform sidewall coverage with aspect ratios approaching 100% for a standard 2mm spacing and the process can do recon-free (which depending on spacing and test vehicle design) can achieve up to 70 percent coverage. In both cases, a feat that traditional processes struggle to match. Critically, the ability to achieve sidewall coverage in such geometries enables manufacturers to eliminate the wafer dicing and reconstitution steps that are typically required to achieve sufficient spacing for traditional sputtered films. By bypassing these stages, Electroninks’s MOD process not only simplifies the overall packaging workflow but also boosts production throughput and reduces handling-related defects.

Silver is widely used in EMI shielding due to its excellent conductivity and high-frequency attenuation capabilities. However, it can be susceptible to surface sulfurization that can alter the film’s appearance when exposed to certain environmental conditions such as elevated temperatures, specific air qualities, or high-humidity tests like uHAST. While this tarnish is purely cosmetic and doesn’t affect conductivity or shielding effectiveness, visible discoloration can erode customer trust, raise quality concerns in manufacturing and inspection, and create uncertainty for long-term reliability. Electroninks has worked with customers to develop solutions, such as the modification of its product chemistry or the addition of a black or clear overcoat, to completely eliminate this hurdle. When combined with the recon-free process, this creates the industry’s most advanced EMI shielding solution. 

“The semiconductor packaging industry has long relied on sputtered EMI shielding layers, despite their cost and complexity,” said Brett Walker, CEO of Electroninks. “With EI-1207, we’re proving that MOD-based spray coating is not just viable; it’s technically superior, lower cost, more sustainable, and ready for high-volume adoption worldwide.”

At the core of EI-1207’s innovation is Electroninks’s proprietary MOD ink chemistry, a true solution, not a particle suspension, which enables superior film uniformity, low-temperature curing, and stable spray coating with no reconstitution required. The platform is already in use by leading OSATs, with production tool installations underway in both Korea and Taiwan.

Key technical advantages over traditional coating processes include:

• Up to 100% sidewall aspect ratio (vs. ~40% with PVD), eliminating the need for wafer dicing and reconstitution.
• Fully compatible with ultrasonic and pneumatic spray heads, enabling seamless integration into standard production lines.
• Simple thermal cure at 160°C, with tack-dry build-up during spraying—no complex vacuum equipment or multi-step sputtering required.
• Multi-head spray systems allow for higher throughput.

For the semiconductor industry, where throughput, yield, and sustainability are paramount, EI-1207 delivers tangible benefits:

• >99% reduction in power and water use compared to PVD.
• Up to 50% lower cost per package, based on third-party modeling by Savansys.
• Small equipment footprint allows for 8 spray coaters in the same floorspace as one PVD system.
• Higher throughput via parallel spray heads, easily scaling production volume.
• Material efficiency gains through optimized spray parameters that reduce silver waste—critical as silver remains the highest-cost input.

“From an engineering standpoint, EI-1200 series is a leap forward because it solves two of the biggest EMI shielding pain points in one stroke, uniform coverage and process complexity,” stated Sima Hannani, product director for Electroninks. “Improvements like achieving near-100 percent sidewall coverage or circumventing dicing and reconstitution steps aren’t just yield boosters; they fundamentally change how lines can be designed and run. Add to that a greater than 99 percent reduction in power and water usage, and you have a process that’s not only more precise, but also inherently more sustainable. This is the kind of advancement that makes high-volume adoption inevitable.”

By replacing capital-intensive and energy-hungry sputtering lines, EI-1207 positions Electroninks’ customers to meet the performance and sustainability demands of 5G, RF-FEM, and SiP applications—without compromising shielding effectiveness. Testing confirms 60dB (1.2μm) to 80dB (3μm) shielding across 1–40GHz, with >30dB from 1MHz–1GHz.

For more information on Electroninks’ expanded portfolio and technical capabilities, visit www.electroninks.com.

Press release link: https://www.einpresswire.com/article/870498095/electroninks-leads-industry-with-total-emi-shielding-solutions-including-recon-free-process

The post Electroninks Leads Industry with Total EMI Shielding Solutions Including Recon-Free Process appeared first on Electroninks.

“Copper conductive inks are more than a cost advantage – they represent a shift toward scalable, energy-efficient production models that enable new form factors and open the door to entirely new design paradigms,” stated Mr. Ozawa. “This transformation not only lowers barriers for advanced semiconductor packaging but also redefines how manufacturers think about next-generation electronics.”

In this presentation, Mr. Ozawa will showcase how copper-based conductive inks aim to unlock new levels of design freedom, functionality, and capital expenditure (CAPEX) efficiency through additive manufacturing, without compromising the performance or reliability required by advanced packaging applications. Traditional copper metallization methods, including deposition and electroless plating, remain industry standards but involve complex, multi-step processes that rely on vacuum chambers, high temperatures, and chemical treatments. These methods face technical, functional, and economic limitations, including restricted panel sizes, high energy consumption, material waste, and costly equipment footprints. In contrast, copper conductive inks offer a streamlined, cost-effective, and scalable solution.

“The next wave of innovation in advanced packaging will come from materials and processes that allow design freedom to address AI-related technology packaging and manufacturing,” stated Melbs LeMieux, co-founder and president of Electroninks. “By enabling unprecedented flexibility, these advances will unlock new levels of performance, efficiency, and scalability critical to meeting the demands of next-generation AI systems.”

Full release: https://www.einpresswire.com/article/851843114/electroninks-to-present-at-imaps-san-diego-2025

The post Electroninks to Present at IMAPS San Diego 2025 appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, August 13, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing. This partnership strengthens Electroninks’ presence in North America while enhancing customer access to its MOD inks across key industries, including aerospace, defense, automotive, and high-tech manufacturing.

Electroninks has successfully commercialized market-ready gold, silver, and platinum-based materials designed for inkjet, screen, and aerosol jet printing. These advanced materials are widely used across OEM design, commercial product development, and government research, reflecting growing demand for high-performance, additive manufacturing-ready inks. The decision to partner with Insulectro was driven by its robust customer engagement capabilities and proven ability to support early-stage design and OEM pathfinding programs, including the DoD.

“At Electroninks, we really value this relationship with Insulectro, which is a trusted, respected, and highly knowledgeable name with our customers and market. This relationship supports our advanced metallization products and overall critical materials supply chain initiatives with our customers here in North America,” said Melbs LeMieux, president and co-founder at Electroninks.
Insulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, is excited to include Electroninks, Inc. in its portfolio of best-in-class products.

Patrick Redfern, Insulectro president and chief executive officer, commented, “I can’t wait for the people building UHDI to see what this stuff can do. MOD is magic and has the potential to replace the costly electroless process. This is a strategic move to support the companies in North America that are investing in additive and chip packaging technologies. America needs these companies to be successful!”

Insulectro’s North American footprint, with eleven stocking locations in the U.S. and Canada, ensures just-in-time delivery and inventory reliability for specialty manufacturing customers. The company’s deep technical expertise, hands-on support, and long-standing relationships with top-tier military, aerospace, and automotive manufacturers make Insulectro ideally positioned to support the introduction of new material technologies into high-performance applications.

Additionally, Insulectro’s strong supply infrastructure offers a strategic advantage in minimizing supply chain risk and avoiding international tariff implications, which is increasingly important for U.S.-based innovation programs and contract manufacturers.

“This partnership is a natural fit,” Dhaval Patel, chief financial officer at Electroninks, added. “Insulectro’s extensive network and application engineering capabilities allow us to better support customers at the design and prototyping stages—accelerating time to market for next-generation devices.”

Insulectro’s Redfern concluded, “Insulectro’s portfolio of materials is defined by bedrock products that are proven high performers, and our customers count on every day. And, our pioneering spirit, that Insulectro was built on, is always scanning for emerging technologies that will enable our customers to expand their capabilities.”

For more information on Electroninks’ expanded portfolio and technical capabilities, visit www.electroninks.com.

Find a complete viewing of Insulectro’s products and services at www.insulectro.com.

The post Insulectro and Electroninks Sign North American Distribution Agreement appeared first on Electroninks.

The interactive class, titled Semiconductor Sparks: Unleashing Young Talent through Circuit Scribe is designed to equip participants with real-world STEM skills that are directly aligned with evolving industry needs. Open to students, the course focuses on learning the basics of circuits and create innovative projects using its unique modules. Circuit Scribe allows you to create your own circuits, by drawing them on paper, using its proprietary silver conductive ink pen. Circuit Scribe recently debuted Circuit Scribe Stickers which can power sticker components like motors, buzzers, switches and blinkers.

“At Circuit Scribe, we believe that building a strong STEM workforce begins with accessible, hands-on education,” said Ana Medrano, Chief of Staff. “By leading this class at SEMICON Taiwan, we’re helping to bridge the gap between education and employment, and empowering individuals with the skills they need to thrive in the modern world.”

The class is part of SEMICON Taiwan Work Force Development Pavillion’s focus on innovation, inclusion, and future-ready talent. Circuit Scribe’s involvement highlights its ongoing commitment to community engagement, workforce development, and diversity in STEM fields.

All of the products mentioned are available for purchase on www.CircuitScribe.com

The post Electroninks’ Owned Circuit Scribe To Lead STEM Workforce Development Class at SEMICON Taiwan 2025 appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, August 4, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced that Merck KGaA, Darmstadt, Germany and Electroninks expanded on the companies’ strategic collaboration to now develop and introduce an innovative Backside Metallization (BSM) solution tailored for advanced semiconductor packaging. This new deal expands on the existing collaboration for Electroninks’ cost-efficient and highly effective EMI shielding solution. The new, next-generation BSM technology announced today offers a highly elegant solution to traditional sputtering and plating processes, addressing the reliability, warpage, and increasing thermal management challenges in hybrid bonding, wafer and Panel Level Packaging (PLP) metallization.

As AI chips and high-performance computing devices continue to push the limits of processing power, thermal density has risen significantly, making efficient heat dissipation more critical than ever. Reliable bonding between semiconductor packages and Thermal Interface Materials (TIM) is essential for effective heat transfer. However, conventional BSM methods—such as sputtering and plating—pose challenges related to cost, equipment requirements, scaling at larger panels, and environmental impact.

By leveraging Merck KGaA, Darmstadt, Germany’s expertise in semiconductor coating processes and Electroninks’ Metal-Organic Decomposition (MOD) Ink technology, this collaboration aims to redefine the standards for BSM in advanced semiconductor packaging.

Key Features and Benefits of the New BSM Solution:

1) High-Uniformity Backside Metallization with Reliable TIM Compatibility

– Merck KGaA, Darmstadt, Germany and Electroninks have advanced spin-coating techniques to enable uniform metal layer formation, even on large-area WLP and PLP substrates.

– The solution ensures high-reliability bonding with TIM and solder materials for optimized heat dissipation.

2) Environmental and Production Efficiency Benefits Over Traditional Methods

– Eliminates the need for large-footprint vacuum equipment, improving manufacturing scalability.

– MOD Ink significantly reduces waste liquid disposal compared to conventional wet processes, aligning with lean manufacturing goals.

3) Enhanced Thermal Management for Next-Generation Devices

– MOD Ink technology provides excellent compatibility with various interface materials, eliminating the need for multi-layer BSM structures (such as Au/Ni-alloy/Ti).

– Ensures superior thermal conductivity and reliability necessary for supporting the high-performance needs and size of AI and computing devices.

Merck KGaA, Darmstadt, Germany and Electroninks remain committed to advancing their strategy and commercial offerings in advanced packaging. With the commercialization of this pioneering BSM technology, which is now underway at customer sites globally, they aim to contribute to the advancement of high-efficiency, more sustainable semiconductor packaging solutions on silicon wafer, as well as panel-level processing where limited solutions exist today.

The companies plan to develop and market this technology together to customers in the near future, with on-site technical support in the US and APAC.

For more information on Electroninks’ expanded portfolio and technical capabilities, visit www.electroninks.com.

Read the full release here: https://www.einpresswire.com/article/836255554/merck-kgaa-darmstadt-germany-and-electroninks-partner-for-next-gen-bsm-solutions-in-advanced-semiconductor-packaging

The post Merck KGaA, Darmstadt, Germany and Electroninks Partner for Next-Gen BSM Solutions in Advanced Semiconductor Packaging appeared first on Electroninks.

AUSTIN, TX, UNITED STATES, June 16, 2025 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced that The University of Texas at Austin has selected Electroninks as the exclusive supplier for the core enabling materials technology for its work under the Defense Advanced Research Projects Agency (DARPA) Additive Manufacturing of MicrosystEms (AMME) program. The initiative aims to revolutionize the production of 3D non-planar microsystems by developing new materials and additive manufacturing technologies. Its goal is to demonstrate a high-throughput process that integrates multiple materials – such as conductors and insulators – within a single structure, enabling complex designs beyond what’s possible with conventional methods.

As part of AMME, UT Austin’s Department of Mechanical Engineering is working alongside a number of industry leaders and academic institutions to drive breakthrough innovations in advanced semiconductor packaging. Electroninks, a key technology provider in the project, will supply critical materials necessary for AMME’s new 3D interconnection techniques. By developing innovative conductive materials optimized for high-speed, large-area lithographic patterning, Electroninks’ contributions will help overcome fundamental limitations in current semiconductor packaging processes.

AMME seeks to transform microsystem manufacturing by pioneering advancements in high-speed, high-volume, and high-resolution multi-material production. This cutting-edge additive manufacturing process will enhance commercial devices with next-generation integrated technologies while enabling rapid adaptability to evolving mission requirements—much like additive manufacturing has revolutionized complex prototyping. Through AMME, DARPA aims to break through the inherent limitations of traditional microsystem fabrication, unlocking new possibilities for innovation and scalability.

Electoninks’ metal complex inks will specifically be used to significantly increase data transfer rates and dramatically lower energy consumption of technology platforms. These advanced inks will streamline semiconductor fabrication, boosting yields, improving design flexibility for 3D packages, and cutting packaging time from months to hours. These inks also allow dies to be packaged closer together, meaning electrons travel smaller and shorter distances, increasing transfer speeds and reducing energy consumed. The implications are significant when considering that a single AI data center by 2035 will require several gigawatts, which is the output of an entire nuclear power plant; even a five percent reduction in energy consumption would equal that of building a modern coal power plant.

“AMME represents a significant step forward in semiconductor technology, addressing critical challenges in AI hardware and advanced packaging,” said Professor Michael Cullinan. “By integrating cutting-edge materials with state-of-the-art holographic lithography, we aim to drive new levels of efficiency and capability in semiconductor manufacturing.”

DARPA’s investment underscores the strategic importance of advancing next-generation 3D integration technologies to maintain U.S. leadership in semiconductor innovation and defense-related applications. The collaboration between academia, industry, and government-backed research institutions will help accelerate the commercialization of advanced manufacturing techniques critical to the future of high-performance computing and artificial intelligence-driven applications.

“We are obviously poised to be a significant partner for this consortium and play a key role in fulfilling DARPA’s goals,” stated Brett Walker, PhD, co-founder and CEO of Electroninks. “This is great news for the State of Texas, innovation and the future of technology.”

Full Release found here: https://www.einpresswire.com/article/822503507/electroninks-chosen-as-key-materials-supplier-for-darpa-amme-program-at-the-university-of-texas-at-austin

The post Electroninks Chosen as Key Materials Supplier for DARPA AMME Program at The University of Texas at Austin appeared first on Electroninks.