Product will address the industry’s thermal management challenges on both wafer and large panels
AUSTIN, TX, UNITED STATES, August 4, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced that Merck KGaA, Darmstadt, Germany and Electroninks expanded on the companies’ strategic collaboration to now develop and introduce an innovative Backside Metallization (BSM) solution tailored for advanced semiconductor packaging. This new deal expands on the existing collaboration for Electroninks’ cost-efficient and highly effective EMI shielding solution. The new, next-generation BSM technology announced today offers a highly elegant solution to traditional sputtering and plating processes, addressing the reliability, warpage, and increasing thermal management challenges in hybrid bonding, wafer and Panel Level Packaging (PLP) metallization.
As AI chips and high-performance computing devices continue to push the limits of processing power, thermal density has risen significantly, making efficient heat dissipation more critical than ever. Reliable bonding between semiconductor packages and Thermal Interface Materials (TIM) is essential for effective heat transfer. However, conventional BSM methods—such as sputtering and plating—pose challenges related to cost, equipment requirements, scaling at larger panels, and environmental impact.
By leveraging Merck KGaA, Darmstadt, Germany’s expertise in semiconductor coating processes and Electroninks’ Metal-Organic Decomposition (MOD) Ink technology, this collaboration aims to redefine the standards for BSM in advanced semiconductor packaging.
Key Features and Benefits of the New BSM Solution:
1) High-Uniformity Backside Metallization with Reliable TIM Compatibility
– Merck KGaA, Darmstadt, Germany and Electroninks have advanced spin-coating techniques to enable uniform metal layer formation, even on large-area WLP and PLP substrates.
– The solution ensures high-reliability bonding with TIM and solder materials for optimized heat dissipation.
2) Environmental and Production Efficiency Benefits Over Traditional Methods
– Eliminates the need for large-footprint vacuum equipment, improving manufacturing scalability.
– MOD Ink significantly reduces waste liquid disposal compared to conventional wet processes, aligning with lean manufacturing goals.
3) Enhanced Thermal Management for Next-Generation Devices
– MOD Ink technology provides excellent compatibility with various interface materials, eliminating the need for multi-layer BSM structures (such as Au/Ni-alloy/Ti).
– Ensures superior thermal conductivity and reliability necessary for supporting the high-performance needs and size of AI and computing devices.
Merck KGaA, Darmstadt, Germany and Electroninks remain committed to advancing their strategy and commercial offerings in advanced packaging. With the commercialization of this pioneering BSM technology, which is now underway at customer sites globally, they aim to contribute to the advancement of high-efficiency, more sustainable semiconductor packaging solutions on silicon wafer, as well as panel-level processing where limited solutions exist today.
The companies plan to develop and market this technology together to customers in the near future, with on-site technical support in the US and APAC.
For more information on Electroninks’ expanded portfolio and technical capabilities, visit www.electroninks.com.
Read the full release here: https://www.einpresswire.com/article/836255554/merck-kgaa-darmstadt-germany-and-electroninks-partner-for-next-gen-bsm-solutions-in-advanced-semiconductor-packaging
The DARPA program will use Electroninks metal complex inks to advance high-throughput 3D interconnection and RDL technologies
AUSTIN, TX, UNITED STATES, June 16, 2025 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced that The University of Texas at Austin has selected Electroninks as the exclusive supplier for the core enabling materials technology for its work under the Defense Advanced Research Projects Agency (DARPA) Additive Manufacturing of MicrosystEms (AMME) program. The initiative aims to revolutionize the production of 3D non-planar microsystems by developing new materials and additive manufacturing technologies. Its goal is to demonstrate a high-throughput process that integrates multiple materials – such as conductors and insulators – within a single structure, enabling complex designs beyond what’s possible with conventional methods.
As part of AMME, UT Austin’s Department of Mechanical Engineering is working alongside a number of industry leaders and academic institutions to drive breakthrough innovations in advanced semiconductor packaging. Electroninks, a key technology provider in the project, will supply critical materials necessary for AMME’s new 3D interconnection techniques. By developing innovative conductive materials optimized for high-speed, large-area lithographic patterning, Electroninks’ contributions will help overcome fundamental limitations in current semiconductor packaging processes.
AMME seeks to transform microsystem manufacturing by pioneering advancements in high-speed, high-volume, and high-resolution multi-material production. This cutting-edge additive manufacturing process will enhance commercial devices with next-generation integrated technologies while enabling rapid adaptability to evolving mission requirements—much like additive manufacturing has revolutionized complex prototyping. Through AMME, DARPA aims to break through the inherent limitations of traditional microsystem fabrication, unlocking new possibilities for innovation and scalability.
Electoninks’ metal complex inks will specifically be used to significantly increase data transfer rates and dramatically lower energy consumption of technology platforms. These advanced inks will streamline semiconductor fabrication, boosting yields, improving design flexibility for 3D packages, and cutting packaging time from months to hours. These inks also allow dies to be packaged closer together, meaning electrons travel smaller and shorter distances, increasing transfer speeds and reducing energy consumed. The implications are significant when considering that a single AI data center by 2035 will require several gigawatts, which is the output of an entire nuclear power plant; even a five percent reduction in energy consumption would equal that of building a modern coal power plant.
“AMME represents a significant step forward in semiconductor technology, addressing critical challenges in AI hardware and advanced packaging,” said Professor Michael Cullinan. “By integrating cutting-edge materials with state-of-the-art holographic lithography, we aim to drive new levels of efficiency and capability in semiconductor manufacturing.”
DARPA’s investment underscores the strategic importance of advancing next-generation 3D integration technologies to maintain U.S. leadership in semiconductor innovation and defense-related applications. The collaboration between academia, industry, and government-backed research institutions will help accelerate the commercialization of advanced manufacturing techniques critical to the future of high-performance computing and artificial intelligence-driven applications.
“We are obviously poised to be a significant partner for this consortium and play a key role in fulfilling DARPA’s goals,” stated Brett Walker, PhD, co-founder and CEO of Electroninks. “This is great news for the State of Texas, innovation and the future of technology.”
Full Release found here: https://www.einpresswire.com/article/822503507/electroninks-chosen-as-key-materials-supplier-for-darpa-amme-program-at-the-university-of-texas-at-austin
Portfolio of nanoinks bring gold, platinum, silver and dielectrics for additive manufacturing customers in biomedical, defense and other demanding applications
AUSTIN, TX, UNITED STATES, May 19, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced it has officially completed its full acquisition of UTDots products and IP into its portfolio, further expanding its offerings in digital printing for high-performance applications. The acquisition brings fully commercialized, market-ready gold, silver, and platinum-based materials designed for inkjet and aerosol jet printing, strengthening Electroninks’ position in the rapidly evolving additive manufacturing for defense and research markets.
Electroninks can now deliver UTDots products with improved product quality and increased manufacturing capacity. These advancements ensure higher reliability, scalability, and enhanced performance for researchers and manufacturers utilizing digital printing techniques. These new products, now wholly owned by Electroninks, provide the company immediate and easy entry into new product applications, like antennas, EMI shielding, microheaters, and miniaturization – further expanding Electroninks’ market share.
“Integrating UTDots’ premium nanomaterials into our portfolio represents an expansion of ownership in the market for gold and platinum nanomaterials globally, and especially here in the US. It also accelerates our mission to provide the highest quality conductive materials to the market,” said Melbs LeMieux, co-founder and president at Electroninks.
“The integration demonstrates EI’s continued focus on top-line growth as we transition towards commercialization. We see continued broadening of adoption of our technology and products,” added Dhaval Patel, chief financial officer at Electroninks.
Electroninks is now able to serve a broader range of industries and institutions, offering scalable solutions for next-generation electronic applications. Specifically, the UTDots portfolio means 20 new products, including nine gold, two platinum, and nine silver products. The company remains committed to delivering cutting-edge materials that drive innovation in digital printing and beyond.
Leading metal complex conductive inks provider to showcase product line and iSAP process sponsored by Dongjin Semichem
AUSTIN, TX, UNITED STATES, February 18, 2025 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced that the company will exhibit and showcase their metal complex conductive inks at booth D800 during SEMICON KOREA. The Electroninks’ team will be on hand to discuss the next-generation manufacturing technology achieved with particle-free conductive inks at booth D800 from February 19-21, 2025.
The booth discussions will showcase how Electroninks’ metal composite conductive inks achieve up to 90% conductivity of bulk metals in low-temperature processes and are compatible with a wide variety of substrates, allowing them to be used directly as an alternative technology to nanoparticle inks, metal pastes, sputtering, deposition, and plating. The session will also cover the iSAP Process, a groundbreaking concept that complements the existing SAP framework with revolutionary new materials, seamlessly adapting to varying scales, while readily reaching feature sizes as small as one micron easily achievable through available photolithography.
“SEMICON KOREA is about revolutionizing industries and showcasing the next level of innovation,” stated Wanjong Kim, Electroninks Korea Representative. “At Electroninks we are creating the most flexible and cost-effective solutions for advanced semiconductor packaging to advance innovation across industries and change lives globally.”
You can read the full release here – https://www.einpresswire.com/article/787050391/electroninks-to-exhibit-with-dongjin-semichem-at-semicon-korea
Enhancing Lightweight and Cost Efficiency of Defense Components with Conductive Metal Inks
Establishing a foothold in the U.S. market, strengthening global competitiveness through open innovation
LIG Nex1 has entered into a joint research and development agreement with advanced materials company Electroninks (Austin, Texas) to develop next-generation component materials based on conductive inks.
On December 3, LIG Nex1 and Electroninks signed a strategic cooperation memorandum of understanding (MOU) at LIG Nex1’s Pangyo House in Seongnam, South Korea, with key officials from both companies present. This agreement marks the first step in combining LIG Nex1’s cutting-edge defense industry technology with Electroninks’ metal complex particle-free conductive ink technology to innovate electronic materials for the defense sector. The collaboration will focus on jointly developing next-generation component materials based on conductive inks, aimed at reducing the weight and cost of weapon systems.
Electroninks is a global leader in the field of metal complex (particle-free) conductive inks using Metal Organic Decomposition (MOD) technology. The company first developed particle-free silver (Ag) composite conductive ink, and now is the only global supplier of a combined portfolio including silver, gold, platinum, nickel and copper MOD products. The company has grown into a key player in the semiconductor, display, and electromagnetic interference (EMI) shielding markets. The next-generation ink, which uses significantly less material compared to traditional particle-based or paste-type inks with enhanced performance and required reliability properties, is expected to contribute to lightweighting and cost reduction when applied to key components, such as LIG Nex1’s antennas.
Meanwhile, LIG Nex1 acquired approximately 60% of the shares in Ghost Robotics, a leading quadruped robot company in the U.S., in July. In addition, they have been accelerating their entry into the U.S. market by passing the 5th FCT (Foreign Comparative Testing) of the 2.75-inch guided rocket ‘Bigung’ with the U.S. Department of Defense
Shin Ik-hyun, CEO of LIG Nex1, stated, “This collaboration presents a significant opportunity for innovation, not just in the defense industry but also in the advanced electronic materials sector. It marks a pivotal moment for a leading Korean defense company and a next-generation U.S. technology startup to achieve breakthrough innovation.”
Melbs LeMieux, Co-founder and President of Electroninks, commented, “Our partnership with LIG Nex1 will accelerate the commercialization of our conductive ink technology,serve as a key stepping stone for entering the Korean market, and further strengthen the Korea – US Defense cooperation.”
Looking ahead, LIG Nex1 plans to continue its open innovation efforts with global high-tech startups, focusing on acquiring cutting-edge technologies in key future industries, including defense, and positioning itself as a game-changer in these fields.
You can read the full release here: https://n.news.naver.com/article/001/0015081871?sid=104
New copper ink displaces electroless copper plating and other industry-standard manufacturing processes with significantly faster production speed, lower ownership cost, and greater sustainability levels
AUSTIN, TX & SEMICON TAIWAN – September 3, 2024 – Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of the company’s advanced conductive copper ink line. The new copper ink extends Electroninks’ global-leading portfolio of metal complex inks while providing further manufacturing flexibility and lower total ownership costs to customers. Electroninks will be showcasing the new copper ink line at booth Q5152 in Hall 2 of SEMICON Taiwan September 4-6, 2024.
A high-demand application for the new copper ink is seed layer printing for fine-line metallization and RDL formation in combination with the company’s proprietary iSAP™ process. For this application, Electroninks copper ink effectively displaces industry use of electroless (e-less) copper plating and physical vapor deposition (PVD) tie layers while achieving a significant increase in manufacturing throughput and a vast reduction in ESG footprint. Compared to legacy methods (PVD and e-less), ink-based additive printing uses a fraction of the water and energy, factory footprint and CAPEX, thus providing customers with the lowest total cost of ownership and highest ROI on the market.
The copper inks are deposited by spray coating, screen printing, inkjet, spin-on, and other conventional printing methods. Beyond the seed layer application, Electroninks is working with customers on a multitude of applications, including advanced packaging, serving a diversity of markets. “These copper inks bolster Electroninks’ strong and diverse MOD ink product portfolio and deliver best-in-class ESG and cost savings to customers.” stated Brett Walker, CEO and co-founder of Electroninks.
“MOD inks, which have been on the market from Electroninks for a few years now, provide unique properties that are well suited for today’s semiconductor wafer and module-based packages requiring high performance thermal and power management.” stated Jim Haley, Vice President of Marketing, IMAPS Executive Council. “By introducing a copper-based MOD product, markets and customers are generally more supportive, as copper is a standard in electronic design for many use-cases. While silver, gold, and other MOD inks will continue to serve this market, we welcome copper MOD inks to address key needs in advanced packaging.”
Electroninks is offering a range of copper ink grades to address customer demand for adhesion to various substrates, including glass, silicon, and EMC. These inks are compatible with multiple printing techniques and can be cured at low temperatures for short times – as low as 140C in 5 minutes under nitrogen or ambient conditions.
Electroninks’ corporate executives and its international sale team will be showcasing the company’s copper ink release at SEMICON Taiwan (https://www.semicontaiwan.org/en/node/7046). For more information on Electroninks products and solutions, please visit www.electroninks.com
Media Contact: Nicolia Wiles
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Leading aerosol printing technology manufacturer partners with Electroninks for advanced printed microelectronics production
AUSTIN, TX, UNITED STATES, July 15, 2024 — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced a business partnership with IDS, Inc. (Integrated Deposition Solutions) for advanced printing on 3D surfaces and printed microelectronics, such as sensors and antennas. IDS will now use Electroninks metal complex inks after both companies worked together to test printing longevity, fine feature printing, and a newly designed in-situ UV curing system.
When evaluating metal complex inks, IDS had a long list of requirements for a partner in reference to the properties of their inks. Specifically, these inks had to be super stable, cause zero nozzle clogging, set up once without the need for additional recalibration, be suitable for low-temp applications, be capable of printing microelectronics (super fine resolution) with less than 10um line printing, and have a high aspect ratio. To fit the company’s needs, IDS chose Electroninks metal complex inks.
Electroninks’s silver inks are formulated for aerosol printing and for applications that require high conductivity and low curing temperatures. The ultrasonic inks are also capable of fine line <20 um printed features. Electroninks’ new particle-free gold ink is designed specifically for non-contact aerosol jet printing of high-conductivity traces on 3D surfaces.
“Successful demonstrations for our clients is a three-part formula involving the deposition machinery, the printing material, and the application design,“ stated Dov Phillips, sales manager at IDS. “Having a materials partner with expertise in crafting and supplying customer-ready inks for aerosol printing is crucial to our success and Electroninks provides that to IDS and our customers.”
“We are proud to collaborate with IDS to support our mutual customers. The combination of Electroninks’s revolutionary metal complex inks and the cutting-edge precision of IDS Nanojet system brings a broad array of solutions for the advanced packaging and additive manufactured electronics,” stated Yuan Gu, Director of Applications at Electroninks. “This is another example of Electroninks working hard with our ecosystem printing partners to bring total solutions to customers.”
Nicolia Wiles
PRIME|PR
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Electroninks continues global expansion with new facility and increased production capabilities
AUSTIN, TX – April 24, 2024 – Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced the official opening of the company’s APAC facility in Kaohsiung City, Taiwan. The facility includes offices, a full technical/field support lab, as well as full ink production for customers using Electroninks’ metal-complex inks in-region. The new operation enables increased and redundant ink production capabilities, with additional engineering staff to work with customers directly in APAC. In addition, the company has also hired Takashi Mochizuki as Head of Asia Business, KY Liu as Taiwan Application Development Manager and Kazutaka Ozawa as Technical Director. Combined, these new members have more than 40 years of experience in conductive inks and semiconductor industries. They will work closely with the rest of the global operations and customers.
In addition to the new reactors and ink production tools, there is a full QA/QC lab and analytical equipment for ink qualification. The APAC facility also has a full engineering support lab complete with printing tools including new screen printers, spray coaters and inkjet printers – that match equipment going into production lines at customer sites. With the new staff and additional equipment, global customers will receive significantly improved logistics with shorter product lead times and faster technical support.
“This new facility marks an important milestone of growth and achievement for our company, and significantly improves our ability to serve the global market,” stated Melbs LeMieux, president and cofounder of Electroninks. “We appreciate the support of the local officials and our partners in Kaohsiung to bring this project to completion.”
Key domestic supplier of advanced materials fortifies executive leadership with financial and operational expertise on pathway to commercialization with expanding customer base
AUSTIN, TX – January 8, 2024 – Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, announced today the appointment of Dhaval Patel as their chief financial officer and Michael Vinson as chief operating officer. Mr. Patel joins the executive leadership team to deliver the company’s financial and strategic objectives as it enters its next phase of growth. Mr. Vinson will supply his expertise and vast industry experience in operational development and material production to bolster Electroninks’ quality assurance and product readiness.
Mr. Patel brings a wealth of relevant experience to Electroninks, most notably in corporate strategy, M&A, corporate finance and investor relations. Prior to joining Electroninks, Dhaval was most recently VP of Investor Relations at Shoals Technologies and prior to that was SVP of Investor Relations, Corporate Strategy and M&A at Pactiv Evergreen. Prior to Pactiv Evergreen, he was Managing Director at Nuveen Asset Management overseeing portfolios with a focus on the materials sectors. At Electroninks, Mr. Patel will focus on strategic financial planning and budgeting, M&A, and other financial responsibilities to achieve longer term company goals.
Mr. Vinson brings a wealth of experience to his new role with an extensive background spanning 11 years in relevant markets and an even more substantial tenure in the electronics and semiconductor sector. In his capacity as COO, Mr. Vinson will collaborate closely with the senior leadership team, working alongside the President and CEO. His responsibilities will include the oversight of Electroninks’ day-to-day operations and the implementation of strategic initiatives to achieve the company’s commercial and manufacturing objectives.
“Everything we do at Electroninks is rooted in the ability to grow smart and fast,” stated Dr. Brett Walker, chief executive officer of Electroninks. “As we start rapid commercialization of existing and new products, it’s imperative that we have the best people at the helm and both Dhaval and Mike bring the exact experience and expertise required to support the continued success of our organization and the development of our product lines.”
New ink enables narrow linewidth features
Electroninks, the leader in particle-free metal inks and advanced conductive materials, announced the confirmation of an enhanced particle-free silver ink product with aerosol jet printing compatibility for ultra-fine line printing requirements for Electroninks’ commercial customers.
As a recognized industry leader of metal complex particle-free conductive inks, Electroninks developed an enhanced particle-free silver ink designed for fine-line, low temperature curing with aerosol jet printing that delivers a best-in-class combination of print resolution, electrical performance, and process temperature.
The new ink product has broad impacts as aerosolized printing heads are compact, can be easily integrated into production lines, or placed on robotic arms for multi-axis additive manufacturing of conductive interconnects and circuits. This manufacturing technique is ideal for highly precise semiconductor packaging, aerospace, display, and biomedical applications. The use of the particle-free ink with aerosol jet printing makes it possible for manufacturers to reduce the size, power and weight of devices, making it ideal for interconnects and metallization in mobile and wearable products, foldable displays, biomedical devices and sensors, and conformal 3D parts.
“At Electroninks, we are committed to providing our customers with the highest performing products and solutions to meet the demands of their emerging manufacturing technologies and products,” said Electroninks co-founder and President, Melbs LeMieux. “Our new enhanced particle-free silver ink product is compatible with aerosol jet printing technology and allows our partners and commercial customers to meet difficult specifications.”
Aerosol jet printing is an additive manufacturing process that prints commercially available conductive, dielectric, semiconductor, and biologic inks onto a variety of 2D or 3D plastic, ceramic, and metallic substrates. Electroninks particle-free inks provide versatile, low-cost, domestically produced, all-in-one additive manufacturing solutions.
Electroninks’ novel particle-free ink formulation and capabilities interested In-Q-Tel, Inc., the strategic investor to the U.S. intelligence community, which joined with Electroninks as an additional strategic partner and investor. The partnership with In-Q-Tel will allow Electroninks to deliver its products at scale to its government partners in national security as well as for broader commercial usage.
“In-Q-Tel understands the value that Electroninks’ technology and team know-how can provide to the manufacturing of interconnects,” said Victoria Chernow, Ph.D., Technology Architect, In-Q-Tel. “We believe our strategic investment in Electroninks will contribute to our partners’ mission needs.”
Electroninks is delivering a more cost-effective and efficient use of many noble metals through its particle-free ink formulations, including gold, platinum, nickel, and copper. Its particle-free silver ink delivers higher conductivity, flexibility and cost-effectiveness making them ideal for today’s smaller, lighter, more highly functional electronic products.
The aerosol jet printing compatible particle-free silver ink is capable of being printed at <15um resolution, with up to 10um height, up to 3x bulk conductivity of silver, while being cured at no higher than 120C, while maintaining certain manufacturing and throughput specifications.
Development Team Quotes:
“The newly developed silver ink combines best-in-class electrical performance with fine feature printing,” said Garret McKerricher, Senior Scientist, Electroninks. “The ink is capable of ultrasonic aerosol jet printing and demonstrates fine feature printing at less than 20um resolution with high aspect ratios.”
“The new silver ink provides good resistivity at a low curing temperature, and has high volume output, ” said Yuan Gu, Senior Scientist, Electroninks. “Combined with room temperature printability, the ink is ideal for3D surfaces printing on wrap-around and other flexible surfaces.”
About Electroninks
Electroninks Inc. provides high-performance, advanced materials that enable technology and manufacturing breakthroughs with our innovative customers to turn promising ideas into profitable new products. The company’s portfolio of products based on its proprietary particle-free conductive metal inks provides cost-effective, highly stable and reliable solutions for applications in semiconductor packaging, consumer electronics, and medical devices. The company is the first to provide particle-free conductive inks in silver, gold, platinum, nickel, and copper. Electroninks’ novel formulations are ideal for the design and manufacturing of today’s smaller, lighter, more highly functional electronic products as well as agile manufacturing and rapid maintenance needs.
Electroninks has forged strategic partnerships with Applied Materials, Merck, FujiFilm, the DoD and other Tier 1 equipment and supply chain partners that allow the company to focus on innovation, while still meeting customers’ demands for quality, reliability and scale. To date, Electroninks has raised Series A and B funding from firms known for material science development and defense integration including Applied Materials, In-Q-Tel, Inc., Band Gap Ventures, ITIC, and M-Ventures. Electroninks is located in Austin, Texas.