New MOD silver ink delivers stable jetting, strong adhesion, and low-temperature curing for printed electronics and EMI shielding
AUSTIN, TX, UNITED STATES, June 15, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of EI-1169, a new UV-curable silver conductive ink engineered for inkjet deposition across advanced electronics manufacturing applications. Designed for high-reliability conductive printing on epoxy, polyimide, and copper substrates, EI-1169 expands Electroninks’ portfolio of metal-organic decomposition (MOD) conductive inks supporting next-generation additive manufacturing workflows, printed electronics, EMI shielding, and semiconductor packaging applications.
The new formulation combines stable jetting performance on industry-relevant printheads, long shelf life and printhead life, low-temperature curing, and strong adhesion characteristics within a polymer-free conductive ink platform optimized for digitally manufactured electronics. The combination of jettability, reliability and electrical performance sets this product apart on a global level.
“As electronics manufacturers continue moving toward additive and digitally driven production environments, conductive materials have to deliver both processing stability and long-term reliability,” said Brett Walker, chief executive officer at Electroninks. “EI-1169 was developed to support those requirements while enabling broader substrate compatibility and lower-temperature conductive processing.”
EI-1169 is formulated for inkjet deposition environments requiring precise droplet control, repeatable print performance, and robust substrate adhesion. The ink demonstrates strong stability and ink-jettability in several printheads, including DMP Samba printheads, helping support scalable additive manufacturing workflows and consistent production output.
Key product features include:
* Polymer-free MOD silver conductive ink
* UV-curable processing capability
* Lead-free and halogen-free formulation
* Strong adhesion on copper, epoxy, and polyimide substrates
* Stable jetting performance for inkjet deposition
* Long refrigerated shelf stability
The material also supports UV curing at 365 nm or 395 nm wavelengths, providing additional process flexibility for manufacturers working with temperature-sensitive substrates and advanced packaging architectures.
Electroninks developed EI-1169 to support the growing shift toward additive manufacturing across electronics production and semiconductor packaging workflows. As device architectures become more compact and geometrically complex, manufacturers increasingly require conductive materials that combine high-resolution deposition, substrate compatibility, and scalable processing performance.
Electroninks expects EI-1169 to support applications including:
* EMI shielding
* Printed electronics
* Flexible electronics
* Semiconductor packaging
* Advanced interconnects
* Additive manufacturing workflows
The launch of EI-1169 further expands Electroninks’ growing portfolio of conductive materials engineered for next-generation electronics manufacturing.
The company continues developing advanced metal complex conductive ink solutions spanning silver, copper, gold, platinum, and nickel chemistries for applications across semiconductor packaging, printed circuit boards, advanced sensors, aerospace systems, medical devices, and additive electronics manufacturing.
“Additive manufacturing is fundamentally changing how electronics are designed and produced,” added Walker. “Our focus remains on delivering conductive materials that help customers simplify manufacturing workflows while enabling new levels of performance and integration flexibility.”
EI-1169 is available immediately for customer evaluation and integration. For additional product specifications and availability information, visit www.electroninks.com.
Full release: https://www.einpresswire.com/article/919268252/electroninks-launches-uv-curable-silver-conductive-ink-for-advanced-printed-electronics-and-emi-shielding-applications
Session will explore how silver MOD inks deliver dense conductive films, lower-temperature processing, and improved economics
AUSTIN, TX, UNITED STATES, June 9, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced it will host a booth and present a session on MOD inks at TechBlick 2026, taking place June 10-11 at the Computer History Museum in Mountain View, California. At the event, Mitchell Smith, will present Silver MOD Inks: Advancing Performance Beyond Particle Pastes at 12:15PM PT on June 10th. Visit us at Booth E07, at TechBlick to connect with our team and discover how Electroninks is transforming the industry.
The presentation will examine how metal organic decomposition (MOD) inks are emerging as a next-generation alternative to conventional silver particle-based conductive pastes used across printed electronics and advanced manufacturing applications.
As manufacturers face increasing pressure to improve performance while managing material costs, silver MOD inks are gaining attention for their ability to achieve high conductivity using less silver content. This advantage becomes particularly important amid ongoing silver price volatility, which continues to impact production economics across the electronics industry.
“Traditional conductive particle pastes have played an important role in printed electronics, but the market is reaching a point where performance, scalability, and cost efficiency must evolve together,” said Mitchell Smith, Engineer, Product Manager at Electroninks. “MOD inks offer a fundamentally different chemical approach that enables denser conductive films, lower curing temperatures, and broader substrate compatibility.”
The session will explore the underlying chemical mechanisms behind silver MOD technology and how these materials differ from traditional particle-filled formulations. Attendees will gain insight into how MOD inks can:
* Form denser conductive films than conventional silver particle pastes
* Achieve high electrical performance with reduced metal loading
* Enable lower-temperature curing processes compatible with plastic substrates
* Support next-generation additive manufacturing and printed electronics applications
The presentation is designed for manufacturers, materials engineers, and product developers currently using conductive particle pastes, as well as organizations evaluating conductive inks for future product integration.
Electroninks continues to expand the use of its proprietary MOD ink platform across advanced packaging, additive electronics, EMI shielding, and printed electronic applications, helping manufacturers improve performance while simplifying manufacturing workflows.
Attendees interested in learning more about Electroninks’ conductive ink technologies are encouraged to attend the session at TechBlick 2026.
Full release: https://www.einpresswire.com/article/918448613/electroninks-to-present-at-techblick-2026-on-the-future-of-silver-mod-inks-for-advanced-electronics
Company expands its leading role in metal complex portfolio with copper metallization without inert gases, expanding access to additive manufacturing
AUSTIN, TX, UNITED STATES, June 2, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced a significant advancement to its copper metal-organic decomposition (MOD) ink platform: a copper metallization technology capable of curing under ambient conditions, open to air.
Building on the company’s September 2024 commercial launch of Cu-MOD, which demonstrated low resistivity and strong adhesion across a broad range of substrates, this next-generation development directly addresses one of the most consistent requests from the market since that release: the ability to cure copper without an inert atmosphere, especially in large area metallization applications.
Electroninks is currently working with a select group of preferred partners to develop this core technology into real-world use cases, with more complete results and performance data expected in Q3 of 2026.
A Meaningful Shift For Copper Metallization
Copper is one of the most widely used materials in electronics manufacturing, valued for its conductivity, availability, and cost advantages over precious metals. However, a fundamental challenge has long limited its use in additive and ink-based processes: copper oxidizes readily, requiring inert atmosphere curing environments, typically nitrogen or forming gas, to produce dense, conductive films.
Electroninks’ new Cu-MOD technology removes that requirement. The ink cures under ambient, open-air conditions using standard low-temperature thermal processing at approximately 150 deg for 5 to 10 minutes, producing a dense copper film without the need for inert gas infrastructure, vacuum equipment, heat press or lamination systems, or other specialty tooling. The result is a simpler, more accessible copper metallization workflow that is compatible with standard processing environments.
Preliminary results, which focus on polymide, glass, EMC, and build-up film substrates, indicate resistivity performance that is competitive with existing copper metallization approaches, with full performance data to be shared with the broader market in Q3 2026
Broader Implications for the Market
Electroninks believes the implications of ambient-condition copper curing extend well beyond the applications where copper metallization is already established.
“While silver and gold will remain key materials in many applications, for large area and full-film metallization, the rising cost of precious metals has renewed interest across the electronics industry in cost-effective alternatives that do not compromise electrical performance. Electroninks’ ambient-curable Cu-MOD is designed to address that need directly, offering a lower-cost conductive solution that can be processed without the environmental controls traditionally required for copper.” Said Kazutaka Ozawa, Technical Director at Electroninks.
Preferred Partner Engagement
Given the level of market interest anticipated, Electroninks is currently limiting early access to a select group of preferred development partners to ensure focused collaboration and the highest quality of technical outcomes. Organizations interested in learning more about partnership opportunities are encouraged to contact Electroninks directly.
Full performance data, application results, and broader availability details will be announced in Q3 2026.
Full release can be found here: https://www.einpresswire.com/article/916854051/electroninks-introduces-air-curable-copper-complex-conductive-ink-in-marked-advanced-for-additive-metallization
UT Dots expands global availability of conductive ink formulations of high conductivity and precision deposition for next-gen electronic and medical devices
AUSTIN, TX, UNITED STATES, May 18, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced the company’s new gold and silver nanoparticle inks from its UTDots portfolio, which will be commercially available through Sigma-Aldrich. The new product family includes six conductive ink formulations with a focus on green solvents and optimized for inkjet and aerosol jet deposition platforms, enabling high-performance additive manufacturing across applications ranging from wearable devices and biosensors to RF systems, EMI shielding, and advanced defense electronics.
The launch includes the following commercially available formulations:
* UTD-Ag-25IJ
* UTD-Ag-40IJ
* UTD-Ag-60PA
* UTD-Au-25IJ
* UTD-Au-40IJ
* UTD-Au-60IJ
As manufacturers increasingly shift toward digital fabrication methods, UT Dots’ nanoparticle inks are designed to provide the conductivity, process stability, and scalability required to move printed electronics beyond prototyping and into broader commercial deployment.
“The printed electronics market is moving rapidly toward higher-performance, digitally manufactured systems that demand both precision and scalability,” said Alex Didenko, engineer at Electroninks, managing the product development of the UTDots portfolio.. “Our new nanoparticle ink portfolio was developed to help engineers and manufacturers bridge that gap with materials capable of supporting everything from flexible consumer devices to highly demanding aerospace and defense applications.”
Engineered for Precision Across Modern Printing Platforms
The new ink portfolio is designed to support a broad range of additive manufacturing workflows and geometries. UT Dots’ inkjet-compatible formulations are optimized for stable and repeatable droplet formation, enabling fine-feature patterning with minimal variability across flexible and rigid substrates alike. The aerosol jet-compatible series extends those capabilities further, supporting conformal deposition on complex three-dimensional surfaces with feature widths below 200 microns.
This flexibility enables manufacturers to print conductive structures on everything from planar flexible circuits to curved integrated systems without sacrificing precision or consistency.
Near-Bulk Conductivity for High-Performance Applications
Following sintering, UT Dots’ silver nanoparticle inks achieve resistivity values between 3–10 microhm-centimeter, approaching the performance characteristics of bulk silver while maintaining compatibility with additive manufacturing processes.
The company’s gold nanoparticle formulations achieve conductivity levels within 2–7x of bulk gold and support photonic curing in the 500–550 nm wavelength range. This capability allows conductive structures to be processed on temperature-sensitive substrates that are incompatible with conventional high-temperature thermal curing methods.
These performance characteristics position the materials for demanding applications requiring high conductivity, low-profile form factors, and advanced integration flexibility.
Accelerating Innovation in Printed Biosensing
UT Dots’ gold nanoparticle formulations are also designed to support emerging biosensing and diagnostic applications. Gold’s inherent biocompatibility, oxidation resistance, and compatibility with thiol-based surface chemistry make the UTD-Au series particularly well suited for applications including:
* Enzymatic glucose sensors
* Immunoassay platforms
* DNA detection arrays
* Lab-on-chip microelectrode systems
By enabling mask-free additive fabrication through inkjet printing, the platform significantly shortens the design-to-prototype cycle compared to traditional lithography-based manufacturing methods. The result is faster iteration, reduced material waste, and improved development flexibility for researchers and medical device developers.
Designed for Commercial Scalability
Beyond laboratory development, UT Dots engineered the new ink platform to support long-term manufacturing scalability. The formulations are produced using standardized synthesis processes and strict quality-control methodologies designed to ensure strong batch-to-batch consistency. This allows manufacturers to maintain predictable electrical and processing performance as products transition from early-stage development into commercial production environments.
“As electronic microdevices continue maturing into broader application spaces, including medical devices and advanced sensors, material consistency and reliability become just as important as conductivity,” stated Melbs LeMieux, cofounder and president of Electroninks, UT Dots’ parent company. “We built this portfolio to support our continuous expansion of advanced materials to address new markets and customers.”
The new conductive ink portfolio is available immediately for customer evaluation and commercial integration. For more information on UT Dots products and solutions, please visit www.utdots.com
Full release: https://www.einpresswire.com/article/913069752/sigma-aldrich-adds-electroninks-ut-dots-advanced-gold-and-silver-nanoparticle-inks-to-product-offering
Company to highlight MOD ink innovations enabling scalable EMI shielding and next-generation semiconductor packaging
AUSTIN, TX, UNITED STATES, April 6, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced its participation in Productronica India 2026 from April 8-10, 2026. The company will highlight its latest advancements in metal organic decomposition (MOD) ink technology for high-performance electronics manufacturing. Representing Electroninks at the event will be Maneesh Gupta, who will engage with customers, partners, and industry stakeholders to discuss how additive metallization is transforming traditional manufacturing approaches across semiconductor packaging and electronics assembly. Attendees can visit Electroninks at the India Expo Mart (IEML) at booth H15.G45 in Hall No. 15.
Productronica India serves as a key platform for the electronics manufacturing ecosystem across Asia, bringing together industry leaders focused on advancing production technologies, materials innovation, and scalable manufacturing solutions. Electroninks’ presence underscores its continued investment in expanding its global footprint and supporting regional demand for next-generation packaging technologies.
“At events like Productronica India, we’re seeing strong interest from manufacturers looking to move beyond conventional metallization processes,” said Maneesh Gupta, Representative of Electroninks. “As device architectures become more complex and performance requirements increase, there is a clear need for solutions that can deliver both precision and scalability. Our MOD ink platform is designed to meet those needs while simplifying manufacturing workflows.”
Enabling Advanced Packaging and EMI Shielding at Scale:
At the event, Electroninks will showcase its portfolio of silver-based MOD inks, which enable additive metallization for applications including electromagnetic interference (EMI) shielding, backside metallization, and advanced interconnect formation.
Unlike traditional vacuum-based deposition methods, Electroninks’ MOD inks support atmospheric processing and can be integrated into a range of deposition techniques, including spray and inkjet systems. This approach enables highly uniform, conformal metal coverage across complex three-dimensional geometries, while reducing energy consumption and process complexity. This also offers much lower CAPEX at higher UPH, and modularity in NPI and production lines, which can be advantageous as OSATs and fabs scale.
The company’s technology is particularly well-suited for emerging System-in-Package (SiP) architectures and high-frequency applications, where conventional line-of-sight processes such as sputtering face increasing limitations in sidewall coverage and feature-level uniformity.
By enabling additive, recon-free metallization approaches, Electroninks’ solutions also support reduced chip spacing and higher integration density, addressing key challenges in next-generation electronics design.
Driving Regional Engagement and Industry Collaboration:
As demand for advanced electronics manufacturing continues to grow across India and the broader Asia-Pacific region, Electroninks is focused on building strong partnerships with local manufacturers, equipment providers, and ecosystem players.
Productronica India provides an opportunity for the company to engage directly with industry leaders exploring new approaches to improve yield, reduce cost, and scale production for high-performance devices.
Attendees are invited to connect with Maneesh Gupta during the event to learn more about Electroninks’ technology platform and explore collaboration opportunities.
For more information on Electroninks products and solutions, please visit www.electroninks.com
Full press release: https://www.einpresswire.com/article/904125458/electroninks-to-showcase-advanced-metallization-solutions-at-productronica-india-2026
AUSTIN, TX, UNITED STATES, February 26, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, will showcase a breakthrough in advanced packaging materials at this year’s IMAPS Device Packaging Conference (DPC), presenting a new total low-temperature silver metal complex ink full-suite materials platform designed specifically for high-performance electromagnetic interference (EMI) shielding in system-in-package (SiP) architectures. Multiple team members, including executives, product leads, and sales team (Melbs LeMieux, Kazutaka Ozawa, Takashi Mochizuki, Jessica Lin and Avery Gerber) from Electroninks will be in attendance to discuss Electroninks’ solutions.
The poster, titled: “A Breakthrough in Advanced Packaging: The Total Low-Temperature Silver Metal Complex Ink Full-Suite Materials Platform for EMI Shielding in SiP” will be presented by Jessica Lin on Wednesday, March 4, from 5:30–7:30 PM on the Akimel Lawn.
Addressing a Growing Packaging Bottleneck
As semiconductor devices continue to scale in complexity, integrating RF modules, sensors, AI accelerators, power management, and memory into increasingly dense SiP architectures, shielding and thermal budgets have become one of the most limiting constraints in advanced packaging. Traditional EMI shielding approaches often rely on high-temperature processes or materials that introduce mechanical stress, warpage risk, or integration complexity. These constraints are increasingly incompatible with:
* Heterogeneous integration
* Organic substrates and advanced laminates
* Temperature-sensitive components
* High-frequency automotive and AI applications
Electroninks’ total silver metal complex ink platform directly addresses this challenge by enabling high-conductivity EMI shielding at processing temperatures compatible with advanced substrates and thermally sensitive device stacks.
A Full-Suite Materials Platform — On a Single Tool
MOD Silver Inks have met the majority of performance and reliability specs for advanced packaging. However, they will sometimes tarnish over time. To address this, EI has developed anti-tarnish chemistry and technology. This platform represents a complete materials ecosystem engineered for integration into modern advanced packaging workflows.
The poster will demonstrate:
* Ultra-low temperature processing compatibility: Enabling EMI shielding without exceeding the thermal thresholds of next-generation SiP designs.
* High conductivity performance: Achieving metallic performance levels required for high-frequency EMI suppression.
* A full-suite materials platform approach: Designed for compatibility across substrates, deposition methods, and packaging configurations.
* Scalable integration for manufacturing: Supporting additive and hybrid manufacturing approaches aligned with evolving semiconductor packaging roadmaps.
This holistic approach allows advanced packaging engineers to rethink EMI shielding as an integrated materials solution rather than a secondary, high-temperature add-on step.
Why This Matters Now
Advanced packaging has become a primary driver of semiconductor innovation, particularly as Moore’s Law scaling slows and heterogeneous integration accelerates. According to industry roadmaps from IMAPS and leading semiconductor consortia, SiP architectures are central to enabling:
* AI edge devices
* Automotive electronics and ADAS
* 5G/6G RF modules
* Power-dense industrial systems
However, EMI performance at higher frequencies—especially in tightly integrated modules—remains a growing technical hurdle.
Electroninks’ low-temperature silver metal complex chemistry provides a path forward by decoupling EMI performance from high thermal budgets. This is particularly relevant for:
* Automotive-grade electronics
* Fine-pitch advanced substrates
* Panel-level packaging
* Emerging heterogeneous chiplet designs
For more information on Electroninks products and solutions, please visit www.electroninks.com
Poster Session: Wednesday, March 4 | 5:30–7:30 PM | Akimel Lawn
Location: Sheraton Grand at Wild Horse Pass
Event: IMAPS Device Packaging Conference
Full release: https://www.einpresswire.com/article/895587437/electroninks-to-present-industry-leading-silver-metal-complex-product-suite-platform-for-emi-shielding-at-imaps-dpc-2026
From AI to high-performance computing — we take a look at emerging use cases and predictions in the industry
AUSTIN, TX, UNITED STATES, January 12, 2026 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today released its annual outlook of top trends to impact the industry, Electroninks 2026: The Top Additive Manufacturing Trends to Watch. The trends identify the next major inflection points in additive manufacturing, where organizations shift from legacy implementation to executing on new insights with cost efficiency, competitive advantages and advanced workflows at the core.
The following predictions come from Electroninks top executives and thought leaders, Brett Walker (CEO and Co-founder), Melbs LeMieux (President and Co-founder), Takashi Mochizuki (Head of Sales and Business Development), Kazutaka Ozawa (Technical Director):
1. Metal–Organic Decomposition (MOD) Inks Become a Standard Metallization Pathway
2026 will mark the first year that MOD inks transition from early-stage adoption to mainstream qualification across chip packaging lines. As fabs seek lower-temperature processes, higher reliability, and faster cycle times, particle-free printable metals will emerge as a de facto choice for backside metallization, EMI shielding, and RDL repair applications.
2. Backside Metallization (BSM) Moves to Additive-First Workflows
The rapid rise of AI accelerators and multi-die GPU architectures is pushing BSM requirements beyond the capabilities of traditional vacuum deposition tools. Additive alternatives enable faster throughput, high-aspect-ratio coverage, and better thermal conduction. In 2026, several major OSATs are expected to shift at least one production line to additive metallization.
3. Materials Equipment Co-development Becomes Industry Standard
The industry will increasingly adopt a collaborative model where materials suppliers and toolmakers co-engineer integrated solutions. This is expected to produce purpose-built additive metallization systems optimized for reliability, speed, and fully digital deposition. These vertically aligned solutions will accelerate qualification cycles and improve scalability.
4. Hybrid Packaging Architectures Drive Demand for Multi-Material Workflows
With chiplets, 2.5D interposers, and 3D stacked architectures reaching commercial scale, 2026 will usher in greater demand for materials that work seamlessly together. Printable metals, curable dielectrics, underfills, and thermal interface materials will need to integrate into unified, digitally programmable workflows that support rapid prototyping and high-mix production environments.
5. Power and Water Reduction Becomes a Global Priority as AI Data Centers Drive Infrastructure Strain
A surge in AI-dedicated data centers will create unprecedented demand for power and cooling, pushing utilities and hyperscalers into crisis-level resource constraints. In 2026, semiconductor companies will face urgent pressure to reduce energy and water use across material deposition, curing, and packaging processes. Additive metallization will gain accelerated momentum due to its ability to:
Governments and enterprise customers will reward suppliers that enable more sustainable semiconductor scaling, especially as AI workloads continue to multiply.
6. Metal-Complex Silver Inks: A New Cost-Stability Lever in a Volatile Silver Market
Record and multi-year-high silver prices are forcing every electronics and semiconductor manufacturer to rethink how much precious metal they really need in their processes. Traditional conductive materials have long depended on heavy silver loading to hit performance targets. Today, that approach is colliding with commodity volatility, budget pressure, and growing scrutiny on material efficiency.
Advanced metal-complex silver technology delivers higher conductivity with dramatically lower silver loading to counter rising commodity prices
AUSTIN, TX, UNITED STATES, December 19, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the expanding industry adoption of its metal-complex silver formulations due to global silver prices climbing to multi-year highs. The company’s proprietary chemistry enables higher conductivity per gram, lower total silver loading, and improved manufacturing efficiency compared to traditional particulate, flake, or bulk silver materials.
Electroninks’ metal-complex silver platform has emerged as a strategic solution for sectors facing escalating materials costs, including semiconductor packaging, consumer electronics, automotive electronics, aerospace, and advanced additive manufacturing. While traditional silver inks and pastes depend on heavy metal loading to achieve conductive performance, Electroninks’ metal-complex silver technology takes a fundamentally different approach, leveraging engineered molecular and nanoscale architectures that create more accessible and uniformly dispersed active silver species.
This structural design forms highly efficient conductive pathways, enabling:
* Higher conductivity per unit of silver
* Equal or greater electrical performance at significantly lower silver loading
* Reduced exposure to volatile precious-metal markets
As conventional silver prices surge, these efficiency gains translate directly into lower material consumption and more stable long-term cost structures for manufacturers. The company’s formulations allow for lower sintering temperatures, more robust substrate compatibility, and improved reproducibility in complex manufacturing environments. These capabilities are particularly valuable as the semiconductor and electronics packaging sectors continue shifting toward thinner substrates, higher data densities, and rapid production cycles.
As silver markets experience sustained volatility and rising spot prices, manufacturers are increasingly reevaluating raw material strategies. Metal-complex silver offers a resilient pathway forward with significant strategic benefits:
* Lower bill of materials (BOM) due to decreased precious-metal usage
* Equal or superior performance relative to traditional silver inks and pastes
* Ability to domestically or near-shore production to strengthen supply chain security
* Reduced environmental impact through lower lifetime silver consumption
* Lower amount/burden for recycling silver materials, ingots
“Every manufacturer working with conductive materials is feeling the pressure of today’s silver market,” said Dhaval Patel, chief financial officer of Electroninks. “Our metal-complex silver platform gives customers a way to maintain or improve performance while using dramatically less silver. It is a material innovation that is aligned with both the economic realities of the moment and the long-term direction of the industry.”
Electroninks’ metal-complex platform supports the industry’s transition toward higher performance, reduced waste, and more secure supply chains. As electronic systems grow more complex and data-rich, conductive materials must deliver elevated reliability and tighter process control while remaining economically viable.
The company continues to partner with leading OEMs, semiconductor manufacturers, and materials suppliers to scale its formulations into high-volume production environments.
Full release: https://www.einpresswire.com/article/876848711/electroninks-announces-high-performance-metal-complex-silver-as-a-cost-efficient-solution-amid-high-global-silver-prices
Recon-free innovation and new advancements in reliability create the industry’s most cost-effective, sustainable and scalable EMI shielding solution
AUSTIN, TX – December 1, 2025 – Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today unveiled its next-generation EMI shielding solution, setting a new standard for cost, performance and reliability in advanced semiconductor packaging. Notably, the new Electroninks process involves smaller tooling footprint, and boasts a greater than 99 percent reduction in power and water use compared to conventional PVD and e-less metallization, also making it the most sustainable solution on the market.
The solution is based on the company’s revolutionary EI-1200 ink series technology, which is engineered to directly metalize molding compounds, silicon and other relevant substrates in various packaging formats including package level, die-level, and wafer level. However, the major advancements come from the addition of a recon-free process.
Electroninks’s MOD spray process offers major advancements in EMI shielding by enabling uniform sidewall coverage with aspect ratios approaching 100% for a standard 2mm spacing and the process can do recon-free (which depending on spacing and test vehicle design) can achieve up to 70 percent coverage. In both cases, a feat that traditional processes struggle to match. Critically, the ability to achieve sidewall coverage in such geometries enables manufacturers to eliminate the wafer dicing and reconstitution steps that are typically required to achieve sufficient spacing for traditional sputtered films. By bypassing these stages, Electroninks’s MOD process not only simplifies the overall packaging workflow but also boosts production throughput and reduces handling-related defects.
Silver is widely used in EMI shielding due to its excellent conductivity and high-frequency attenuation capabilities. However, it can be susceptible to surface sulfurization that can alter the film’s appearance when exposed to certain environmental conditions such as elevated temperatures, specific air qualities, or high-humidity tests like uHAST. While this tarnish is purely cosmetic and doesn’t affect conductivity or shielding effectiveness, visible discoloration can erode customer trust, raise quality concerns in manufacturing and inspection, and create uncertainty for long-term reliability. Electroninks has worked with customers to develop solutions, such as the modification of its product chemistry or the addition of a black or clear overcoat, to completely eliminate this hurdle. When combined with the recon-free process, this creates the industry’s most advanced EMI shielding solution.
“The semiconductor packaging industry has long relied on sputtered EMI shielding layers, despite their cost and complexity,” said Brett Walker, CEO of Electroninks. “With EI-1207, we’re proving that MOD-based spray coating is not just viable; it’s technically superior, lower cost, more sustainable, and ready for high-volume adoption worldwide.”
At the core of EI-1207’s innovation is Electroninks’s proprietary MOD ink chemistry, a true solution, not a particle suspension, which enables superior film uniformity, low-temperature curing, and stable spray coating with no reconstitution required. The platform is already in use by leading OSATs, with production tool installations underway in both Korea and Taiwan.
Key technical advantages over traditional coating processes include:
For the semiconductor industry, where throughput, yield, and sustainability are paramount, EI-1207 delivers tangible benefits:
“From an engineering standpoint, EI-1200 series is a leap forward because it solves two of the biggest EMI shielding pain points in one stroke, uniform coverage and process complexity,” stated Sima Hannani, product director for Electroninks. “Improvements like achieving near-100 percent sidewall coverage or circumventing dicing and reconstitution steps aren’t just yield boosters; they fundamentally change how lines can be designed and run. Add to that a greater than 99 percent reduction in power and water usage, and you have a process that’s not only more precise, but also inherently more sustainable. This is the kind of advancement that makes high-volume adoption inevitable.”
By replacing capital-intensive and energy-hungry sputtering lines, EI-1207 positions Electroninks’ customers to meet the performance and sustainability demands of 5G, RF-FEM, and SiP applications—without compromising shielding effectiveness. Testing confirms 60dB (1.2μm) to 80dB (3μm) shielding across 1–40GHz, with >30dB from 1MHz–1GHz.
For more information on Electroninks’ expanded portfolio and technical capabilities, visit www.electroninks.com.
Press release link: https://www.einpresswire.com/article/870498095/electroninks-leads-industry-with-total-emi-shielding-solutions-including-recon-free-process
AUSTIN, TX, UNITED STATES, September 24, 2025 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced that Kazutaka Ozawa, global technology manager at Electroninks, will present at IMAPS San Diego 2025, which will be held from September 29th through October 2nd. Mr. Ozawa will present the WPM6 – Additive Manufacturing session, “Copper Metal Organic Decomposition (MOD) Inks and Films for Semiconductor Packaging Applications” on Wednesday, October 1st at 1:30-3PM PT. The talk will focus on how copper-based conductive inks are emerging as a compelling complement to traditional copper metallization techniques in semiconductor packaging. Electroninks will be at booth #802 for the entirety of the show with company executives available to speak in more detail about the company’s copper MOD products.
“Copper conductive inks are more than a cost advantage – they represent a shift toward scalable, energy-efficient production models that enable new form factors and open the door to entirely new design paradigms,” stated Mr. Ozawa. “This transformation not only lowers barriers for advanced semiconductor packaging but also redefines how manufacturers think about next-generation electronics.”
In this presentation, Mr. Ozawa will showcase how copper-based conductive inks aim to unlock new levels of design freedom, functionality, and capital expenditure (CAPEX) efficiency through additive manufacturing, without compromising the performance or reliability required by advanced packaging applications. Traditional copper metallization methods, including deposition and electroless plating, remain industry standards but involve complex, multi-step processes that rely on vacuum chambers, high temperatures, and chemical treatments. These methods face technical, functional, and economic limitations, including restricted panel sizes, high energy consumption, material waste, and costly equipment footprints. In contrast, copper conductive inks offer a streamlined, cost-effective, and scalable solution.
“The next wave of innovation in advanced packaging will come from materials and processes that allow design freedom to address AI-related technology packaging and manufacturing,” stated Melbs LeMieux, co-founder and president of Electroninks. “By enabling unprecedented flexibility, these advances will unlock new levels of performance, efficiency, and scalability critical to meeting the demands of next-generation AI systems.”
Full release: https://www.einpresswire.com/article/851843114/electroninks-to-present-at-imaps-san-diego-2025