August 4, 2025
Product will address the industry’s thermal management challenges on both wafer and large panels
AUSTIN, TX, UNITED STATES, August 4, 2025 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced that Merck KGaA, Darmstadt, Germany and Electroninks expanded on the companies’ strategic collaboration to now develop and introduce an innovative Backside Metallization (BSM) solution tailored for advanced semiconductor packaging. This new deal expands on the existing collaboration for Electroninks’ cost-efficient and highly effective EMI shielding solution. The new, next-generation BSM technology announced today offers a highly elegant solution to traditional sputtering and plating processes, addressing the reliability, warpage, and increasing thermal management challenges in hybrid bonding, wafer and Panel Level Packaging (PLP) metallization.
As AI chips and high-performance computing devices continue to push the limits of processing power, thermal density has risen significantly, making efficient heat dissipation more critical than ever. Reliable bonding between semiconductor packages and Thermal Interface Materials (TIM) is essential for effective heat transfer. However, conventional BSM methods—such as sputtering and plating—pose challenges related to cost, equipment requirements, scaling at larger panels, and environmental impact.
By leveraging Merck KGaA, Darmstadt, Germany’s expertise in semiconductor coating processes and Electroninks’ Metal-Organic Decomposition (MOD) Ink technology, this collaboration aims to redefine the standards for BSM in advanced semiconductor packaging.
Key Features and Benefits of the New BSM Solution:
1) High-Uniformity Backside Metallization with Reliable TIM Compatibility
– Merck KGaA, Darmstadt, Germany and Electroninks have advanced spin-coating techniques to enable uniform metal layer formation, even on large-area WLP and PLP substrates.
– The solution ensures high-reliability bonding with TIM and solder materials for optimized heat dissipation.
2) Environmental and Production Efficiency Benefits Over Traditional Methods
– Eliminates the need for large-footprint vacuum equipment, improving manufacturing scalability.
– MOD Ink significantly reduces waste liquid disposal compared to conventional wet processes, aligning with lean manufacturing goals.
3) Enhanced Thermal Management for Next-Generation Devices
– MOD Ink technology provides excellent compatibility with various interface materials, eliminating the need for multi-layer BSM structures (such as Au/Ni-alloy/Ti).
– Ensures superior thermal conductivity and reliability necessary for supporting the high-performance needs and size of AI and computing devices.
Merck KGaA, Darmstadt, Germany and Electroninks remain committed to advancing their strategy and commercial offerings in advanced packaging. With the commercialization of this pioneering BSM technology, which is now underway at customer sites globally, they aim to contribute to the advancement of high-efficiency, more sustainable semiconductor packaging solutions on silicon wafer, as well as panel-level processing where limited solutions exist today.
The companies plan to develop and market this technology together to customers in the near future, with on-site technical support in the US and APAC.
For more information on Electroninks’ expanded portfolio and technical capabilities, visit www.electroninks.com.
Read the full release here: https://www.einpresswire.com/article/836255554/merck-kgaa-darmstadt-germany-and-electroninks-partner-for-next-gen-bsm-solutions-in-advanced-semiconductor-packaging