The alignment further expands Electroninks’ North American presence in the additive electronics market and increases advanced packaging onshoring efforts
AUSTIN, TX, UNITED STATES, August 13, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing. This partnership strengthens Electroninks’ presence in North America while enhancing customer access to its MOD inks across key industries, including aerospace, defense, automotive, and high-tech manufacturing.
Electroninks has successfully commercialized market-ready gold, silver, and platinum-based materials designed for inkjet, screen, and aerosol jet printing. These advanced materials are widely used across OEM design, commercial product development, and government research, reflecting growing demand for high-performance, additive manufacturing-ready inks. The decision to partner with Insulectro was driven by its robust customer engagement capabilities and proven ability to support early-stage design and OEM pathfinding programs, including the DoD.
“At Electroninks, we really value this relationship with Insulectro, which is a trusted, respected, and highly knowledgeable name with our customers and market. This relationship supports our advanced metallization products and overall critical materials supply chain initiatives with our customers here in North America,” said Melbs LeMieux, president and co-founder at Electroninks.
Insulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, is excited to include Electroninks, Inc. in its portfolio of best-in-class products.
Patrick Redfern, Insulectro president and chief executive officer, commented, “I can’t wait for the people building UHDI to see what this stuff can do. MOD is magic and has the potential to replace the costly electroless process. This is a strategic move to support the companies in North America that are investing in additive and chip packaging technologies. America needs these companies to be successful!”
Insulectro’s North American footprint, with eleven stocking locations in the U.S. and Canada, ensures just-in-time delivery and inventory reliability for specialty manufacturing customers. The company’s deep technical expertise, hands-on support, and long-standing relationships with top-tier military, aerospace, and automotive manufacturers make Insulectro ideally positioned to support the introduction of new material technologies into high-performance applications.
Additionally, Insulectro’s strong supply infrastructure offers a strategic advantage in minimizing supply chain risk and avoiding international tariff implications, which is increasingly important for U.S.-based innovation programs and contract manufacturers.
“This partnership is a natural fit,” Dhaval Patel, chief financial officer at Electroninks, added. “Insulectro’s extensive network and application engineering capabilities allow us to better support customers at the design and prototyping stages—accelerating time to market for next-generation devices.”
Insulectro’s Redfern concluded, “Insulectro’s portfolio of materials is defined by bedrock products that are proven high performers, and our customers count on every day. And, our pioneering spirit, that Insulectro was built on, is always scanning for emerging technologies that will enable our customers to expand their capabilities.”
For more information on Electroninks’ expanded portfolio and technical capabilities, visit www.electroninks.com.
Find a complete viewing of Insulectro’s products and services at www.insulectro.com.
AUSTIN, TX – [DATE], 2025 – Electroninks’ owned Circuit Scribe, a leader in Innovative STEM education products, is proud to announce its role in leading a hands-on STEM class at this year’s SEMICON Taiwan taking place on September 10 – 12, 2025 at SEMICON Taiwan, WFD Pavilion. The session is part of a broader initiative to strengthen workforce development and build the next generation of skilled professionals in science, technology, engineering, and mathematics (STEM).
The interactive class, titled Semiconductor Sparks: Unleashing Young Talent through Circuit Scribe is designed to equip participants with real-world STEM skills that are directly aligned with evolving industry needs. Open to students, the course focuses on learning the basics of circuits and create innovative projects using its unique modules. Circuit Scribe allows you to create your own circuits, by drawing them on paper, using its proprietary silver conductive ink pen. Circuit Scribe recently debuted Circuit Scribe Stickers which can power sticker components like motors, buzzers, switches and blinkers.
“At Circuit Scribe, we believe that building a strong STEM workforce begins with accessible, hands-on education,” said Ana Medrano, Chief of Staff. “By leading this class at SEMICON Taiwan, we’re helping to bridge the gap between education and employment, and empowering individuals with the skills they need to thrive in the modern world.”
The class is part of SEMICON Taiwan Work Force Development Pavillion’s focus on innovation, inclusion, and future-ready talent. Circuit Scribe’s involvement highlights its ongoing commitment to community engagement, workforce development, and diversity in STEM fields.
All of the products mentioned are available for purchase on www.CircuitScribe.com
Product will address the industry’s thermal management challenges on both wafer and large panels
AUSTIN, TX, UNITED STATES, August 4, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced that Merck KGaA, Darmstadt, Germany and Electroninks expanded on the companies’ strategic collaboration to now develop and introduce an innovative Backside Metallization (BSM) solution tailored for advanced semiconductor packaging. This new deal expands on the existing collaboration for Electroninks’ cost-efficient and highly effective EMI shielding solution. The new, next-generation BSM technology announced today offers a highly elegant solution to traditional sputtering and plating processes, addressing the reliability, warpage, and increasing thermal management challenges in hybrid bonding, wafer and Panel Level Packaging (PLP) metallization.
As AI chips and high-performance computing devices continue to push the limits of processing power, thermal density has risen significantly, making efficient heat dissipation more critical than ever. Reliable bonding between semiconductor packages and Thermal Interface Materials (TIM) is essential for effective heat transfer. However, conventional BSM methods—such as sputtering and plating—pose challenges related to cost, equipment requirements, scaling at larger panels, and environmental impact.
By leveraging Merck KGaA, Darmstadt, Germany’s expertise in semiconductor coating processes and Electroninks’ Metal-Organic Decomposition (MOD) Ink technology, this collaboration aims to redefine the standards for BSM in advanced semiconductor packaging.
Key Features and Benefits of the New BSM Solution:
1) High-Uniformity Backside Metallization with Reliable TIM Compatibility
– Merck KGaA, Darmstadt, Germany and Electroninks have advanced spin-coating techniques to enable uniform metal layer formation, even on large-area WLP and PLP substrates.
– The solution ensures high-reliability bonding with TIM and solder materials for optimized heat dissipation.
2) Environmental and Production Efficiency Benefits Over Traditional Methods
– Eliminates the need for large-footprint vacuum equipment, improving manufacturing scalability.
– MOD Ink significantly reduces waste liquid disposal compared to conventional wet processes, aligning with lean manufacturing goals.
3) Enhanced Thermal Management for Next-Generation Devices
– MOD Ink technology provides excellent compatibility with various interface materials, eliminating the need for multi-layer BSM structures (such as Au/Ni-alloy/Ti).
– Ensures superior thermal conductivity and reliability necessary for supporting the high-performance needs and size of AI and computing devices.
Merck KGaA, Darmstadt, Germany and Electroninks remain committed to advancing their strategy and commercial offerings in advanced packaging. With the commercialization of this pioneering BSM technology, which is now underway at customer sites globally, they aim to contribute to the advancement of high-efficiency, more sustainable semiconductor packaging solutions on silicon wafer, as well as panel-level processing where limited solutions exist today.
The companies plan to develop and market this technology together to customers in the near future, with on-site technical support in the US and APAC.
For more information on Electroninks’ expanded portfolio and technical capabilities, visit www.electroninks.com.
Read the full release here: https://www.einpresswire.com/article/836255554/merck-kgaa-darmstadt-germany-and-electroninks-partner-for-next-gen-bsm-solutions-in-advanced-semiconductor-packaging
The DARPA program will use Electroninks metal complex inks to advance high-throughput 3D interconnection and RDL technologies
AUSTIN, TX, UNITED STATES, June 16, 2025 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced that The University of Texas at Austin has selected Electroninks as the exclusive supplier for the core enabling materials technology for its work under the Defense Advanced Research Projects Agency (DARPA) Additive Manufacturing of MicrosystEms (AMME) program. The initiative aims to revolutionize the production of 3D non-planar microsystems by developing new materials and additive manufacturing technologies. Its goal is to demonstrate a high-throughput process that integrates multiple materials – such as conductors and insulators – within a single structure, enabling complex designs beyond what’s possible with conventional methods.
As part of AMME, UT Austin’s Department of Mechanical Engineering is working alongside a number of industry leaders and academic institutions to drive breakthrough innovations in advanced semiconductor packaging. Electroninks, a key technology provider in the project, will supply critical materials necessary for AMME’s new 3D interconnection techniques. By developing innovative conductive materials optimized for high-speed, large-area lithographic patterning, Electroninks’ contributions will help overcome fundamental limitations in current semiconductor packaging processes.
AMME seeks to transform microsystem manufacturing by pioneering advancements in high-speed, high-volume, and high-resolution multi-material production. This cutting-edge additive manufacturing process will enhance commercial devices with next-generation integrated technologies while enabling rapid adaptability to evolving mission requirements—much like additive manufacturing has revolutionized complex prototyping. Through AMME, DARPA aims to break through the inherent limitations of traditional microsystem fabrication, unlocking new possibilities for innovation and scalability.
Electoninks’ metal complex inks will specifically be used to significantly increase data transfer rates and dramatically lower energy consumption of technology platforms. These advanced inks will streamline semiconductor fabrication, boosting yields, improving design flexibility for 3D packages, and cutting packaging time from months to hours. These inks also allow dies to be packaged closer together, meaning electrons travel smaller and shorter distances, increasing transfer speeds and reducing energy consumed. The implications are significant when considering that a single AI data center by 2035 will require several gigawatts, which is the output of an entire nuclear power plant; even a five percent reduction in energy consumption would equal that of building a modern coal power plant.
“AMME represents a significant step forward in semiconductor technology, addressing critical challenges in AI hardware and advanced packaging,” said Professor Michael Cullinan. “By integrating cutting-edge materials with state-of-the-art holographic lithography, we aim to drive new levels of efficiency and capability in semiconductor manufacturing.”
DARPA’s investment underscores the strategic importance of advancing next-generation 3D integration technologies to maintain U.S. leadership in semiconductor innovation and defense-related applications. The collaboration between academia, industry, and government-backed research institutions will help accelerate the commercialization of advanced manufacturing techniques critical to the future of high-performance computing and artificial intelligence-driven applications.
“We are obviously poised to be a significant partner for this consortium and play a key role in fulfilling DARPA’s goals,” stated Brett Walker, PhD, co-founder and CEO of Electroninks. “This is great news for the State of Texas, innovation and the future of technology.”
Full Release found here: https://www.einpresswire.com/article/822503507/electroninks-chosen-as-key-materials-supplier-for-darpa-amme-program-at-the-university-of-texas-at-austin
Portfolio of nanoinks bring gold, platinum, silver and dielectrics for additive manufacturing customers in biomedical, defense and other demanding applications
AUSTIN, TX, UNITED STATES, May 19, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced it has officially completed its full acquisition of UTDots products and IP into its portfolio, further expanding its offerings in digital printing for high-performance applications. The acquisition brings fully commercialized, market-ready gold, silver, and platinum-based materials designed for inkjet and aerosol jet printing, strengthening Electroninks’ position in the rapidly evolving additive manufacturing for defense and research markets.
Electroninks can now deliver UTDots products with improved product quality and increased manufacturing capacity. These advancements ensure higher reliability, scalability, and enhanced performance for researchers and manufacturers utilizing digital printing techniques. These new products, now wholly owned by Electroninks, provide the company immediate and easy entry into new product applications, like antennas, EMI shielding, microheaters, and miniaturization – further expanding Electroninks’ market share.
“Integrating UTDots’ premium nanomaterials into our portfolio represents an expansion of ownership in the market for gold and platinum nanomaterials globally, and especially here in the US. It also accelerates our mission to provide the highest quality conductive materials to the market,” said Melbs LeMieux, co-founder and president at Electroninks.
“The integration demonstrates EI’s continued focus on top-line growth as we transition towards commercialization. We see continued broadening of adoption of our technology and products,” added Dhaval Patel, chief financial officer at Electroninks.
Electroninks is now able to serve a broader range of industries and institutions, offering scalable solutions for next-generation electronic applications. Specifically, the UTDots portfolio means 20 new products, including nine gold, two platinum, and nine silver products. The company remains committed to delivering cutting-edge materials that drive innovation in digital printing and beyond.
Leading metal complex conductive inks provider to showcase product line and iSAP process sponsored by Dongjin Semichem
AUSTIN, TX, UNITED STATES, February 18, 2025 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced that the company will exhibit and showcase their metal complex conductive inks at booth D800 during SEMICON KOREA. The Electroninks’ team will be on hand to discuss the next-generation manufacturing technology achieved with particle-free conductive inks at booth D800 from February 19-21, 2025.
The booth discussions will showcase how Electroninks’ metal composite conductive inks achieve up to 90% conductivity of bulk metals in low-temperature processes and are compatible with a wide variety of substrates, allowing them to be used directly as an alternative technology to nanoparticle inks, metal pastes, sputtering, deposition, and plating. The session will also cover the iSAP Process, a groundbreaking concept that complements the existing SAP framework with revolutionary new materials, seamlessly adapting to varying scales, while readily reaching feature sizes as small as one micron easily achievable through available photolithography.
“SEMICON KOREA is about revolutionizing industries and showcasing the next level of innovation,” stated Wanjong Kim, Electroninks Korea Representative. “At Electroninks we are creating the most flexible and cost-effective solutions for advanced semiconductor packaging to advance innovation across industries and change lives globally.”
You can read the full release here – https://www.einpresswire.com/article/787050391/electroninks-to-exhibit-with-dongjin-semichem-at-semicon-korea
Enhancing Lightweight and Cost Efficiency of Defense Components with Conductive Metal Inks
Establishing a foothold in the U.S. market, strengthening global competitiveness through open innovation
LIG Nex1 has entered into a joint research and development agreement with advanced materials company Electroninks (Austin, Texas) to develop next-generation component materials based on conductive inks.
On December 3, LIG Nex1 and Electroninks signed a strategic cooperation memorandum of understanding (MOU) at LIG Nex1’s Pangyo House in Seongnam, South Korea, with key officials from both companies present. This agreement marks the first step in combining LIG Nex1’s cutting-edge defense industry technology with Electroninks’ metal complex particle-free conductive ink technology to innovate electronic materials for the defense sector. The collaboration will focus on jointly developing next-generation component materials based on conductive inks, aimed at reducing the weight and cost of weapon systems.
Electroninks is a global leader in the field of metal complex (particle-free) conductive inks using Metal Organic Decomposition (MOD) technology. The company first developed particle-free silver (Ag) composite conductive ink, and now is the only global supplier of a combined portfolio including silver, gold, platinum, nickel and copper MOD products. The company has grown into a key player in the semiconductor, display, and electromagnetic interference (EMI) shielding markets. The next-generation ink, which uses significantly less material compared to traditional particle-based or paste-type inks with enhanced performance and required reliability properties, is expected to contribute to lightweighting and cost reduction when applied to key components, such as LIG Nex1’s antennas.
Meanwhile, LIG Nex1 acquired approximately 60% of the shares in Ghost Robotics, a leading quadruped robot company in the U.S., in July. In addition, they have been accelerating their entry into the U.S. market by passing the 5th FCT (Foreign Comparative Testing) of the 2.75-inch guided rocket ‘Bigung’ with the U.S. Department of Defense
Shin Ik-hyun, CEO of LIG Nex1, stated, “This collaboration presents a significant opportunity for innovation, not just in the defense industry but also in the advanced electronic materials sector. It marks a pivotal moment for a leading Korean defense company and a next-generation U.S. technology startup to achieve breakthrough innovation.”
Melbs LeMieux, Co-founder and President of Electroninks, commented, “Our partnership with LIG Nex1 will accelerate the commercialization of our conductive ink technology,serve as a key stepping stone for entering the Korean market, and further strengthen the Korea – US Defense cooperation.”
Looking ahead, LIG Nex1 plans to continue its open innovation efforts with global high-tech startups, focusing on acquiring cutting-edge technologies in key future industries, including defense, and positioning itself as a game-changer in these fields.
You can read the full release here: https://n.news.naver.com/article/001/0015081871?sid=104
New copper ink displaces electroless copper plating and other industry-standard manufacturing processes with significantly faster production speed, lower ownership cost, and greater sustainability levels
AUSTIN, TX & SEMICON TAIWAN – September 3, 2024 – Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of the company’s advanced conductive copper ink line. The new copper ink extends Electroninks’ global-leading portfolio of metal complex inks while providing further manufacturing flexibility and lower total ownership costs to customers. Electroninks will be showcasing the new copper ink line at booth Q5152 in Hall 2 of SEMICON Taiwan September 4-6, 2024.
A high-demand application for the new copper ink is seed layer printing for fine-line metallization and RDL formation in combination with the company’s proprietary iSAP™ process. For this application, Electroninks copper ink effectively displaces industry use of electroless (e-less) copper plating and physical vapor deposition (PVD) tie layers while achieving a significant increase in manufacturing throughput and a vast reduction in ESG footprint. Compared to legacy methods (PVD and e-less), ink-based additive printing uses a fraction of the water and energy, factory footprint and CAPEX, thus providing customers with the lowest total cost of ownership and highest ROI on the market.
The copper inks are deposited by spray coating, screen printing, inkjet, spin-on, and other conventional printing methods. Beyond the seed layer application, Electroninks is working with customers on a multitude of applications, including advanced packaging, serving a diversity of markets. “These copper inks bolster Electroninks’ strong and diverse MOD ink product portfolio and deliver best-in-class ESG and cost savings to customers.” stated Brett Walker, CEO and co-founder of Electroninks.
“MOD inks, which have been on the market from Electroninks for a few years now, provide unique properties that are well suited for today’s semiconductor wafer and module-based packages requiring high performance thermal and power management.” stated Jim Haley, Vice President of Marketing, IMAPS Executive Council. “By introducing a copper-based MOD product, markets and customers are generally more supportive, as copper is a standard in electronic design for many use-cases. While silver, gold, and other MOD inks will continue to serve this market, we welcome copper MOD inks to address key needs in advanced packaging.”
Electroninks is offering a range of copper ink grades to address customer demand for adhesion to various substrates, including glass, silicon, and EMC. These inks are compatible with multiple printing techniques and can be cured at low temperatures for short times – as low as 140C in 5 minutes under nitrogen or ambient conditions.
Electroninks’ corporate executives and its international sale team will be showcasing the company’s copper ink release at SEMICON Taiwan (https://www.semicontaiwan.org/en/node/7046). For more information on Electroninks products and solutions, please visit www.electroninks.com
Media Contact: Nicolia Wiles
PRIME|PR
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Leading aerosol printing technology manufacturer partners with Electroninks for advanced printed microelectronics production
AUSTIN, TX, UNITED STATES, July 15, 2024 — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced a business partnership with IDS, Inc. (Integrated Deposition Solutions) for advanced printing on 3D surfaces and printed microelectronics, such as sensors and antennas. IDS will now use Electroninks metal complex inks after both companies worked together to test printing longevity, fine feature printing, and a newly designed in-situ UV curing system.
When evaluating metal complex inks, IDS had a long list of requirements for a partner in reference to the properties of their inks. Specifically, these inks had to be super stable, cause zero nozzle clogging, set up once without the need for additional recalibration, be suitable for low-temp applications, be capable of printing microelectronics (super fine resolution) with less than 10um line printing, and have a high aspect ratio. To fit the company’s needs, IDS chose Electroninks metal complex inks.
Electroninks’s silver inks are formulated for aerosol printing and for applications that require high conductivity and low curing temperatures. The ultrasonic inks are also capable of fine line <20 um printed features. Electroninks’ new particle-free gold ink is designed specifically for non-contact aerosol jet printing of high-conductivity traces on 3D surfaces.
“Successful demonstrations for our clients is a three-part formula involving the deposition machinery, the printing material, and the application design,“ stated Dov Phillips, sales manager at IDS. “Having a materials partner with expertise in crafting and supplying customer-ready inks for aerosol printing is crucial to our success and Electroninks provides that to IDS and our customers.”
“We are proud to collaborate with IDS to support our mutual customers. The combination of Electroninks’s revolutionary metal complex inks and the cutting-edge precision of IDS Nanojet system brings a broad array of solutions for the advanced packaging and additive manufactured electronics,” stated Yuan Gu, Director of Applications at Electroninks. “This is another example of Electroninks working hard with our ecosystem printing partners to bring total solutions to customers.”
Nicolia Wiles
PRIME|PR
+1 512-698-7373
email us here
Electroninks continues global expansion with new facility and increased production capabilities
AUSTIN, TX – April 24, 2024 – Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced the official opening of the company’s APAC facility in Kaohsiung City, Taiwan. The facility includes offices, a full technical/field support lab, as well as full ink production for customers using Electroninks’ metal-complex inks in-region. The new operation enables increased and redundant ink production capabilities, with additional engineering staff to work with customers directly in APAC. In addition, the company has also hired Takashi Mochizuki as Head of Asia Business, KY Liu as Taiwan Application Development Manager and Kazutaka Ozawa as Technical Director. Combined, these new members have more than 40 years of experience in conductive inks and semiconductor industries. They will work closely with the rest of the global operations and customers.
In addition to the new reactors and ink production tools, there is a full QA/QC lab and analytical equipment for ink qualification. The APAC facility also has a full engineering support lab complete with printing tools including new screen printers, spray coaters and inkjet printers – that match equipment going into production lines at customer sites. With the new staff and additional equipment, global customers will receive significantly improved logistics with shorter product lead times and faster technical support.
“This new facility marks an important milestone of growth and achievement for our company, and significantly improves our ability to serve the global market,” stated Melbs LeMieux, president and cofounder of Electroninks. “We appreciate the support of the local officials and our partners in Kaohsiung to bring this project to completion.”