Advanced metal-complex silver technology delivers higher conductivity with dramatically lower silver loading to counter rising commodity prices
AUSTIN, TX, UNITED STATES, December 19, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the expanding industry adoption of its metal-complex silver formulations due to global silver prices climbing to multi-year highs. The company’s proprietary chemistry enables higher conductivity per gram, lower total silver loading, and improved manufacturing efficiency compared to traditional particulate, flake, or bulk silver materials.
Electroninks’ metal-complex silver platform has emerged as a strategic solution for sectors facing escalating materials costs, including semiconductor packaging, consumer electronics, automotive electronics, aerospace, and advanced additive manufacturing. While traditional silver inks and pastes depend on heavy metal loading to achieve conductive performance, Electroninks’ metal-complex silver technology takes a fundamentally different approach, leveraging engineered molecular and nanoscale architectures that create more accessible and uniformly dispersed active silver species.
This structural design forms highly efficient conductive pathways, enabling:
* Higher conductivity per unit of silver
* Equal or greater electrical performance at significantly lower silver loading
* Reduced exposure to volatile precious-metal markets
As conventional silver prices surge, these efficiency gains translate directly into lower material consumption and more stable long-term cost structures for manufacturers. The company’s formulations allow for lower sintering temperatures, more robust substrate compatibility, and improved reproducibility in complex manufacturing environments. These capabilities are particularly valuable as the semiconductor and electronics packaging sectors continue shifting toward thinner substrates, higher data densities, and rapid production cycles.
As silver markets experience sustained volatility and rising spot prices, manufacturers are increasingly reevaluating raw material strategies. Metal-complex silver offers a resilient pathway forward with significant strategic benefits:
* Lower bill of materials (BOM) due to decreased precious-metal usage
* Equal or superior performance relative to traditional silver inks and pastes
* Ability to domestically or near-shore production to strengthen supply chain security
* Reduced environmental impact through lower lifetime silver consumption
* Lower amount/burden for recycling silver materials, ingots
“Every manufacturer working with conductive materials is feeling the pressure of today’s silver market,” said Dhaval Patel, chief financial officer of Electroninks. “Our metal-complex silver platform gives customers a way to maintain or improve performance while using dramatically less silver. It is a material innovation that is aligned with both the economic realities of the moment and the long-term direction of the industry.”
Electroninks’ metal-complex platform supports the industry’s transition toward higher performance, reduced waste, and more secure supply chains. As electronic systems grow more complex and data-rich, conductive materials must deliver elevated reliability and tighter process control while remaining economically viable.
The company continues to partner with leading OEMs, semiconductor manufacturers, and materials suppliers to scale its formulations into high-volume production environments.
Full release: https://www.einpresswire.com/article/876848711/electroninks-announces-high-performance-metal-complex-silver-as-a-cost-efficient-solution-amid-high-global-silver-prices
Recon-free innovation and new advancements in reliability create the industry’s most cost-effective, sustainable and scalable EMI shielding solution
AUSTIN, TX – December 1, 2025 – Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today unveiled its next-generation EMI shielding solution, setting a new standard for cost, performance and reliability in advanced semiconductor packaging. Notably, the new Electroninks process involves smaller tooling footprint, and boasts a greater than 99 percent reduction in power and water use compared to conventional PVD and e-less metallization, also making it the most sustainable solution on the market.
The solution is based on the company’s revolutionary EI-1200 ink series technology, which is engineered to directly metalize molding compounds, silicon and other relevant substrates in various packaging formats including package level, die-level, and wafer level. However, the major advancements come from the addition of a recon-free process.
Electroninks’s MOD spray process offers major advancements in EMI shielding by enabling uniform sidewall coverage with aspect ratios approaching 100% for a standard 2mm spacing and the process can do recon-free (which depending on spacing and test vehicle design) can achieve up to 70 percent coverage. In both cases, a feat that traditional processes struggle to match. Critically, the ability to achieve sidewall coverage in such geometries enables manufacturers to eliminate the wafer dicing and reconstitution steps that are typically required to achieve sufficient spacing for traditional sputtered films. By bypassing these stages, Electroninks’s MOD process not only simplifies the overall packaging workflow but also boosts production throughput and reduces handling-related defects.
Silver is widely used in EMI shielding due to its excellent conductivity and high-frequency attenuation capabilities. However, it can be susceptible to surface sulfurization that can alter the film’s appearance when exposed to certain environmental conditions such as elevated temperatures, specific air qualities, or high-humidity tests like uHAST. While this tarnish is purely cosmetic and doesn’t affect conductivity or shielding effectiveness, visible discoloration can erode customer trust, raise quality concerns in manufacturing and inspection, and create uncertainty for long-term reliability. Electroninks has worked with customers to develop solutions, such as the modification of its product chemistry or the addition of a black or clear overcoat, to completely eliminate this hurdle. When combined with the recon-free process, this creates the industry’s most advanced EMI shielding solution.
“The semiconductor packaging industry has long relied on sputtered EMI shielding layers, despite their cost and complexity,” said Brett Walker, CEO of Electroninks. “With EI-1207, we’re proving that MOD-based spray coating is not just viable; it’s technically superior, lower cost, more sustainable, and ready for high-volume adoption worldwide.”
At the core of EI-1207’s innovation is Electroninks’s proprietary MOD ink chemistry, a true solution, not a particle suspension, which enables superior film uniformity, low-temperature curing, and stable spray coating with no reconstitution required. The platform is already in use by leading OSATs, with production tool installations underway in both Korea and Taiwan.
Key technical advantages over traditional coating processes include:
For the semiconductor industry, where throughput, yield, and sustainability are paramount, EI-1207 delivers tangible benefits:
“From an engineering standpoint, EI-1200 series is a leap forward because it solves two of the biggest EMI shielding pain points in one stroke, uniform coverage and process complexity,” stated Sima Hannani, product director for Electroninks. “Improvements like achieving near-100 percent sidewall coverage or circumventing dicing and reconstitution steps aren’t just yield boosters; they fundamentally change how lines can be designed and run. Add to that a greater than 99 percent reduction in power and water usage, and you have a process that’s not only more precise, but also inherently more sustainable. This is the kind of advancement that makes high-volume adoption inevitable.”
By replacing capital-intensive and energy-hungry sputtering lines, EI-1207 positions Electroninks’ customers to meet the performance and sustainability demands of 5G, RF-FEM, and SiP applications—without compromising shielding effectiveness. Testing confirms 60dB (1.2μm) to 80dB (3μm) shielding across 1–40GHz, with >30dB from 1MHz–1GHz.
For more information on Electroninks’ expanded portfolio and technical capabilities, visit www.electroninks.com.
Press release link: https://www.einpresswire.com/article/870498095/electroninks-leads-industry-with-total-emi-shielding-solutions-including-recon-free-process
AUSTIN, TX, UNITED STATES, September 24, 2025 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced that Kazutaka Ozawa, global technology manager at Electroninks, will present at IMAPS San Diego 2025, which will be held from September 29th through October 2nd. Mr. Ozawa will present the WPM6 – Additive Manufacturing session, “Copper Metal Organic Decomposition (MOD) Inks and Films for Semiconductor Packaging Applications” on Wednesday, October 1st at 1:30-3PM PT. The talk will focus on how copper-based conductive inks are emerging as a compelling complement to traditional copper metallization techniques in semiconductor packaging. Electroninks will be at booth #802 for the entirety of the show with company executives available to speak in more detail about the company’s copper MOD products.
“Copper conductive inks are more than a cost advantage – they represent a shift toward scalable, energy-efficient production models that enable new form factors and open the door to entirely new design paradigms,” stated Mr. Ozawa. “This transformation not only lowers barriers for advanced semiconductor packaging but also redefines how manufacturers think about next-generation electronics.”
In this presentation, Mr. Ozawa will showcase how copper-based conductive inks aim to unlock new levels of design freedom, functionality, and capital expenditure (CAPEX) efficiency through additive manufacturing, without compromising the performance or reliability required by advanced packaging applications. Traditional copper metallization methods, including deposition and electroless plating, remain industry standards but involve complex, multi-step processes that rely on vacuum chambers, high temperatures, and chemical treatments. These methods face technical, functional, and economic limitations, including restricted panel sizes, high energy consumption, material waste, and costly equipment footprints. In contrast, copper conductive inks offer a streamlined, cost-effective, and scalable solution.
“The next wave of innovation in advanced packaging will come from materials and processes that allow design freedom to address AI-related technology packaging and manufacturing,” stated Melbs LeMieux, co-founder and president of Electroninks. “By enabling unprecedented flexibility, these advances will unlock new levels of performance, efficiency, and scalability critical to meeting the demands of next-generation AI systems.”
Full release: https://www.einpresswire.com/article/851843114/electroninks-to-present-at-imaps-san-diego-2025
The alignment further expands Electroninks’ North American presence in the additive electronics market and increases advanced packaging onshoring efforts
AUSTIN, TX, UNITED STATES, August 13, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing. This partnership strengthens Electroninks’ presence in North America while enhancing customer access to its MOD inks across key industries, including aerospace, defense, automotive, and high-tech manufacturing.
Electroninks has successfully commercialized market-ready gold, silver, and platinum-based materials designed for inkjet, screen, and aerosol jet printing. These advanced materials are widely used across OEM design, commercial product development, and government research, reflecting growing demand for high-performance, additive manufacturing-ready inks. The decision to partner with Insulectro was driven by its robust customer engagement capabilities and proven ability to support early-stage design and OEM pathfinding programs, including the DoD.
“At Electroninks, we really value this relationship with Insulectro, which is a trusted, respected, and highly knowledgeable name with our customers and market. This relationship supports our advanced metallization products and overall critical materials supply chain initiatives with our customers here in North America,” said Melbs LeMieux, president and co-founder at Electroninks.
Insulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, is excited to include Electroninks, Inc. in its portfolio of best-in-class products.
Patrick Redfern, Insulectro president and chief executive officer, commented, “I can’t wait for the people building UHDI to see what this stuff can do. MOD is magic and has the potential to replace the costly electroless process. This is a strategic move to support the companies in North America that are investing in additive and chip packaging technologies. America needs these companies to be successful!”
Insulectro’s North American footprint, with eleven stocking locations in the U.S. and Canada, ensures just-in-time delivery and inventory reliability for specialty manufacturing customers. The company’s deep technical expertise, hands-on support, and long-standing relationships with top-tier military, aerospace, and automotive manufacturers make Insulectro ideally positioned to support the introduction of new material technologies into high-performance applications.
Additionally, Insulectro’s strong supply infrastructure offers a strategic advantage in minimizing supply chain risk and avoiding international tariff implications, which is increasingly important for U.S.-based innovation programs and contract manufacturers.
“This partnership is a natural fit,” Dhaval Patel, chief financial officer at Electroninks, added. “Insulectro’s extensive network and application engineering capabilities allow us to better support customers at the design and prototyping stages—accelerating time to market for next-generation devices.”
Insulectro’s Redfern concluded, “Insulectro’s portfolio of materials is defined by bedrock products that are proven high performers, and our customers count on every day. And, our pioneering spirit, that Insulectro was built on, is always scanning for emerging technologies that will enable our customers to expand their capabilities.”
For more information on Electroninks’ expanded portfolio and technical capabilities, visit www.electroninks.com.
Find a complete viewing of Insulectro’s products and services at www.insulectro.com.
AUSTIN, TX – [DATE], 2025 – Electroninks’ owned Circuit Scribe, a leader in Innovative STEM education products, is proud to announce its role in leading a hands-on STEM class at this year’s SEMICON Taiwan taking place on September 10 – 12, 2025 at SEMICON Taiwan, WFD Pavilion. The session is part of a broader initiative to strengthen workforce development and build the next generation of skilled professionals in science, technology, engineering, and mathematics (STEM).
The interactive class, titled Semiconductor Sparks: Unleashing Young Talent through Circuit Scribe is designed to equip participants with real-world STEM skills that are directly aligned with evolving industry needs. Open to students, the course focuses on learning the basics of circuits and create innovative projects using its unique modules. Circuit Scribe allows you to create your own circuits, by drawing them on paper, using its proprietary silver conductive ink pen. Circuit Scribe recently debuted Circuit Scribe Stickers which can power sticker components like motors, buzzers, switches and blinkers.
“At Circuit Scribe, we believe that building a strong STEM workforce begins with accessible, hands-on education,” said Ana Medrano, Chief of Staff. “By leading this class at SEMICON Taiwan, we’re helping to bridge the gap between education and employment, and empowering individuals with the skills they need to thrive in the modern world.”
The class is part of SEMICON Taiwan Work Force Development Pavillion’s focus on innovation, inclusion, and future-ready talent. Circuit Scribe’s involvement highlights its ongoing commitment to community engagement, workforce development, and diversity in STEM fields.
All of the products mentioned are available for purchase on www.CircuitScribe.com
Product will address the industry’s thermal management challenges on both wafer and large panels
AUSTIN, TX, UNITED STATES, August 4, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced that Merck KGaA, Darmstadt, Germany and Electroninks expanded on the companies’ strategic collaboration to now develop and introduce an innovative Backside Metallization (BSM) solution tailored for advanced semiconductor packaging. This new deal expands on the existing collaboration for Electroninks’ cost-efficient and highly effective EMI shielding solution. The new, next-generation BSM technology announced today offers a highly elegant solution to traditional sputtering and plating processes, addressing the reliability, warpage, and increasing thermal management challenges in hybrid bonding, wafer and Panel Level Packaging (PLP) metallization.
As AI chips and high-performance computing devices continue to push the limits of processing power, thermal density has risen significantly, making efficient heat dissipation more critical than ever. Reliable bonding between semiconductor packages and Thermal Interface Materials (TIM) is essential for effective heat transfer. However, conventional BSM methods—such as sputtering and plating—pose challenges related to cost, equipment requirements, scaling at larger panels, and environmental impact.
By leveraging Merck KGaA, Darmstadt, Germany’s expertise in semiconductor coating processes and Electroninks’ Metal-Organic Decomposition (MOD) Ink technology, this collaboration aims to redefine the standards for BSM in advanced semiconductor packaging.
Key Features and Benefits of the New BSM Solution:
1) High-Uniformity Backside Metallization with Reliable TIM Compatibility
– Merck KGaA, Darmstadt, Germany and Electroninks have advanced spin-coating techniques to enable uniform metal layer formation, even on large-area WLP and PLP substrates.
– The solution ensures high-reliability bonding with TIM and solder materials for optimized heat dissipation.
2) Environmental and Production Efficiency Benefits Over Traditional Methods
– Eliminates the need for large-footprint vacuum equipment, improving manufacturing scalability.
– MOD Ink significantly reduces waste liquid disposal compared to conventional wet processes, aligning with lean manufacturing goals.
3) Enhanced Thermal Management for Next-Generation Devices
– MOD Ink technology provides excellent compatibility with various interface materials, eliminating the need for multi-layer BSM structures (such as Au/Ni-alloy/Ti).
– Ensures superior thermal conductivity and reliability necessary for supporting the high-performance needs and size of AI and computing devices.
Merck KGaA, Darmstadt, Germany and Electroninks remain committed to advancing their strategy and commercial offerings in advanced packaging. With the commercialization of this pioneering BSM technology, which is now underway at customer sites globally, they aim to contribute to the advancement of high-efficiency, more sustainable semiconductor packaging solutions on silicon wafer, as well as panel-level processing where limited solutions exist today.
The companies plan to develop and market this technology together to customers in the near future, with on-site technical support in the US and APAC.
For more information on Electroninks’ expanded portfolio and technical capabilities, visit www.electroninks.com.
Read the full release here: https://www.einpresswire.com/article/836255554/merck-kgaa-darmstadt-germany-and-electroninks-partner-for-next-gen-bsm-solutions-in-advanced-semiconductor-packaging
The DARPA program will use Electroninks metal complex inks to advance high-throughput 3D interconnection and RDL technologies
AUSTIN, TX, UNITED STATES, June 16, 2025 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced that The University of Texas at Austin has selected Electroninks as the exclusive supplier for the core enabling materials technology for its work under the Defense Advanced Research Projects Agency (DARPA) Additive Manufacturing of MicrosystEms (AMME) program. The initiative aims to revolutionize the production of 3D non-planar microsystems by developing new materials and additive manufacturing technologies. Its goal is to demonstrate a high-throughput process that integrates multiple materials – such as conductors and insulators – within a single structure, enabling complex designs beyond what’s possible with conventional methods.
As part of AMME, UT Austin’s Department of Mechanical Engineering is working alongside a number of industry leaders and academic institutions to drive breakthrough innovations in advanced semiconductor packaging. Electroninks, a key technology provider in the project, will supply critical materials necessary for AMME’s new 3D interconnection techniques. By developing innovative conductive materials optimized for high-speed, large-area lithographic patterning, Electroninks’ contributions will help overcome fundamental limitations in current semiconductor packaging processes.
AMME seeks to transform microsystem manufacturing by pioneering advancements in high-speed, high-volume, and high-resolution multi-material production. This cutting-edge additive manufacturing process will enhance commercial devices with next-generation integrated technologies while enabling rapid adaptability to evolving mission requirements—much like additive manufacturing has revolutionized complex prototyping. Through AMME, DARPA aims to break through the inherent limitations of traditional microsystem fabrication, unlocking new possibilities for innovation and scalability.
Electoninks’ metal complex inks will specifically be used to significantly increase data transfer rates and dramatically lower energy consumption of technology platforms. These advanced inks will streamline semiconductor fabrication, boosting yields, improving design flexibility for 3D packages, and cutting packaging time from months to hours. These inks also allow dies to be packaged closer together, meaning electrons travel smaller and shorter distances, increasing transfer speeds and reducing energy consumed. The implications are significant when considering that a single AI data center by 2035 will require several gigawatts, which is the output of an entire nuclear power plant; even a five percent reduction in energy consumption would equal that of building a modern coal power plant.
“AMME represents a significant step forward in semiconductor technology, addressing critical challenges in AI hardware and advanced packaging,” said Professor Michael Cullinan. “By integrating cutting-edge materials with state-of-the-art holographic lithography, we aim to drive new levels of efficiency and capability in semiconductor manufacturing.”
DARPA’s investment underscores the strategic importance of advancing next-generation 3D integration technologies to maintain U.S. leadership in semiconductor innovation and defense-related applications. The collaboration between academia, industry, and government-backed research institutions will help accelerate the commercialization of advanced manufacturing techniques critical to the future of high-performance computing and artificial intelligence-driven applications.
“We are obviously poised to be a significant partner for this consortium and play a key role in fulfilling DARPA’s goals,” stated Brett Walker, PhD, co-founder and CEO of Electroninks. “This is great news for the State of Texas, innovation and the future of technology.”
Full Release found here: https://www.einpresswire.com/article/822503507/electroninks-chosen-as-key-materials-supplier-for-darpa-amme-program-at-the-university-of-texas-at-austin
Portfolio of nanoinks bring gold, platinum, silver and dielectrics for additive manufacturing customers in biomedical, defense and other demanding applications
AUSTIN, TX, UNITED STATES, May 19, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced it has officially completed its full acquisition of UTDots products and IP into its portfolio, further expanding its offerings in digital printing for high-performance applications. The acquisition brings fully commercialized, market-ready gold, silver, and platinum-based materials designed for inkjet and aerosol jet printing, strengthening Electroninks’ position in the rapidly evolving additive manufacturing for defense and research markets.
Electroninks can now deliver UTDots products with improved product quality and increased manufacturing capacity. These advancements ensure higher reliability, scalability, and enhanced performance for researchers and manufacturers utilizing digital printing techniques. These new products, now wholly owned by Electroninks, provide the company immediate and easy entry into new product applications, like antennas, EMI shielding, microheaters, and miniaturization – further expanding Electroninks’ market share.
“Integrating UTDots’ premium nanomaterials into our portfolio represents an expansion of ownership in the market for gold and platinum nanomaterials globally, and especially here in the US. It also accelerates our mission to provide the highest quality conductive materials to the market,” said Melbs LeMieux, co-founder and president at Electroninks.
“The integration demonstrates EI’s continued focus on top-line growth as we transition towards commercialization. We see continued broadening of adoption of our technology and products,” added Dhaval Patel, chief financial officer at Electroninks.
Electroninks is now able to serve a broader range of industries and institutions, offering scalable solutions for next-generation electronic applications. Specifically, the UTDots portfolio means 20 new products, including nine gold, two platinum, and nine silver products. The company remains committed to delivering cutting-edge materials that drive innovation in digital printing and beyond.
Leading metal complex conductive inks provider to showcase product line and iSAP process sponsored by Dongjin Semichem
AUSTIN, TX, UNITED STATES, February 18, 2025 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced that the company will exhibit and showcase their metal complex conductive inks at booth D800 during SEMICON KOREA. The Electroninks’ team will be on hand to discuss the next-generation manufacturing technology achieved with particle-free conductive inks at booth D800 from February 19-21, 2025.
The booth discussions will showcase how Electroninks’ metal composite conductive inks achieve up to 90% conductivity of bulk metals in low-temperature processes and are compatible with a wide variety of substrates, allowing them to be used directly as an alternative technology to nanoparticle inks, metal pastes, sputtering, deposition, and plating. The session will also cover the iSAP Process, a groundbreaking concept that complements the existing SAP framework with revolutionary new materials, seamlessly adapting to varying scales, while readily reaching feature sizes as small as one micron easily achievable through available photolithography.
“SEMICON KOREA is about revolutionizing industries and showcasing the next level of innovation,” stated Wanjong Kim, Electroninks Korea Representative. “At Electroninks we are creating the most flexible and cost-effective solutions for advanced semiconductor packaging to advance innovation across industries and change lives globally.”
You can read the full release here – https://www.einpresswire.com/article/787050391/electroninks-to-exhibit-with-dongjin-semichem-at-semicon-korea
Enhancing Lightweight and Cost Efficiency of Defense Components with Conductive Metal Inks
Establishing a foothold in the U.S. market, strengthening global competitiveness through open innovation
LIG Nex1 has entered into a joint research and development agreement with advanced materials company Electroninks (Austin, Texas) to develop next-generation component materials based on conductive inks.
On December 3, LIG Nex1 and Electroninks signed a strategic cooperation memorandum of understanding (MOU) at LIG Nex1’s Pangyo House in Seongnam, South Korea, with key officials from both companies present. This agreement marks the first step in combining LIG Nex1’s cutting-edge defense industry technology with Electroninks’ metal complex particle-free conductive ink technology to innovate electronic materials for the defense sector. The collaboration will focus on jointly developing next-generation component materials based on conductive inks, aimed at reducing the weight and cost of weapon systems.
Electroninks is a global leader in the field of metal complex (particle-free) conductive inks using Metal Organic Decomposition (MOD) technology. The company first developed particle-free silver (Ag) composite conductive ink, and now is the only global supplier of a combined portfolio including silver, gold, platinum, nickel and copper MOD products. The company has grown into a key player in the semiconductor, display, and electromagnetic interference (EMI) shielding markets. The next-generation ink, which uses significantly less material compared to traditional particle-based or paste-type inks with enhanced performance and required reliability properties, is expected to contribute to lightweighting and cost reduction when applied to key components, such as LIG Nex1’s antennas.
Meanwhile, LIG Nex1 acquired approximately 60% of the shares in Ghost Robotics, a leading quadruped robot company in the U.S., in July. In addition, they have been accelerating their entry into the U.S. market by passing the 5th FCT (Foreign Comparative Testing) of the 2.75-inch guided rocket ‘Bigung’ with the U.S. Department of Defense
Shin Ik-hyun, CEO of LIG Nex1, stated, “This collaboration presents a significant opportunity for innovation, not just in the defense industry but also in the advanced electronic materials sector. It marks a pivotal moment for a leading Korean defense company and a next-generation U.S. technology startup to achieve breakthrough innovation.”
Melbs LeMieux, Co-founder and President of Electroninks, commented, “Our partnership with LIG Nex1 will accelerate the commercialization of our conductive ink technology,serve as a key stepping stone for entering the Korean market, and further strengthen the Korea – US Defense cooperation.”
Looking ahead, LIG Nex1 plans to continue its open innovation efforts with global high-tech startups, focusing on acquiring cutting-edge technologies in key future industries, including defense, and positioning itself as a game-changer in these fields.
You can read the full release here: https://n.news.naver.com/article/001/0015081871?sid=104