The CircuitWrap, CircuitShield, and CircuitSeed product lines can be used for a wide range of applications including electronic and mobile displays, semiconductor packaging, rigid PCBs, medical devices, electromagnetic shielding, and e-textiles.
Circuit WrapCircuitWrap creates metal mesh films for flexible display technologies. Produced by capillary infill of polymer structures on glass or PET films, it produces metal mesh down to an ultra-thin grid-width for use in mini and micro-LED displays. Panel-makers and original equipment manufacturers (OEMs) can then produce foldable touch screen devices with different form factors.
Circuit ShieldCircuitShield powers the technology that produces smartphones with 5G capabilities. It is the ideal cost-effective solution for EMI shielding, creating an ultra-thin uniform coating with optimal sidewall coverage and high shielding effectiveness. Simply put, CircuitShield creates EMI shielding for electronics with high throughput and lower equipment costs compared to conventional sputter coating. CircuitShield inks provide 60dB- 80dB of shielding at 1 GHz with only 1-3um of film thickness. This is less than half the thickness required from less-conductive nanoparticle-based formulations.
Circuit SeedCircuitSeed is a radically more efficient method for plating electronics – reducing a 20-step process to 8 steps and using 50 times less water. As a low-cost, flexible solution, it supports multiple chemistries that can be printed via a variety of techniques. For copper deposition, either electroless plating or electroplating can occur after the silver layer has been fully metallized.
Flexible, larger displays with faster response and less power.
Flexible, bezel-less display
Space savings and cost savings
AoP, SiP, space and weight savings
Ultimate security solution, space saving
Reflective/metal hues + antenna