June 9, 2026
Session will explore how silver MOD inks deliver dense conductive films, lower-temperature processing, and improved economics
AUSTIN, TX, UNITED STATES, June 9, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, today announced it will host a booth and present a session on MOD inks at TechBlick 2026, taking place June 10-11 at the Computer History Museum in Mountain View, California. At the event, Mitchell Smith, will present Silver MOD Inks: Advancing Performance Beyond Particle Pastes at 12:15PM PT on June 10th. Visit us at Booth E07, at TechBlick to connect with our team and discover how Electroninks is transforming the industry.
The presentation will examine how metal organic decomposition (MOD) inks are emerging as a next-generation alternative to conventional silver particle-based conductive pastes used across printed electronics and advanced manufacturing applications.
As manufacturers face increasing pressure to improve performance while managing material costs, silver MOD inks are gaining attention for their ability to achieve high conductivity using less silver content. This advantage becomes particularly important amid ongoing silver price volatility, which continues to impact production economics across the electronics industry.
“Traditional conductive particle pastes have played an important role in printed electronics, but the market is reaching a point where performance, scalability, and cost efficiency must evolve together,” said Mitchell Smith, Engineer, Product Manager at Electroninks. “MOD inks offer a fundamentally different chemical approach that enables denser conductive films, lower curing temperatures, and broader substrate compatibility.”
The session will explore the underlying chemical mechanisms behind silver MOD technology and how these materials differ from traditional particle-filled formulations. Attendees will gain insight into how MOD inks can:
* Form denser conductive films than conventional silver particle pastes
* Achieve high electrical performance with reduced metal loading
* Enable lower-temperature curing processes compatible with plastic substrates
* Support next-generation additive manufacturing and printed electronics applications
The presentation is designed for manufacturers, materials engineers, and product developers currently using conductive particle pastes, as well as organizations evaluating conductive inks for future product integration.
Electroninks continues to expand the use of its proprietary MOD ink platform across advanced packaging, additive electronics, EMI shielding, and printed electronic applications, helping manufacturers improve performance while simplifying manufacturing workflows.
Attendees interested in learning more about Electroninks’ conductive ink technologies are encouraged to attend the session at TechBlick 2026.
Full release: https://www.einpresswire.com/article/918448613/electroninks-to-present-at-techblick-2026-on-the-future-of-silver-mod-inks-for-advanced-electronics